CN107633777A - 一种led显示装置及其制造方法 - Google Patents

一种led显示装置及其制造方法 Download PDF

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CN107633777A
CN107633777A CN201710946272.4A CN201710946272A CN107633777A CN 107633777 A CN107633777 A CN 107633777A CN 201710946272 A CN201710946272 A CN 201710946272A CN 107633777 A CN107633777 A CN 107633777A
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led display
display devices
led
circuit board
resin layer
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成卓
朱兴中
罗立坚
白燕林
张彩肋
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CREATELED ELECTRONICS Co Ltd
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CREATELED ELECTRONICS Co Ltd
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Priority to US16/470,805 priority patent/US10790422B2/en
Priority to PCT/CN2018/074482 priority patent/WO2019071879A1/zh
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Abstract

本发明公开一种led显示装置及其制造方法，属于led显示装置的技术领域，尤其属于小间距led显示装置的技术领域。此led显示装置包括底壳、电子元器件、电路板、led灯组，且不在led灯组上方贴覆面罩，在固定于电路板上方的led灯组上方灌封固化树脂层，固化树脂层上方覆有透光膜，固化树脂层与透光膜共同成为保护层。本发明还公开了此led显示装置的制造方法。该led显示装置在调节与控制显示装置的对比度、可视角度与色彩均匀度等方面更具优势；在防潮、防风、防雨、抗腐蚀、散热与抗紫外线等方面性能明显提升，能明显降低显示装置的坏灯、撞灯率，能更有效地避免灯珠脱落以及其他损害灯珠现象的发生，且维修程序更简便。

Description

一种led显示装置及其制造方法
技术领域
本发明属于led显示装置的技术领域，尤其属于小间距led显示装置的技术领域，涉及一种led显示装置及其制造方法。
背景技术
近几年，小间距LED显示装置需求呈爆发式增长，对led显示装置的分辨率、对比度、可视角度与色彩均匀度等重要光学性能提出更高的要求，间距越小，单位面积的分辨率越大，显示图像越清晰，就需要用到更小的led灯珠。led灯珠越小，单个灯珠所能达到的稳定性越差，极易受外部环境的影响，防潮、防风、防雨、抗腐蚀、散热与抗紫外线等方面都越来越难以满足正常使用的要求；在搬运、安装与使用时灯珠失效率也随之增加。
目前，led显示行业普遍采用在灯组上方覆盖面罩的方式来保护灯珠，该面罩上有与灯珠尺寸匹配、数量相同的一系列灯孔，通过将每个灯珠卡扣在面罩的灯孔内，实现面罩在灯组表面的贴覆与固定。然而，由于面罩是通过灯孔卡扣灯珠贴覆于灯组上方，led显示装置常出现撞灯、坏灯的现象，此现象在小间距led显示装置领域尤为突出。在维修时，又需要取下卡扣在灯组上面的面罩，极易产生死灯、灯珠脱落问题，造成灯珠二次损害、甚至更大面积坏灯现象，维修起来相当麻烦，这已成为小间距led显示装置使用与维修中面临的一大难题。
发明内容
本发明要解决的技术问题是提供一种led显示装置，尤其是提供一种小间距led显示装置，该led显示装置可为led显示模组或led显示箱体或led显示屏。该显示装置在防潮、防风、防雨、抗腐蚀、散热与抗紫外线等方面性能明显提升，能明显降低显示装置的坏灯、撞灯率，在后期维修时，能够有效避免灯珠脱落以及其他损害灯珠现象的发生，且维修程序更简便；同时又能更好地控制与调节led显示装置的对比度、可视角度与色彩均匀度。
为了解决上述技术问题，本发明的led显示装置包括底壳、电子元器件、电路板、led灯组，且不在led灯组上方贴覆面罩，在固定于电路板上方的led灯组上方灌封固化树脂层，固化树脂层上方覆有透光膜，固化树脂层与透光膜共同成为保护层。所述底壳内置有容纳、固定电子元器件的腔体，还包括电路板的固定支撑结构。所述电路板为PCB电路板或为fR4电路板。
所述led灯组采用SMT贴片封装方式固定于PCB电路板正面或采用COB封装方式固定于FR4电路板正面。所述固化树脂层为密封透明材料与丙烯聚合物加热熔化所得，厚度为0.5-1mm，透光率为50-90%，硬度为邵A65度-邵A75度，附着于led灯组正面。所述透光膜厚度为0.05-0.1mm，透光率为50-55%，附着于固化树脂层上。
上述显示装置的制造方法，包括以下步骤：
一、采用SMT贴片封装方式将led灯组固定于PCB电路板正面或采用COB封装方式将led灯组固定于FR4电路板正面；
二、将密封透明材料与丙烯聚合物加热至熔化成液态，搅拌混匀后，形成液态树脂混合物；
三、将电路板放置于模具内，然后将液态胶注入模具中的电路板上；
四、将有注入液态树脂混合物的电路板，将其烘烤，形成固化胶体层；
五、取出led灯组电路板，贴覆透光膜；
六、将步骤五所述电路板与底壳、电子元器件拼接装配形成led显示模组或led显示箱体或led显示屏。
本发明提供的led显示装置因为在灯组表面覆有一层固化树脂层，使用该固化树脂层比面罩在调节与控制显示装置的对比度、可视角度与色彩均匀度等方面更具优势；在防潮、防风、防雨、抗腐蚀、散热与抗紫外线等方面性能明显提升，能明显降低显示装置的坏灯、撞灯率。基于显示装置为一块一块显示单元拼接而成，在后期维修时，可以通过替换同尺寸显示单元的方式进行维修，相比较贴覆面罩的led显示装置，本led显示装置能更有效地避免灯珠脱落以及其他损害灯珠现象的发生，且维修程序更简便。
附图说明
图1是本发明的led显示装置的分解图，
图2是本发明的led显示装置的正视图，
图3是本发明的led显示装置的立体图。
附图标记:
1是底壳、2是电路板、3是led灯组、4是固化树脂层、5是透光膜。
具体实施方式
如图3所示，本发明的led显示装置包括底壳1、电子元器件、电路板2、led灯组3、固化树脂层4。传统的led显示装置都会在led灯组上方覆盖面罩，这样对led灯组3表面有一定的保护作用，但本发明的led显示装置突破传统思维，在led灯组3表面不覆盖面罩。将led灯组3固定在电路板2上方，在led灯组3上方灌封固化树脂层4，固化树脂层4上方覆盖透光膜5。
实施例
如图3所示，led显示装置包括底壳1、电子元器件、电路板2、led灯组3、固化树脂层4和透光膜5。电子元器件固定止于底壳1内腔，该电路板2采用PCB电路板或FPC电路板，将led灯组3采用SMT贴片封装方式固定于PCB电路板正面，将封装固定有led灯组的电路板水平置于与电路板大小相对应的模具中，将密封透明材料与丙烯聚合物加热高温至熔化成液态，搅拌混匀后，得到液态树脂混合物；液态树脂混合物注入到模具内，胶层厚度为1mm，再晾干、烘烤得到附着有固化树脂层4和固定有led灯组的电路板，该固化树脂层的透光率为70%，硬度为邵A70度，将透光膜5附着于固化树脂层4上，该透光膜厚度为0.1mm，透光率为50%。将四块上述封装好灯组，且附着好固化树脂层4与透光膜5的电路板2拼接成led显示模组主体后，通过底壳将其固定支撑好，形成led显示模组。将四块上述显示模组与底壳安装成一体可形成led显示箱，根据需求尺寸可拼接得到成体的led显示屏。
上述显示装置的制造方法，包括以下步骤：
一、采用SMT贴片封装方式将led灯组固定于PCB电路板正面或采用COB封装方式将led灯组固定于FR4电路板正面；
二、将密封透明材料与丙烯聚合物加热至熔化成液态，搅拌混匀后，进行抽真空脱泡处理，形成液态树脂混合物；
三、将电路板水平放置于与电路板大小相匹配的模具内，然后将液态树脂混合物注入模具中的电路板上，通过模具调控树脂层层厚度；
四、将装有注入液态树脂混合物的电路板的模具移至晾干架一定时间，再将其烘烤固化，形成固化树脂层；
五、取出覆有固化树脂层的led灯组电路板，贴覆透光膜；
六、将四块相同的上述电路板与底壳、电子元器件拼接成体，形成led显示模组；
七、进行模组测试，当坏灯率与撞灯率，防潮、防风、防雨、抗腐蚀与抗紫外线以及对比度、亮度、与色彩均匀度等性能均达到生产要求后，将四块相同led显示模组装配成led显示箱体；
八、根据需求尺寸要求组装得到成体的led显示屏。

Claims (8)

1.一种led显示装置包括底壳(1)、电子元器件、电路板(2)、led灯组(3)，其特征在于固定在电路板上方的led灯组上方灌封有固化树脂层(4)，所述底壳(1)内置有容纳、固定电子元器件的腔体，还包括电路板的固定支撑结构。
2.根据权利要求1所述的led显示装置，所述电路板(2)为PCB电路板或为FR4电路板。
3.根据权利要求2所述的led显示装置，所述led灯组(3)采用SMT贴片封装方式固定于PCB电路板正面或采用COB封装方式固定于FR4电路板正面。
4.根据权利要求3所述的led显示装置，所述固化树脂层(4)为密封材料与丙烯聚合物加热熔化所得。
5.根据权利要求4所述的led显示装置，所述固化树脂层(4)厚度为0.5-1mm，透光率为50-90%，硬度为邵A65度-邵A75度。
6.根据权利要求5所述的led显示装置，所述固化树脂层(4)上方覆有透光膜(5)。
7.根据权利要求6所述的led显示装置，所述透光膜(5)，厚度为0.05-0.1mm。
8.一种权利要求7所述的led显示装置的制造方法，包括以下步骤：
一、采用SMT贴片封装方式将led灯组(3)固定于PCB电路板正面或采用COB封装方式将led灯组(3)固定于FR4电路板正面；
二、将密封透明材料与丙烯聚合物加热至熔化成液态，搅拌混匀后，形成液态树脂混合物；
三、将电路板水平放置模具内，然后将液态树脂混合物注入模具；
四、将装有注入树脂混合物的电路板(2)，将其高温烘烤固化，形成固化树脂层(4)；
五、取出覆有固化树脂层(4)和led灯组(3)电路板(2)，贴覆透光膜(5)；
六、将步骤五所述覆有固化树脂层(4)和led灯组(3)的电路板(2)与底壳(1)、电子元器件拼接装配形成led显示模组或led显示箱体或led显示屏。
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