WO2019071879A1 - Led 显示装置及其制造方法 - Google Patents

Led 显示装置及其制造方法 Download PDF

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Publication number
WO2019071879A1
WO2019071879A1 PCT/CN2018/074482 CN2018074482W WO2019071879A1 WO 2019071879 A1 WO2019071879 A1 WO 2019071879A1 CN 2018074482 W CN2018074482 W CN 2018074482W WO 2019071879 A1 WO2019071879 A1 WO 2019071879A1
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WIPO (PCT)
Prior art keywords
circuit board
led display
display device
resin layer
led
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PCT/CN2018/074482
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English (en)
French (fr)
Inventor
成卓
朱兴中
罗立坚
白燕林
张彩肋
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深圳市创显光电有限公司
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Priority to US16/470,805 priority Critical patent/US10790422B2/en
Publication of WO2019071879A1 publication Critical patent/WO2019071879A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components

Definitions

  • the present invention belongs to the technical field of LED display devices, and particularly relates to the technical field of small-pitch LED display devices, and relates to an LED display device and a method of fabricating the same.
  • the LED display industry generally adopts a method of covering a mask above the lamp group to protect the lamp bead.
  • the mask has a series of lamp holes matching the size of the lamp bead and the same number, and the lamp is buckled on the mask by each lamp bead. In the hole, the cover is fixed and fixed on the surface of the lamp set.
  • the LED display device since the mask is attached to the lamp group through the lamp hole buckle lamp bead, the LED display device often has a phenomenon of hitting the lamp and the bad lamp. This phenomenon is particularly prominent in the field of small-pitch LED display devices.
  • the technical problem to be solved by the present solution is to provide an LED display device, in particular to provide a small-pitch LED display device, which can be an LED display module or an LED display box or an LED display screen.
  • the display device has obvious performance improvement in moisture proof, windproof, rainproof, anti-corrosion, heat dissipation and anti-ultraviolet radiation, can significantly reduce the bad light and the light strike rate of the display device, and can effectively prevent the lamp beads from falling off and other during the later maintenance. Damage to the lamp bead phenomenon, and the maintenance procedure is easier; at the same time, it can better control and adjust the contrast, viewing angle and color uniformity of the LED display device.
  • the LED display device of the solution comprises a bottom case, an electronic component, a circuit board, an LED lamp set, and the mask is not attached above the LED lamp group, and is fixed on the circuit board.
  • the upper layer of the LED lamp group is filled with a curing resin layer, and the cured resin layer is covered with a light-transmissive film, and the cured resin layer and the light-transmissive film together form a protective layer.
  • a cavity for accommodating and fixing electronic components is disposed in the bottom case, and a fixed support structure for fixedly supporting the circuit board is further included.
  • circuit board is a printed circuit board or a fiberglass epoxy copper clad laminate.
  • the LED lamp group is fixed on the front surface of the printed circuit board by using an SMT chip package or is fixed on the front surface of the glass fiber epoxy resin copper clad plate by using a COB package.
  • the cured resin layer is obtained by heating and melting a sealed transparent material and a propylene polymer, and has a thickness of 0.5 to 1 mm, a light transmittance of 50 to 90%, and a hardness of Shao A65 to Shao A75, and is attached to the LED lamp group. positive.
  • the light transmissive film has a thickness of 0.05 to 0.1 mm and a light transmittance of 50 to 55% and is attached to the cured resin layer.
  • the solution also provides a method of manufacturing a display device, comprising the following steps:
  • S1 fixing the LED lamp group to the front surface of the printed circuit board by using an SMT chip package to form a circuit board, or fixing the LED lamp group to the front surface of the glass fiber epoxy resin copper clad plate by using a COB package to form the circuit board;
  • the LED display device provided by the present scheme has a layer of a cured resin layer on the surface of the lamp group, and the cured resin layer is more advantageous than the mask in adjusting and controlling the contrast ratio, the viewing angle and the color uniformity of the display device;
  • the performance of windproof, rainproof, anti-corrosion, heat dissipation and anti-ultraviolet radiation is obviously improved, which can significantly reduce the bad light and the light strike rate of the display device.
  • the display device is formed by splicing a plurality of single display units, and can be repaired by replacing the same size display unit during the later maintenance. Compared with the LED display device of the mask, the LED display device can be more effectively avoided. Lamp beading and other damage to the lamp bead occur, and the maintenance procedure is simpler.
  • 1 is an exploded view of the LED display device of the present embodiment
  • Figure 2 is a front elevational view of the LED display device of the present embodiment
  • FIG. 3 is a perspective view of the LED display device of the present embodiment.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or integrated; can be mechanical connection, or can be electrical connection; can be directly connected, or can be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction of two elements.
  • installation can be understood on a case-by-case basis.
  • the LED display device of the present embodiment includes a bottom case 1, an electronic component, a circuit board 2, an LED lamp set 3, and a cured resin layer 4.
  • the conventional LED display device covers the mask above the LED lamp group 3, so that the surface of the LED lamp group 3 has a certain protection effect, but the LED display device of the present scheme breaks through the conventional thinking, and the surface of the LED lamp group 3 does not cover the mask.
  • the LED lamp group 3 is fixed above the circuit board 2, and the cured resin layer 4 is potted over the LED lamp group 3, and the transparent resin film 4 is covered over the cured resin layer 4.
  • the LED display device includes a bottom case 1, an electronic component, a circuit board 2, an LED lamp group 3, a cured resin layer 4, and a light transmissive film 5.
  • the electronic component is fixed in the inner cavity of the bottom case 1.
  • the circuit board 2 is printed on a printed circuit board or a glass fiber epoxy resin copper clad plate, and the LED lamp set 3 is fixed on the front side of the printed circuit board by using an SMT chip package.
  • the circuit board 2 in which the LED lamp group 3 is packaged is horizontally placed in a mold corresponding to the size of the circuit board 2, and the sealed transparent material and the propylene polymer are heated to a high temperature to be melted into a liquid state, and stirred and mixed to obtain a liquid resin mixture;
  • the liquid resin mixture is injected into the mold, the thickness of the adhesive layer is 1 mm, and then dried and baked to obtain the circuit board 2 to which the cured resin layer 4 and the LED lamp group 3 are attached, and the light transmittance of the cured resin layer 4 is 70.
  • the hardness is a Shore hardness value of 70
  • the light-transmitting film 5 is adhered to the cured resin layer 4, and the light-transmissive film 5 has a thickness of 0.1 mm and a light transmittance of 50%.
  • the manufacturing method of the above display device comprises the following steps:
  • S7 Perform module test. When the bad lamp rate and the light strike rate, moisture, wind, rain, corrosion and UV resistance, and contrast, brightness, and color uniformity meet the production requirements, four identical LEDs will be used.
  • the display module is assembled into an LED display box;
  • the LED display device obtained by the LED display device manufacturing method provided in this embodiment is provided with a layer of the cured resin layer 4 and the light-transmissive film 5 on the surface of the lamp group, and the cured resin layer 4 has a certain hardness and is protected by the transparent film 5.
  • the layer can obviously improve the performance of the LED display device in moisture proof, windproof, rainproof, anti-corrosion and anti-ultraviolet light, effectively reduce the bad light and the light strike rate; meanwhile, the LED display device can be illuminated from the point through the cured resin layer 4. It becomes a surface illumination, and its contrast, viewing angle and color uniformity can be improved. From the point of heat dissipation of a single LED lamp bead to the heat dissipation of the LED lamp group 3, it can also improve the heat dissipation capability, thereby prolonging the service life of the lamp bead. .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED显示装置及其制造方法，LED显示装置包括底壳(1)、电子元器件、电路板(2)、LED灯组(3)，且不在LED灯组(3)上方贴覆面罩，在固定于电路板(2)上方的LED灯组(3)上方灌封固化树脂层(4)，固化树脂层(4)上方覆有透光膜(5)，固化树脂层(4)与透光膜(5)共同成为保护层。

Description

LED显示装置及其制造方法 技术领域
本方案属于LED显示装置的技术领域，尤其属于小间距LED显示装置的技术领域，涉及一种LED显示装置及其制造方法。
 背景技术
近几年，小间距LED显示装置需求呈爆发式增长，对LED显示装置的分辨率、对比度、可视角度与色彩均匀度等重要光学性能提出更高的要求，间距越小，单位面积的分辨率越大，显示图像越清晰，就需要用到更小的LED灯珠。LED灯珠越小，单个灯珠所能达到的稳定性越差，极易受外部环境的影响，防潮、防风、防雨、抗腐蚀、散热与抗紫外线等方面都越来越难以满足正常使用的要求；在搬运、安装与使用时灯珠失效率也随之增加。
目前，LED显示行业普遍采用在灯组上方覆盖面罩的方式来保护灯珠，该面罩上有与灯珠尺寸匹配、数量相同的一系列灯孔，通过将每个灯珠卡扣在面罩的灯孔内，实现面罩在灯组表面的贴覆与固定。然而，由于面罩是通过灯孔卡扣灯珠贴覆于灯组上方，LED显示装置常出现撞灯、坏灯的现象，此现象在小间距LED显示装置领域尤为突出。在维修时，又需要取下卡扣在灯组上面的面罩，极易产生死灯、灯珠脱落问题，造成灯珠二次损害、甚至更大面积坏灯现象，维修起来相当麻烦，这已成为小间距LED显示装置使用与维修中面临的一大难题。
 技术问题
本方案要解决的技术问题是提供一种LED显示装置，尤其是提供一种小间距LED显示装置，该LED显示装置可为LED显示模组或LED显示箱体或LED显示屏。该显示装置在防潮、防风、防雨、抗腐蚀、散热与抗紫外线等方面性能明显提升，能明显降低显示装置的坏灯、撞灯率，在后期维修时，能够有效避免灯珠脱落以及其他损害灯珠现象的发生，且维修程序更简便；同时又能更好地控制与调节LED显示装置的对比度、可视角度与色彩均匀度。
 技术解决方案
为了解决上述技术问题，本方案采用的技术方案是：本方案的LED显示装置包括底壳、电子元器件、电路板、LED灯组，且不在LED灯组上方贴覆面罩，在固定于电路板上方的LED灯组上方灌封固化树脂层，固化树脂层上方覆有透光膜，固化树脂层与透光膜共同成为保护层。
进一步地，所述底壳内设有用于容纳、固定电子元器件的腔体，还包括用于固定支撑所述电路板的固定支撑结构。
进一步地，所述电路板为印制电路板或为玻璃纤维环氧树脂覆铜板。
进一步地，所述LED灯组采用SMT贴片封装方式固定于印制电路板正面或采用COB封装方式固定于玻璃纤维环氧树脂覆铜板正面。
进一步地，所述固化树脂层为密封透明材料与丙烯聚合物加热熔化所得，厚度为0.5~1mm，透光率为50~90%，硬度为邵A65~邵A75，附着于所述LED灯组正面。
进一步地，所述透光膜厚度为0.05-0.1mm，透光率为50-55%，附着于所述固化树脂层上。
本方案还提供一种显示装置的制造方法，包括以下步骤：
S1：采用SMT贴片封装方式将LED灯组固定于印制电路板正面以形成电路板，或采用COB封装方式将LED灯组固定于玻璃纤维环氧树脂覆铜板正面以形成所述电路板；
S2：将密封透明材料与丙烯聚合物加热至熔化成液态，搅拌混匀后，形成液态树脂混合物；
S3：将所述电路板放置于模具内，然后将所述液态树脂混合物注入模具中的电路板上；
S4：将有注入所述液态树脂混合物的所述电路板，将其烘烤固化，形成固化胶体层；
S5：取出LED灯组电路板，贴覆透光膜；
S6：将步骤S5所述电路板与底壳、电子元器件拼接装配形成LED显示模组或LED显示箱体或LED显示屏。
 有益效果
本方案提供的LED显示装置因为在灯组表面覆有一层固化树脂层，使用该固化树脂层比面罩在调节与控制显示装置的对比度、可视角度与色彩均匀度等方面更具优势；在防潮、防风、防雨、抗腐蚀、散热与抗紫外线等方面性能明显提升，能明显降低显示装置的坏灯、撞灯率。基于显示装置为多个单块显示单元拼接而成，在后期维修时，可以通过替换同尺寸显示单元的方式进行维修，相比较贴覆面罩的LED显示装置，本LED显示装置能更有效地避免灯珠脱落以及其他损害灯珠现象的发生，且维修程序更简便。
 附图说明
为了更清楚地说明本方案实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本方案的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本方案的LED显示装置的分解图；
图2是本方案的LED显示装置的正视图；
图3是本方案的LED显示装置的立体图。
其中，图中各附图标记：
1—底壳；           2—电路板；     3—LED灯组；
4—固化树脂层；    5—透光膜。
 本发明的实施方式
下面详细描述本方案的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图1~3描述的实施例是示例性的，旨在用于解释本方案，而不能理解为对本方案的限制。
在本方案的描述中，需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本方案和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本方案的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本方案的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本方案中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本方案中的具体含义。
如图1~3所示，本方案的LED显示装置包括底壳1、电子元器件、电路板2、LED灯组3、固化树脂层4。传统的LED显示装置都会在LED灯组3上方覆盖面罩，这样对LED灯组3表面有一定的保护作用，但本方案的LED显示装置突破传统思维，在LED灯组3表面不覆盖面罩。将LED灯组3固定在电路板2上方，在LED灯组3上方灌封固化树脂层4，固化树脂层4上方覆盖透光膜5。
如图3所示，LED显示装置包括底壳1、电子元器件、电路板2、LED灯组3、固化树脂层4和透光膜5。电子元器件固定止于底壳1内腔，该电路板2采用印制电路板或玻璃纤维环氧树脂覆铜板，将LED灯组3采用SMT贴片封装方式固定于印制电路板正面，将封装固定有LED灯组3的电路板2水平置于与电路板2大小相对应的模具中，将密封透明材料与丙烯聚合物加热高温至熔化成液态，搅拌混匀后，得到液态树脂混合物；液态树脂混合物注入到模具内，胶层厚度为1mm，再晾干、烘烤得到附着有固化树脂层4和固定有LED灯组3的电路板2，该固化树脂层4的透光率为70%，硬度为邵氏硬度值70，将透光膜5附着于固化树脂层4上，该透光膜5厚度为0.1mm，透光率为50%。将四块上述封装好灯组且附着好固化树脂层4与透光膜5的电路板2拼接成LED显示模组主体后，通过底壳1将其固定支撑好，形成LED显示模组。将四块上述显示模组与底壳1安装成一体可形成LED显示箱，根据需求尺寸可拼接得到成体的LED显示屏。
上述显示装置的制造方法，包括以下步骤：
S1：采用SMT贴片封装方式将LED灯组3固定于印制电路板2正面或采用COB封装方式将LED灯组3固定于玻璃纤维环氧树脂覆铜板正面；
S2：将密封透明材料与丙烯聚合物加热至熔化成液态，搅拌混匀后，进行抽真空脱泡处理，形成液态树脂混合物；
S3：将电路板2水平放置于与电路板2大小相匹配的模具内，然后将液态树脂混合物注入模具中的电路板2上，通过模具调控树脂层层厚度；
S4：将装有注入液态树脂混合物的电路板2的模具移至晾干架一定时间，再将其烘烤固化，形成固化树脂层4；
S5：取出覆有固化树脂层4的LED灯组电路板2，贴覆透光膜5；
S6：将四块相同的上述电路板2、底壳1以及电子元器件拼接成体，形成LED显示模组；
S7：进行模组测试，当坏灯率与撞灯率，防潮、防风、防雨、抗腐蚀与抗紫外线以及对比度、亮度、与色彩均匀度等性能均达到生产要求后，将四块相同LED显示模组装配成LED显示箱体；
S8：根据需求尺寸要求组装得到成体的LED显示屏。
本实施例提供的LED显示装置制造方法所得的LED显示装置因为在灯组表面覆有一层固化树脂层4和透光膜5，固化树脂层4具备一定的硬度，与透光膜5组成的保护层可以明显提升LED显示装置的防潮、防风、防雨、抗腐蚀与抗紫外线等方面性能，有效地降低坏灯、撞灯率；同时，通过该固化树脂层4可使LED显示装置从点发光变为面发光，其对比度、可视角度与色彩均匀度均能得到提升，从单个LED灯珠的点散热变为LED灯组3面散热，也可提升散热能力，进而延长灯珠的使用寿命。
以上所述仅为本方案的较佳实施例而已，并不用以限制本方案，凡在本方案的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本方案的保护范围之内。

Claims (8)

  1. 一种LED显示装置包括底壳、电子元器件、电路板、LED灯组，其特征在于：所述灯组固定于所述电路板的上方，且所述灯组的上方灌封有固化树脂层，所述底壳内开设有用于容纳并固定所述电子元器件的腔体，所述底壳内还包括用于固定支撑所述电路板的固定支撑结构。
  2. 根据权利要求1所述的LED显示装置，其特征在于：所述电路板为印制电路板或为玻璃纤维环氧树脂覆铜板。
  3. 根据权利要求2所述的LED显示装置，其特征在于：所述LED灯组采用SMT贴片封装方式固定于印制电路板正面或采用COB封装方式固定于玻璃纤维环氧树脂覆铜板正面。
  4. 根据权利要求3所述的LED显示装置，其特征在于：所述固化树脂层的材料是密封材料与丙烯聚合物加热熔化所得的树脂混合物。
  5. 根据权利要求4所述的LED显示装置，其特征在于：所述固化树脂层厚度为0.5mm~1mm，透光率为50%~90%，邵氏硬度值为65~75。
  6. 根据权利要求5所述的LED显示装置，其特征在于：所述固化树脂层上方覆有透光膜。
  7. 根据权利要求6所述的LED显示装置，其特征在于：所述透光膜的厚度为0.05 mm~0.1mm。
  8. 一种权利要求7所述的LED显示装置的制造方法，其特征在于：包括以下步骤：
    S1：采用SMT贴片封装方式将LED灯组固定于印制电路板正面以形成电路板，或采用COB封装方式将所述LED灯组固定于玻璃纤维环氧树脂覆铜板正面以形成所述电路板；
    S2：加热密封透明材料与丙烯聚合物至熔融状态，并搅拌混匀，以形成液态树脂混合物；
    S3：将所述电路板水平放置模具内，然后将所述液态树脂混合物注入模具以形成预制树脂层；
    S4：将所述预制树脂层高温烘烤固化，以形成固化树脂层；
    S5：取出覆有所述固化树脂层和所述LED灯组的所述电路板，贴覆透光膜；
    S6：将步骤S5中覆有所述固化树脂层和所述LED灯组的所述电路板与底壳、电子元器件拼接装配形成LED显示模组或LED显示箱体或LED显示屏。
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