CN102844607A - 由具有led的可缩放的陶瓷载体构成的阵列 - Google Patents
由具有led的可缩放的陶瓷载体构成的阵列 Download PDFInfo
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Abstract
本发明描述陶瓷二极管载体(10),其包括与散热的陶瓷冷却元件(7)一体连接的陶瓷载体本体(2),其中在载体本体(2)的表面(3)上设置烧结的金属化区域(41)作为导体线路,并且LED(13)能固定在二极管载体(10)上,所述LED的电接线端子可与导体线路电连接。为了由陶瓷二极管载体(10)制造发光本体,建议将至少两个相同的陶瓷二极管载体(10)连接为阵列。
Description
本发明涉及一种根据权利要求1的前序部分的陶瓷二极管载体。
根据所需的热导性能,用于功率LED的载体可由陶瓷材料如AIN或AI2O3构成。替代地,可使用由金属材料如AI构成的金属载体,但是由于其导电性,所述金属载体必须在LED组装之前被非金属地胶合,或者必须将LED安装在单个的非传导结构(载体板)上,这样即便金属冷却体的导热良好,但由于粘合剂与合成材料的导热系数较差(通常在3W/mK以下),也会使所需的安装面积(以及冷却面积)增大或使功率LED的封装密度降低。
由WO 2007/107601 A2已知陶瓷冷却体1(见图2a至2d),也称作热沉。该冷却体1由与散热的冷却元件7(也称作鳍)一体提供的陶瓷载体本体2构成,其中在载体本体2的表面3上施加烧结的金属化区域41,使得冷却体1可作为电路板使用。
金属化区域41优选由钨构成,并经过化学镀镍。图2a以三维视图示出具有冷却元件7的载体本体2,并且图2b从下方示出了对冷却元件7的俯视图。图2c示出冷却体1的纵剖面图,并且2d示出冷却体1的表面3。
本发明所基于的任务是,由根据权利要求1的前序部分的二极管载体制造发光体。
根据本发明,该任务通过如下方式解决,即将至少两个相同的陶瓷二极管载体连接为阵列。由此,仅需制造相同的陶瓷二极管载体,将这些相同的陶瓷二极管载体彼此物理地和电地连接为阵列以制造发光体。应将阵列理解为相同的元件(即二极管载体)以确定方式的设置。
在优选实施方式中,二极管载体被置入优选由金属或合成材料制成的框架中。该框架用作为二极管载体的接纳装置。该框架可以实施为平面的,但是也可以实施为三维的。
二极管载体优选具有作为电和/或机械连接元件的插头和/或插槽,利用所述插头和/或插槽相邻的二极管载体直接或间接地彼此连接。在这种情况下,如果插头和插槽承担了框架作用,则可以取消框架。但是,插头和/或插槽也可以彼此仅用于二极管载体的电相连。为了电连接,插头和/或插槽的极点必须与导体线路或金属化区域连接。
在优选实施方式中,插头为尤其是根据标准GU 5.3的销钉,并且插槽与该销钉相匹配。在该实施方式中,销钉和插槽也承担机械连接以及电连接。
在替代的优选实施方式中,二极管载体通过单独的连接元件彼此连接。该连接元件也可以是电和/或机械连接元件,或者满足这两种功能(机械和电连接)。
在优选实施方式中,至少在二极管载体的边缘处设置没有金属化区域和LED的带区。该带区构成了用于在框架或导轨处固定的陶瓷嵌榫。于是,至少两个导轨构成框架。
带区优选具有至少一个空隙以用于与螺钉固定。该空隙优选构造为半圆形的,并且关于带区的长度设置在中心。在二极管载体的相对侧上同样设置具有凹槽的带区,其中空隙位于相同的位置处。
在优选实施方式中,框架还同时用作LED的馈电装置。为此,框架必须由导电材料、例如由金属制成。
在优选实施方式中,框架构造为柔性的,由此易于实现二极管载体的凸状或凹状的设置。因此,例如可以将二极管载体彼此安装为凹状的,从而使LED的光在约100cm的距离内聚焦。阵列为了平面发光是平坦的,并且为了点状发光在LED的侧上弯曲为凹状的。
二极管载体优选可替换地置入、插入、挂入或夹入到框架中,因此可以容易地更换缺损的二极管载体并且易于制造阵列。
在优选实施方式中,在二极管载体上设置彼此平行的导体线路。每两个相邻的导体线路构成LED的馈电装置。
根据本发明,用至少两个相同的陶瓷二极管载体来描述阵列,其中LED被固定在二极管载体上,所述LED的电接线端子与二极管载体的导体线路电连接。
陶瓷冷却体——例如由AIN(具有180W/mK)作为具有陶瓷鳍的基板单片地构造在背面上——由于LED可借助良好导热的焊接连接(例如具有约60-80W/mK的AuSn)直接安装到金属化的冷却体上而是如此高效的,使得也可以将多个冷却体直接毗邻地在大小和数量上可缩放地设置为阵列。该阵列通过例如由金属制成的框架利用用于各个冷却体的夹子结合在一起。在阵列中可以以不同的角度固定二极管载体,从而形成聚焦的或散射的阵列,或可调整的阵列。二极管的光色可以是不同的。连同合适的电路,二极管可以在特定的时间间歇性接通。冷却体可以是对流冷却的或者流体冷却的。
下面根据附图进一步阐述本发明。
图2a至2d示出了如上所述的根据WO 2007/107601 A2的陶瓷冷却体1。
图1示出了9个分别具有4*4cm电路面积的相同的正方形的陶瓷二极管载体10,每个二极管载体10分别装配6个具有相同颜色每个为1瓦的LED 13,这些二极管载体10连接成阵列。各个二极管载体10被置入或挂入金属框架11中(仅示意性示出),该金属框架同时也用作LED 13的馈电装置(所述馈电装置在该图中未示出)。与中间的二极管载体10相反,金属框架11或阵列在四个角12处略微抬起,使得二极管载体10彼此安装为凸状的(在图中无法看出)。因此,这种凸状设置将该阵列的LED的光在距离二极管载体10约100cm的距离内聚焦。
由二极管载体10构成的阵列用于平面发光,但是也可如所述的那样用于点状发光。为此,以不同的角度将二极管载体10这样固定在金属框架11中,使得得出聚焦的光。
通过翻起角12,形成例如具有光焦点的抛物线状的设置。阵列也可以是平坦的以用于平面发光或者被弯曲用于点状发光。
二极管载体10由与散热的冷却元件7(也称作鳍)一体提供的陶瓷载体本体2构成,其中在载体本体2的表面3上施加烧结的金属化区域(见图2),使得载体本体2用作为电路板。
金属化区域优选由钨构成,并且经过化学镀镍。
所述阵列的一种应用优选是在外科手术室中用于外科中的使用。另外的优选应用可能是:
-街道照明
-室内/室外物体照明
-泛射光
图3a、3b以俯视图3a和以剖面图3b示出根据本发明的陶瓷的二极管载体10,该二极管载体10由冷却体1或陶瓷的载体本体2构成,该冷却体1或陶瓷的载体本体2与散热的陶瓷冷却元件7、这里为鳍一体提供。冷却元件7如图2中所示那样设置在载体本体2的一侧上,并且以梳状与载体本体2呈直角。在载体本体2的表面3上施加烧结的金属化区域41作为导体线路42,使得二极管载体10具有带有极好导热性的电路板的功能。在该实施方式中,5个LED 13被固定在二极管载体10上,这些LED与其电导线被焊到金属化区域41上。为了将两个或更多个二极管载体10导电和/或机械连接为阵列,所述二极管载体10具有插头和/或插槽作为连接元件,利用这些连接元件二极管载体直接或间接地彼此连接。
在所示实施方式中,插头为尤其是根据标准GU 5.3的销钉6,并且插槽与该销钉相匹配。图3示出了仅具有插头的实施方式,所述插头在此由销钉6构成。这些销钉6——每个插头设有两个销钉6——设置在二极管载体10的边缘区域处,其中插头6位于二极管载体10的相对侧处。为了连接两个二极管载体10,在此使用单独的连接元件8。在这里示出的变型方案中,该连接元件8是具有贯穿孔14的矩形或正方形的板。二极管载体10处的销钉6以建立电接触的方式插入到所述孔14中。每个连接元件8具有4个孔14。连接元件8上的每两个孔14彼此电相连。
为了将二极管载体10固定在框架中,所述二极管载体10至少在边缘处具有没有金属化区域41并且没有LED 13的带区4。该带区4由此构成了用于固定在框架或导轨中的陶瓷嵌榫。于是至少两个导轨构成框架。
带区4具有至少一个空隙5以用于与优选螺钉固定。
Claims (13)
1.一种陶瓷二极管载体(10),包括与散热的陶瓷冷却元件(7)一体连接的陶瓷载体本体(2),其中在载体本体(2)的表面上设置烧结的金属化区域(41)作为导体线路,并且LED(13)能固定在二极管载体(10)上,LED的电接线端子能与导体线路电连接,其特征在于,将至少两个相同的陶瓷二极管载体(10)连接为阵列。
2.根据权利要求1所述的二极管载体,其特征在于,所述二极管载体(10)被置于优选由金属或合成材料制成的框架(11)中。
3.根据权利要求1所述的二极管载体,其特征在于,所述二极管载体具有插头和/或插槽作为电和/或机械连接元件,利用所述插头和/或插槽相邻的二极管载体(10)直接或间接地彼此连接。
4.根据权利要求3所述的二极管载体,其特征在于,所述插头为尤其是根据标准GU 5.3的销钉(6),并且所述插槽与该销钉(6)相匹配。
5.根据权利要求1至4之一所述的二极管载体,其特征在于,所述二极管载体(10)通过单独的连接元件(8)彼此连接。
6.根据权利要求1至5之一所述的二极管载体,其特征在于,至少在所述二极管载体(10)的边缘处设置没有金属化区域(41)和LED(13)的带区(4)。
7.根据权利要求6所述的二极管载体,其特征在于,所述带区(4)具有至少一个空隙(5)以用于固定。
8.根据上述权利要求之一所述的二极管载体,其特征在于,所述框架(11)同时也用作LED(13)的馈电装置。
9.根据上述权利要求之一所述的二极管载体,其特征在于,所述框架(11)被构造为柔性的。
10.根据上述权利要求之一所述的二极管载体,其特征在于,所述阵列为了平面发光是平坦的并且为了点状发光在LED(13)的侧上弯曲为凹状的。
11.根据上述权利要求之一所述的二极管载体,其特征在于,所述二极管载体(10)优选以可替换的方式置入、插入、挂入或夹入到框架(11)中。
12.根据上述权利要求之一所述的二极管载体,其特征在于,在二极管载体(10)上设置彼此平行的导体线路(42)。
13.一种具有至少两个根据权利要求1至12之一所述的陶瓷二极管载体(10)的阵列,其特征在于,LED(13)固定在二极管载体(10)上,所述LED的电接线端子与二极管载体(10)的导体线路(42)电连接。
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DE102009054974 | 2009-12-18 | ||
PCT/EP2010/066211 WO2011051310A1 (de) | 2009-10-27 | 2010-10-27 | Array aus skalierbaren keramischen diodenträgern mit led´s |
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EP2691688B1 (de) * | 2011-03-29 | 2015-08-19 | CeramTec GmbH | Spritzguss-lampenkörper mit keramischen kühlern und leds |
GB2497283A (en) * | 2011-12-02 | 2013-06-12 | Tzu-Yu Liao | Method for assembling LEDs to a ceramic heat conductive member |
TWM441213U (en) * | 2012-04-12 | 2012-11-11 | Jin-Huan Ni | The porous heat dissipation module |
DE102012214887A1 (de) * | 2012-08-22 | 2014-02-27 | Ridi - Leuchten Gmbh | LED-Flächenstrahler |
CN103900002B (zh) * | 2014-03-28 | 2016-04-27 | 上海大学 | 组合式led路灯 |
CN108432351B (zh) * | 2015-12-08 | 2021-03-19 | 飞利浦照明控股有限公司 | 组件和包括组件的照明设备 |
RU174281U1 (ru) * | 2016-11-22 | 2017-10-09 | Егор Евгеньевич Нилов | Осветительное устройство |
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DE102010042979A1 (de) | 2011-04-28 |
TW201122348A (en) | 2011-07-01 |
TWI525287B (zh) | 2016-03-11 |
RU2012121579A (ru) | 2013-12-10 |
MY160695A (en) | 2017-03-15 |
CN102844607B (zh) | 2016-04-13 |
JP2013508929A (ja) | 2013-03-07 |
KR20120112428A (ko) | 2012-10-11 |
RU2563245C2 (ru) | 2015-09-20 |
EP2494263A1 (de) | 2012-09-05 |
US8545054B2 (en) | 2013-10-01 |
JP5758907B2 (ja) | 2015-08-05 |
US20120223344A1 (en) | 2012-09-06 |
EP2494263B1 (de) | 2020-03-11 |
WO2011051310A1 (de) | 2011-05-05 |
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