BR112012010068A2 - rede de suportes de diodo de cerâmica escaláveis com leds - Google Patents
rede de suportes de diodo de cerâmica escaláveis com ledsInfo
- Publication number
- BR112012010068A2 BR112012010068A2 BR112012010068A BR112012010068A BR112012010068A2 BR 112012010068 A2 BR112012010068 A2 BR 112012010068A2 BR 112012010068 A BR112012010068 A BR 112012010068A BR 112012010068 A BR112012010068 A BR 112012010068A BR 112012010068 A2 BR112012010068 A2 BR 112012010068A2
- Authority
- BR
- Brazil
- Prior art keywords
- ceramic
- leds
- network
- brackets
- diode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/20—Lighting for medical use
- F21W2131/205—Lighting for medical use for operating theatres
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
rede de suportes de diodo de cerâmica escaláveis com leds. a presente invenção refere-se a suportes de diodo de cerâmica (10) que compreendem um corpo de suporte de cerâmica (2) o qual está conectado a elementos de resfriamento de cerâmica a dissipação de calor (7) em uma peça con este, em que regiões de metalização sinterizadas (41) estão dispostas como condutores impressos sobre a superfície (3) do corpo de suporte (2) e podem estar presos sobre o suporte de diodo (10) leds (13) cujos terminais elétricos podem estar eletricamente conectados nos condutores impressos. de modo a produzir corpos de iluminação de suportes de diodo de cerâmica (10) está proposto que pelo menos dois suportes de diodo de cerâmica (10) idênticos estejam conectados para formar uma rede.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009046049 | 2009-10-27 | ||
DE102009054974 | 2009-12-18 | ||
PCT/EP2010/066211 WO2011051310A1 (de) | 2009-10-27 | 2010-10-27 | Array aus skalierbaren keramischen diodenträgern mit led´s |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112012010068A2 true BR112012010068A2 (pt) | 2016-05-31 |
Family
ID=43577328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112012010068A BR112012010068A2 (pt) | 2009-10-27 | 2010-10-27 | rede de suportes de diodo de cerâmica escaláveis com leds |
Country Status (11)
Country | Link |
---|---|
US (1) | US8545054B2 (pt) |
EP (1) | EP2494263B1 (pt) |
JP (1) | JP5758907B2 (pt) |
KR (1) | KR20120112428A (pt) |
CN (1) | CN102844607B (pt) |
BR (1) | BR112012010068A2 (pt) |
DE (1) | DE102010042979A1 (pt) |
MY (1) | MY160695A (pt) |
RU (1) | RU2563245C2 (pt) |
TW (1) | TWI525287B (pt) |
WO (1) | WO2011051310A1 (pt) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112013024771A2 (pt) * | 2011-03-29 | 2019-08-13 | Ceram Gmbh | corpo de iluminação moldado por injeção com resfriadores cerâmicos e leds |
GB2497283A (en) * | 2011-12-02 | 2013-06-12 | Tzu-Yu Liao | Method for assembling LEDs to a ceramic heat conductive member |
TWM441213U (en) * | 2012-04-12 | 2012-11-11 | Jin-Huan Ni | The porous heat dissipation module |
DE102012214887A1 (de) * | 2012-08-22 | 2014-02-27 | Ridi - Leuchten Gmbh | LED-Flächenstrahler |
CN103900002B (zh) * | 2014-03-28 | 2016-04-27 | 上海大学 | 组合式led路灯 |
WO2017097627A1 (en) * | 2015-12-08 | 2017-06-15 | Philips Lighting Holding B.V. | Assembly and lighting device comprising the assembly |
RU174281U1 (ru) * | 2016-11-22 | 2017-10-09 | Егор Евгеньевич Нилов | Осветительное устройство |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2151457C1 (ru) * | 1991-05-15 | 2000-06-20 | Миннесота Майнинг Энд Мэнюфекчуринг Компани | Способ изготовления омического контактного слоя и полупроводниковое устройство ii-vi групп |
US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
TW567619B (en) | 2001-08-09 | 2003-12-21 | Matsushita Electric Ind Co Ltd | LED lighting apparatus and card-type LED light source |
US20080151562A1 (en) * | 2005-11-02 | 2008-06-26 | Hwa Su | Fabrication structure for light emitting diode component |
TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | Ceramtec Ag | 構件或電路用的攜帶體 |
WO2007126074A1 (ja) * | 2006-04-28 | 2007-11-08 | Shimane Prefectural Government | 半導体発光モジュール、装置、およびその製造方法 |
US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
CN101235946A (zh) * | 2007-02-01 | 2008-08-06 | 亿光电子工业股份有限公司 | 均匀照明模块 |
US20080238338A1 (en) * | 2007-03-30 | 2008-10-02 | Stephen Andrew Latham | Method and system for providing scalable and configurable illumination |
DE102008001221A1 (de) * | 2007-04-24 | 2008-10-30 | Ceramtec Ag | Bauteil mit einem keramischen Körper mit metallisierter Oberfläche |
JP2008288536A (ja) * | 2007-05-21 | 2008-11-27 | Panasonic Electric Works Co Ltd | 表面実装型セラミック基板 |
JP5140368B2 (ja) * | 2007-10-01 | 2013-02-06 | ローム株式会社 | 照明装置 |
JP4724700B2 (ja) * | 2007-10-19 | 2011-07-13 | 株式会社Maruwa | 発光装置 |
-
2010
- 2010-10-26 TW TW099136422A patent/TWI525287B/zh not_active IP Right Cessation
- 2010-10-27 DE DE102010042979A patent/DE102010042979A1/de not_active Ceased
- 2010-10-27 US US13/503,974 patent/US8545054B2/en not_active Expired - Fee Related
- 2010-10-27 RU RU2012121579/07A patent/RU2563245C2/ru not_active IP Right Cessation
- 2010-10-27 BR BR112012010068A patent/BR112012010068A2/pt not_active IP Right Cessation
- 2010-10-27 KR KR1020127013744A patent/KR20120112428A/ko not_active Application Discontinuation
- 2010-10-27 MY MYPI2012001812A patent/MY160695A/en unknown
- 2010-10-27 JP JP2012535800A patent/JP5758907B2/ja not_active Expired - Fee Related
- 2010-10-27 EP EP10770829.9A patent/EP2494263B1/de active Active
- 2010-10-27 WO PCT/EP2010/066211 patent/WO2011051310A1/de active Application Filing
- 2010-10-27 CN CN201080049112.6A patent/CN102844607B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2494263B1 (de) | 2020-03-11 |
JP2013508929A (ja) | 2013-03-07 |
WO2011051310A1 (de) | 2011-05-05 |
DE102010042979A1 (de) | 2011-04-28 |
CN102844607A (zh) | 2012-12-26 |
RU2563245C2 (ru) | 2015-09-20 |
US20120223344A1 (en) | 2012-09-06 |
EP2494263A1 (de) | 2012-09-05 |
TW201122348A (en) | 2011-07-01 |
JP5758907B2 (ja) | 2015-08-05 |
KR20120112428A (ko) | 2012-10-11 |
CN102844607B (zh) | 2016-04-13 |
US8545054B2 (en) | 2013-10-01 |
RU2012121579A (ru) | 2013-12-10 |
MY160695A (en) | 2017-03-15 |
TWI525287B (zh) | 2016-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |