TWI525287B - 由具有ｌｅｄ的可變規模的陶瓷二極體載體構成的陣列 - Google Patents

由具有ｌｅｄ的可變規模的陶瓷二極體載體構成的陣列 Download PDF

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TWI525287B
TWI525287B TW099136422A TW99136422A TWI525287B TW I525287 B TWI525287 B TW I525287B TW 099136422 A TW099136422 A TW 099136422A TW 99136422 A TW99136422 A TW 99136422A TW I525287 B TWI525287 B TW I525287B
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ceramic
diode carrier
diode
carrier
led
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TW201122348A (en
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亞歷山大 多恩
阿爾福列德 提姆
史提方 葛瑞格
阿敏 帆特
庫特 布朗
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製陶技術股份有限公司
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
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    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/20—Lighting for medical use
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    • F21Y2115/10—Light-emitting diodes [LED]
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Description

由具有LED的可變規模的陶瓷二極體載體構成的陣列
本發明關於申請專利範圍第1項引文的一種陶瓷二極體載體。
功率LED用的載體可由陶瓷材料(如氮化鋁AlN或Al2O3)構成，各依所需導熱能力而定。如不採此方式，可使用由金屬材料構成的金屬載體，但它們由於對LED結構能導電，故須鍍覆非金屬，或LED須安裝在個別的不導電的結構(載體板)上，如此，儘管該金屬冷却體有良好導熱性，但由於粘著劑和熱膠的導熱性差(典型值在3W/mK以下)使得所需之安裝面積(及冷却面積)增加、或使功率LED的充裝密度下降。
在國際專利WO 2007/107601 A2提到陶瓷冷却體(1)(見本案附圖2a～2d)，它們也稱「熱阱」(散熱體、熱沈)(heatsink)。這些冷却體由一陶瓷的載體本體(2)構成，它設有將熱導離的一體式冷却元件(7)(亦稱翼片)，其中在載體本體(2)的表面(3)上設有燒結的鍍金屬層區域(41)，因此冷却體(1)可當作電路基板(Platine)用。
鍍金屬層區域(41)宜由鎢構成，且用化學方式鍍鎳。圖2a顯示具有冷却元件(7)的載體本體(2)的立體圖，圖2b顯示冷却元件(7)的下視圖。圖2c顯示冷却元件(7)的縱剖面圖，圖2d顯示冷却元件(1)的表面(3)。
本發明的目的在由申請專利範圍第1項的引文的二極體載體製造照明體。
依本發明，這種目的達成之道係為：將至少二個相同的陶瓷二極體載體連接成一陣列。如此只須製造一些相同的陶瓷二極體載體，它們可用物理方式及導電方式互相連接成一陣列以製造該照明體。「陣列」一詞係指同種元件(此處為二極體載體)以固定方式排列。
在一較佳實施例，該二極體載體放入一框中，框宜由金屬或塑膠構成。該框當作二極體載體的容納裝置。此框可做成扁平，但也可做成立體式。
最好該二極體載體具有插頭及/或插座當作電氣式或機械式連接元件，利用該連接元件將相鄰的二極體載體直接或間接互相連接。在此情形中，如果插頭和插座擔任這種功能，則該一框可省却。但插頭及/或插座也只能用於將二極體載體互相作導電連接。要作導電連接，須將插頭與/或插座的極與導線路或鍍金屬層區域互相連接。
在一較佳實施例，該插頭的銷特別是依GU標準5.3者，且該插座配合該銷。在此實施例中，端子銷和插座也捏任機械式及電氣式連接的功能。
在另一變更之較佳實施例，該二極體載體經由分別的連接元件互相連接。這些連接元件也可滿足導電連接元件及/或機械式連接元件的功能或二者兼具。
在一較佳實施例，至少在二極體載體的一邊緣上設有無鍍金屬區域及LED的一個條帶。此條帶構成一陶瓷彈簧以固定在一框上或在一軌上。如此，至少二條軌形成該框。
最好該條帶至少有一凹隙以作固定，此凹隙宜設計成半圓形，且相對於條帶的長度設在中央。在二極體載體的對立側同樣設有一個具一凹隙的條帶，其中該凹隙位在相同側。
在一較佳實施例，該框同時也當作LED的電流供應源。為此，該框由一導電材料構成，例如一金屬。
在一較佳實施例，該框設計成可撓性，其中可很容易地造成二極體載體凸形或凹形的排列。因此舉例而言，可將二極體載體互相排列成凹形，如此該LED可在約100厘米的距離聚焦，此陣列可在LED那一側排成平坦狀以作平面狀照明(散射到一平面)，也可在LED那一側彎成凹形以作點狀(聚焦到一點)照明。
該二極體載體宜可以可以可更換的方式建入、插入、掛入或夾入該框中，如此有缺陷的二極體載體可很容易更換，且該陣列很容易製造。
在一較佳實施例，在該二極體載體上設有互相平行的導線路。各一個相鄰的導線路形成LED的供應源。
依本發明的一種陣列，具有至少二個上述的陶瓷二極體載體，其中，有LED固定在二極體載體上，該LED的電端子與該二極體載體的導線路呈導電連接。
陶瓷冷却體(舉例而言，由氮化鋁AlN構成者，具有180W/mK的導熱性)設計成單晶方式的板，其後側具有陶瓷翼片，它們由於可將LED直接利用導熱良好的軟銲化合物(例如AuSn，其導熱性約60～80W/mK)直接安裝在金屬冷却體上，因此很有效率，故也可將數個冷却體直接相鄰設致成一陣列，以將尺寸規模及數目提升。這種陣列利用一框(例如由金屬製者)保持在一起，該框具有鉗夾以夾住個別之冷却體。在一陣列中，二極體載體可固定成不同角度，因此可產生一種聚焦式或漫射式陣列或一可調整的陣列。二極體的光色可不同。二極體可和一適當的電路一齊間歇地在一定時間啟開。冷却體可用對流方式冷却或用冷却液冷却。
以下本發明利用圖式詳細說明。
圖1顯示九個相同的方形陶瓷二極體載體(10)，它們各有4×4cm的電路，設有各六個同色LED(13)，各有1瓦，它們連接成一陣列。個別的二極體載體(10)建入或掛入一金屬框(11)(只作示意圖示)，該金屬框同時也作為LED(發光二極體)(13)的電流供應源(圖中不顯示電流供應)。在四個角落該金屬框(11)或該陣列係相對於中央的二極體載體(10a)略升高。因此二極體載體(10)設成互相凸出(在圖中看不出)，由於呈凸形排列，故此陣列的LED的光在距二極體載體(10)約100公分距離聚焦。
此由二極體載體(10)構成的陣列用於作面狀的照明，但也可用於作點狀照明。為此，二極體載體(10)以不同角度固定在金屬框中而產生聚焦的光。
藉著將角落(12)向上翻起，舉例而言，造成一種抛物面式的排列，具有一焦點。此陣列也可為平坦作以作面狀照明，或呈彎曲以作點狀照明。
二極體載體(10)可由一陶瓷載體本體(2)構成，它設有一體式的散熱冷却元件(7)(也稱翼片)，其中在載體本體(2)表面(3)上設有燒結的鍍金屬層區域(見圖2)，因此載體本體可當作電路基板使用。
鍍金屬層區域宜由鎢構成，且用化學方式鍍鎳。
此陣列宜用在外科手術室中，其他有利的可能應用方式為：
街道照明
室內/室外物體照明
廣幅光(Flutlicht)(由寬米束燈頭發出的光，用於照明建築物及廣場)
圖3a及3b顯示一本發明的陶瓷二極體載體(10)的上視圖(圖3a)及剖面圖(圖3b)，該二極體載體由一冷却體(1)式一陶瓷載體本體(2)構成，該冷却體或本體設有一體式的散熱的陶瓷冷却元件(7)，此處為翼片。如圖2所示，這些冷却元件(7)設在載體本體(2)的一側且呈梳齒狀垂直地從載體本體(2)突伸出。在載體本體(2)的上側(3)設有燒結的鍍金屬層區域(41)當作導線路(42)(Leiterbahn,英：lead)，因此二極體載體(10)具有一電路基板的功能，具有極佳的散熱性。在二極體載體(10)上，在此實施例中固定著五個LED(13)，它們用其電導線軟銲到鍍金屬層區域(41)，為了將二個或數個二極體載體(10)以導電及/或機械方式連接成一陣列，故該二極體載體(10)具有插頭及/或插座當作連接元件，利用它們可將二極體載體直接或間接互相連接。
在此處所示之實施例，插頭銷(6)特別是依標準GU5.3者，而插座配合該插頭銷。圖3顯示只有具插頭的實施例，在此處它們由插頭銷(6)構成。這些銷(6)[每個插頭各有二根]位在二極體載體(10)的對立側，要將二個二極體載體(10)連接，此處使用一分別的連接元件(8)。此處所示的變更例中的連接元件(8)為一長方形或正方形的板，具有貫穿的孔(14)。二極體載體(10)上的銷(6)插入這些孔，造成導電的接觸。各連接元件(8)有四個孔(14)。在連接元件(8)上的各二個孔(14)互相連接成導電方式。
為了將二極體載體(10)固定在一框中，它們的一邊具有至少一個不具鍍金屬層區域(41)及不具LED(13)的條帶(4)，因此該條帶(4)構成一陶瓷彈簧以固定在一框中或一軌中。如此至少二條軌形成該框。
條帶(4)具有至少一凹隙(5)，以作固定(宜利用一螺絲固定)。
(1)．．．陶瓷冷却體
(2)．．．(陶瓷)載體本體
(3)．．．表面
(4)．．．條帶
(5)．．．凹隙
(6)．．．插頭銷
(7)．．．冷却元件
(8)．．．連接元件
(10)．．．陶瓷二極體載體
(10a)．．．(中央的)二極體載體
(11)．．．金屬框
(12)．．．角落
(13)．．．LED(發光二極體)
(14)．．．孔
(41)．．．鍍金屬區域
(42)．．．導線路
圖1係本發明的九個方形陶瓷二極體載體；
圖2a～2d係依WO 2007/10760 A2的陶瓷冷却體(1)；
圖3a係本發明的陶瓷二極體載體(10)的上視圖；
圖3b係本發明的陶瓷二極體載體(10)的剖面圖。
(2)．．．(陶瓷)載體本體
(3)．．．表面
(7)．．．冷却元件
(10)．．．陶瓷二極體載體
(10a)．．．(中央的)二極體載體
(11)．．．金屬框
(12)．．．角落

Claims (12)

  1. 一種陶瓷二極體載體(10)，包含一陶瓷載體本體(2)，該陶瓷載體本體(2)與將熱導離的陶瓷冷却元件(2)連接，其中在該載體本體(2)的表面(3)上設有燒結在其上的鍍金屬層區域(41)當作導線路，且LED(13)可固定在該二極體載體(10)上，LED(13)的電端子可與導線路呈導電連接，其特徵在：至少二個相同的陶瓷二極體載體(10)連接成一陣列，且該二極體載體(10)放入一框(11)中，框(11)由金屬或塑膠構成。
  2. 如申請專利範圍第1項之陶瓷二極體載體，其中：該二極體載體具有插頭及/或插座當作電氣式或機械式連接元件，利用該連接元件將相鄰的二極體載體(10)直接或間接互相連接。
  3. 如申請專利範圍第2項之陶瓷二極體載體，其中：該插頭的銷(6)特別是依GU標準5.3者，且該插座配合該銷(6)。
  4. 如申請專利範圍第1~3項之任一項之陶瓷二極體載體，其中：該二極體載體(10)經由分別的連接元件(8)互相連接。
  5. 如申請專利範圍第1~3項之任一項之陶瓷二極體載體，其中：至少在二極體載體(10)的一邊緣上設有無鍍金屬區域(41)及LED(13)的一條帶(4)。
  6. 如申請專利範圍第5項之陶瓷二極體載體，其中： 該條帶(4)至少有一凹隙(5)以作固定。
  7. 如申請專利範圍第1~3項之任一項之陶瓷二極體載體，其中：該框(11)同時也當作LED(13)的電流供應源。
  8. 如申請專利範圍第1~3項之任一項之陶瓷二極體載體，其中：該框(11)設計成可撓性。
  9. 如申請專利範圍第~3項之任一項之陶瓷二極體載體，其中：該陣列可在LED那一側作成平坦狀以當作面狀的照明手段也可在LED(13)那一側彎曲成凹形，用於作點狀照明的手段。
  10. 如申請專利範圍第1~3項之任一項之陶瓷二極體載體，其中：該二極體載體(10)建入、插入、掛入或夾入到框(11)中，且宜呈可更換的方式。
  11. 如申請專利範圍第1~3項之任一項之陶瓷二極體載體，其中：在該二極體載體(10)上設有互相平行的導線路(42)。
  12. 一種陣列，具有至少二個依申請專利範圍第1~12項任一項的陶瓷二極體載體(10)，其特徵在：有LED(13)固定在二極體載體(10)上，該LED的電端子與該二極體載體(10)的導線路(42)呈導電連接。
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