M319374 八、新型說明： 【新型所屬之技術領域】 本創作係一種發光二極體燈具上之熱源分散散熱模組，其係藉由散熱极及 散熱罩體分別將發光二極體及電源電路板之熱以分散、分治散熱方式，迅迷向 外散去之目的者。 【先前技術】 ’ 按，在曰常生活上最常接觸之燈光光源有舊式燈泡、石英燈泡、日光燈泡 及水銀燈等，不同於前述之燈源，發光二極體係屬於冷發光，具有耗電量低、 ^ 元件壽命長、不需暖燈時間、反應速度快等優點，再加上其體積小、耐震動、 適合量產、容易配合應用上之需求製作成極小及陣列式元件，所以發光二極體 在資訊、通訊及消費性產品之指示、顯示裝置上，已成為曰常生活上不可或缺 之重要元件，同樣地，以發光二極體為照明之光源將愈來愈受到重視。 但現今以發光二極體作為照明用之燈具，因轉換效率問題，使用時皆會產 生高熱，持續之高熱對於燈具中之電子元件會造成損害，因此會將散熱材料貼 覆於發熱之電子元件上或利用風扇將熱散去，請參照第1圖所示，其設有一燈 座100，該燈座100上設有電源接頭110，且該燈座100上設有電源電路板12〇， 而在燈座100上則有複數個直立且排列成碗狀之散熱鰭片130，該等散熱鰭片 -· 130並藉由一環圈131加以固定，且該等散熱鰭片130中設有一反光罩體14〇， 该反光罩體140具有反射光源之作用，且該反光罩體140中設有一光源基板 • 150，該光源基板150上設有發光二極體151，該發光二極體151上設有一光學 鏡頭152,且該發光二極體151並藉由電流引線與電源電路板120做電性連接， 該電源電路板120上並設有一導熱座160,該導熱座160並與散熱鰭片130密接， 惟此種裝置雖可將電源電路板120及發光二極體151所產生之熱分別透過導熱 座160、光源基板150及反光罩體140傳導至散熱鰭片130上，而使熱散發至外 界上，但由於係共同使用相同散熱鰭片130進行散熱，致使發光二極體151及 電源電路板120之熱源相互影響，特別在使用高瓦數之低電壓高電流的電源電 5 M319374 路’其轉換效率亦低，故產生之熱亦高，若能將發光二極體及獅電路之熱分 別進行散熱，則對發光二極體之壽命將可大幅提高，同時，由於散熱鰭片13〇 係以銘擠或沖壓姻，其形狀、大小皆須依照每個燈具不同而重賴模製作， 且組裝之人工成本亦高，在使用上並非理想。 【新型内容】 ' 創作綱要： • 本創作之創作人有鑑於上述之缺點，因此乃針對其癥結所在，開始著手加 以謀求改善，以期尋求一項合理解決之道，經過無數次之研析、設計，終於完 成本創作之發光二極體燈具上之熱源分散散熱模組。 籲 本創作之另-目的，在提供一種發光二極體燈具上之熱源分散散熱模組， 祕具上設有-燈罩，該燈罩巾容置有_獅電路板，該電源電路板係作為驅 動發光二極體之用’且該電源電路板上設有一將其所產生之熱向外傳導之散熱 罩體，該散熱罩體上設有複數個疊置在一起之散熱板，該等散熱板係配合散熱 罩體之形狀，又，該等散熱板上設有_反光罩，該反光罩巾容置有光源基板， 該光源基板上設有發光二極體，該發光二極體並藉由電流引線與電源電路板作 電性連接，如此一來，發光二極體可透過光源基板及反光罩之導引，將熱傳導 至散熱板上，而電源電路板則可藉散熱罩體之傳導，使熱傳導至外界，使將發 光二極體及電源電路板所產生之熱，以分散方式迅速向外界散去，進而達到散 .熱分治之目的。 本創作之次一目的，在提供一種方便製作及組裝之散熱板，該散熱板可依 燈具形狀、大小不同，任意搭配適合之散熱板形狀及數量。 本創作之另一目的，在提供一種發光二極體燈具上之熱源分散散熱模組， 其電源電路板、散熱罩體、散熱板、反光罩及光源基板，可藉由一連結件之連 結’而串接在一起。 本創作之再一目的，在提供一種發光二極體燈具上之熱源分散散熱模組， 其散熱板上設有複數個通風孔，以確保氣流可以流通其中，不會受到阻礙。 6 M319374 【實施方式】 請參閱第2、3、4、5圖所示，本創作係一種發光二極體燈具上之熱源分散 散熱模組，該燈具上設有一燈罩10，於本實施例係呈一碗狀鏤空體，於本實施 例該燈罩係由塑膠製成，且該燈罩10上設有一向外凸出之燈座11，該燈座11 上設有電源接頭12，該電源接頭12係與外部之電源（圖中未示）相連接，又， ' 於該燈罩10週邊上設有鏤空之通風孔13，透過該通風孔13可與外界之冷空氣 ， 保持流通，且該燈罩1〇内並容置有一形狀與之配合之散熱罩體20，該散熱罩體 20係由導熱性佳之金屬散熱材料所製成，且於該散熱罩體20之底部及週邊上設 有穿孔21及鏤空之通風孔23，又，該散熱罩體20與燈罩1〇間設有一電源電路 • 板30，該電源電路板30係提供驅動發光二極體之電源，且該電源電路板3〇設 有穿孔31及導熱墊32，該導熱墊32係接觸於散熱罩體2〇。 再者，該散熱罩體20中設有一隔熱墊體22,該隔熱墊體22上設有穿孔221， 而該散熱罩體20在隔熱墊體22上則設有複數個以疊置方式重疊在一起之片狀 散熱板40 (於本實施例之片狀散熱片為石墨所組成），為該等散熱板4〇係配合 散熱罩體20形狀，而由下向上之面積逐漸擴增，且該等散熱板4〇間設有面積 較小之導熱板50，透過該等導熱板50可使該等散熱板4〇間保持適當間隙及導 熱效果，又，該等散熱板40及導熱板50上分別設有穿孔41、51，又，該等散 鲁熱板40上則分別設有一個以上之通風孔42，藉由該等通風孔42及導熱板5〇以 •確保氣流可以流通其中，不會受到阻礙。 此外，該等散熱板40上設有-反光罩60，於本實施例為一碗狀之反光罩， 該反光罩60上設有穿孔61，且該反光罩6〇 t容置有一光源基板7〇，該光源基 板70並藉由電流引線與電源電路板3〇做電性連接，且該光源基板7〇上設有一 個以上已封裝之發光二極體71，該光源基板7〇設有凹入之缺口 72，以令連結 件80可穿過缺π 72、穿孔6卜5卜4卜紉、2卜31，而將散熱罩體2〇、隔。熱 墊體22、電源電路板30、散熱板4〇、導熱板5〇、反光罩6〇以及光源基板7〇 串接在-起(如第6圖所示），於本實施例令連結件8〇為螺桿，且該連結件8〇 7 M3193 74 亦作為傳導熱源用。 使用時，請參照苐5、6 ®所示，透過電源接頭12將外部電源導入電源電 路板30，而驅動發光二歸71發出亮光，同時，電源電路板3〇可透過導熱墊 32將熱傳導至散熱罩體20，再藉由散熱罩體2〇將熱傳導出去，同時，光源基 板70上之發光二極體71所產生之熱也可藉由反光罩6〇傳導至疊置在一起之散 熱板40及導熱板50 ’將熱傳導出去，進而達到將電源電路板3〇及發光二極體 71所產生之熱分散、分治傳導之目的。 綜上所述，本創作在物品、形狀、構造、裝置上屬首先創作，且可改良習用 技術之各種缺點，在使用上能增進功效，合於實用，紐符合新型專利要件， 實為一理想之創作。 【圖式簡單說明】 第1圖··為習用裝置之示意圖。 第2圖：為本創作之立體示意圖。 第3圖：為本創作之立體分解示意圖。 第4圖：為本創作之散熱板、導熱板及光源基板之立體分解示意圖。 第5圖：為本創作實施時之俯視示意圖。 第6圖：為本創作實施時之斷面動作示意圖。 【主要元件符號說明】 燈卓 10 燈座 11 電源接頭 12 通風孔 13、23、42 散熱罩體 20 穿孔 21、221、31、41、51、61 隔熱墊體 22 8 M319374 電源電路板 30 導熱墊 32 散熱板 40 導熱板 50 反光罩 60 光源基板 70 發光二極體 71 缺口 72 連結件 80M319374 VIII. New Description: [New Technology Field] This creation is a heat source dispersion heat dissipation module on a light-emitting diode lamp. The heat-emitting diode and the power supply circuit board are respectively used by the heat-dissipating pole and the heat-dissipating cover body. The heat is used to disperse and divide the heat dissipation method. [Prior Art] ' Press, the most common light source in the normal life is the old light bulb, quartz bulb, daylight bulb and mercury lamp. Unlike the above-mentioned light source, the light-emitting diode system is cold-emitting and has power consumption. Low, ^ long component life, no need for warm-up time, fast response, etc., plus its small size, vibration resistance, suitable for mass production, easy to meet the needs of the application to make very small and array components, so the light two In the information, communication and consumer product indications and display devices, polar bodies have become an indispensable component in ordinary life. Similarly, the use of light-emitting diodes as the source of illumination will be increasingly valued. However, today's illuminating diodes are used as lighting fixtures. Due to the conversion efficiency problem, high heat is generated during use. The continuous high heat will cause damage to the electronic components in the luminaire, so the heat dissipating material will be attached to the hot electronic components. The heat is dissipated by using a fan. Please refer to FIG. 1 , which is provided with a lamp holder 100 . The lamp holder 100 is provided with a power connector 110 , and the lamp holder 100 is provided with a power circuit board 12 , and On the lamp holder 100, there are a plurality of heat dissipating fins 130 which are erected and arranged in a bowl shape. The heat dissipating fins 130 are fixed by a ring 131, and the heat dissipating fins 130 are provided with a reflector. The light-emitting diode body 151 is disposed on the light-emitting substrate 150, and the light-emitting diode 151 is disposed on the light-emitting substrate 150. An optical lens 152 is disposed, and the light emitting diode 151 is electrically connected to the power circuit board 120 by a current lead. The power circuit board 120 is further provided with a heat conducting seat 160, and the heat conducting seat 160 and the heat sink fin 130 Close connection, but this device can The heat generated by the power circuit board 120 and the light-emitting diode 151 is transmitted to the heat-dissipating fins 130 through the heat-conducting base 160, the light source substrate 150, and the reflector body 140, respectively, and the heat is radiated to the outside, but the same is used in common. The heat dissipation fins 130 dissipate heat, so that the heat sources of the light-emitting diodes 151 and the power supply circuit board 120 affect each other, especially in the case of using a high-wattage low-voltage high-current power supply 5 M319374 road, which has low conversion efficiency, so that The heat is also high. If the heat of the light-emitting diode and the lion circuit are separately dissipated, the life of the light-emitting diode can be greatly improved, and at the same time, since the heat-dissipating fins 13 are pressed or stamped, The shape and size must be made according to the different lamps, and the labor cost of assembly is also high, which is not ideal in use. [New Content] 'Creation Outline: • The creators of this creation, in view of the above shortcomings, are aiming at the crux of the problem and begin to seek improvement, in order to seek a reasonable solution, after numerous studies and designs. Finally, the heat source dispersion heat dissipation module on the light-emitting diode lamp of the present invention is finally completed. The purpose of this creation is to provide a heat source dissipating heat dissipation module on a light-emitting diode lamp, and a secret cover is provided with a lamp cover, and the lamp cover towel is provided with a _ shi circuit board, and the power circuit board is used as a drive. The heat-emitting diode is disposed on the power circuit board, and the heat-dissipating cover body is provided with a heat-dissipating cover body for transmitting heat generated by the heat-dissipating cover body, and the heat-dissipating cover body is provided with a plurality of heat-dissipating plates stacked on each other, and the heat-dissipating plates In combination with the shape of the heat-dissipating cover, the heat-dissipating plate is provided with a reflector, and the reflector towel is provided with a light source substrate, and the light-emitting substrate is provided with a light-emitting diode, and the light-emitting diode is The current lead is electrically connected to the power circuit board, so that the light emitting diode can be guided through the light source substrate and the reflector to conduct heat to the heat sink board, and the power circuit board can be conducted by the heat sink body. The heat is transmitted to the outside, so that the heat generated by the light-emitting diode and the power circuit board is quickly dissipated to the outside in a dispersed manner, thereby achieving the purpose of dispersing heat and dividing. The second purpose of the present invention is to provide a heat dissipating plate which is convenient to manufacture and assemble. The heat dissipating plate can be arbitrarily matched with the shape and quantity of the suitable heat dissipating plate according to the shape and size of the lamp. Another object of the present invention is to provide a heat source dissipating heat dissipation module on a light-emitting diode lamp, wherein the power circuit board, the heat dissipation cover body, the heat dissipation plate, the reflector and the light source substrate can be connected by a connecting member. And connected together. A further object of the present invention is to provide a heat source dissipating heat dissipation module on a light-emitting diode lamp, and a plurality of ventilation holes are arranged on the heat dissipation plate to ensure that airflow can be circulated therein without being hindered. 6 M319374 [Embodiment] Please refer to Figures 2, 3, 4, and 5, which is a heat source dissipating heat dissipation module on a light-emitting diode lamp. The lamp is provided with a lamp cover 10, which is in this embodiment. In the present embodiment, the lampshade is made of plastic, and the lampshade 10 is provided with an outwardly protruding lamp holder 11, and the lamp holder 11 is provided with a power connector 12, and the power connector 12 is provided. It is connected to an external power source (not shown), and a hollow venting opening 13 is provided in the periphery of the lampshade 10, through which the cold air can be kept circulated, and the lampshade 1 is kept. The heat sink cover 20 is formed by a metal heat dissipation material with good thermal conductivity, and a through hole 21 is formed on the bottom and the periphery of the heat dissipation cover 20 and The power supply circuit board 30 is provided with a power circuit board 30, and the power circuit board 30 is provided with a power source for driving the light emitting diode, and the power circuit board 3 is provided with a power supply circuit board 30. a through hole 31 and a thermal pad 32, the thermal pad 32 is in contact with the heat dissipation cover 2 . In addition, the heat dissipation cover body 20 is provided with a heat insulation pad body 22, and the heat insulation cover body 22 is provided with a through hole 221, and the heat dissipation cover body 20 is provided with a plurality of stacked on the heat insulation pad body 22. The sheet-like heat dissipation plate 40 (which is composed of graphite in the embodiment) has a shape in which the heat dissipation plate 4 is matched with the shape of the heat dissipation cover 20, and the area from the bottom to the top is gradually expanded. And a heat-conducting plate 50 having a smaller area is disposed between the heat-dissipating plates 4, and the heat-dissipating plates 50 can maintain proper gaps and heat-conducting effects between the heat-dissipating plates 4, and the heat-dissipating plates 40 and heat conduction. The plate 50 is provided with perforations 41 and 51 respectively. Further, the dispersing heat plates 40 are respectively provided with one or more ventilation holes 42. The ventilation holes 42 and the heat conducting plates 5 are used to ensure that the airflow can be circulated. Among them, it will not be hindered. In addition, the heat dissipation plate 40 is provided with a reflector 60, which is a bowl-shaped reflector in the embodiment, the reflector 60 is provided with a through hole 61, and the reflector 6 〇t accommodates a light source substrate 7 The light source substrate 70 is electrically connected to the power supply circuit board 3 via a current lead, and the light source substrate 7 is provided with one or more packaged light emitting diodes 71, and the light source substrate 7 is provided with a concave surface. The gap 72 is inserted so that the connecting member 80 can pass through the missing π 72, the through hole 6 b 5 b 4 b, 2 b 31, and the heat sink cover 2 is separated and separated. The thermal pad body 22, the power supply circuit board 30, the heat dissipation board 4〇, the heat conducting board 5〇, the reflector 6〇, and the light source substrate 7 are connected in series (as shown in FIG. 6). 8〇 is a screw, and the joint 8〇7 M3193 74 is also used as a conduction heat source. When in use, please refer to 苐5, 6®, and the external power supply is introduced into the power circuit board 30 through the power connector 12, and the driving light-emitting diode 71 emits light, and the power circuit board 3 〇 can conduct heat through the thermal pad 32 to The heat dissipation cover 20 is further radiated by the heat dissipation cover 2, and the heat generated by the LEDs 71 on the light source substrate 70 can also be transmitted to the stacked heat dissipation plates by the reflector 6 40 and the heat conducting plate 50' conduct heat out, thereby achieving the purpose of dispersing and dividing the heat generated by the power circuit board 3 and the light emitting diode 71. In summary, the creation is first created in the article, shape, structure and device, and can improve various shortcomings of the conventional technology. It can enhance the effect in use, and is practical, and the New Zealand meets the new patent requirements, which is an ideal. Creation. [Simple description of the drawing] Fig. 1 is a schematic diagram of a conventional device. Figure 2: A three-dimensional diagram of the creation. Figure 3: A three-dimensional exploded view of the creation. Fig. 4 is a perspective exploded view of the heat sink, heat conducting plate and light source substrate of the present invention. Figure 5: A schematic view of the top view of the creation of the creation. Figure 6: Schematic diagram of the cross-section action during the implementation of this creation. [Main component symbol description] Lamps 10 Lamp holder 11 Power connector 12 Ventilation holes 13, 23, 42 Heat shield 20 Perforations 21, 221, 31, 41, 51, 61 Insulation pad body 22 8 M319374 Power supply board 30 Heat conduction Pad 32 Heat sink 40 Thermal plate 50 Reflector 60 Light source substrate 70 Light-emitting diode 71 Notch 72 Connector 80