WO2012036465A3 - 방열특성이 향상된 고광력 ｌｅｄ 광원 구조체 - Google Patents

방열특성이 향상된 고광력 ｌｅｄ 광원 구조체 Download PDF

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Publication number
WO2012036465A3
WO2012036465A3 PCT/KR2011/006783 KR2011006783W WO2012036465A3 WO 2012036465 A3 WO2012036465 A3 WO 2012036465A3 KR 2011006783 W KR2011006783 W KR 2011006783W WO 2012036465 A3 WO2012036465 A3 WO 2012036465A3
Authority
WO
WIPO (PCT)
Prior art keywords
light source
electrode unit
source structure
led light
led chip
Prior art date
Application number
PCT/KR2011/006783
Other languages
English (en)
French (fr)
Other versions
WO2012036465A2 (ko
Inventor
이동수
Original Assignee
Lee Dong-Soo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100089576A external-priority patent/KR101051188B1/ko
Priority claimed from KR1020110013577A external-priority patent/KR101220834B1/ko
Application filed by Lee Dong-Soo filed Critical Lee Dong-Soo
Priority to CN2011800406749A priority Critical patent/CN103154607A/zh
Priority to US13/819,395 priority patent/US20130153943A1/en
Priority to EP11825425.9A priority patent/EP2618050A4/en
Priority to JP2013525849A priority patent/JP5705323B2/ja
Publication of WO2012036465A2 publication Critical patent/WO2012036465A2/ko
Publication of WO2012036465A3 publication Critical patent/WO2012036465A3/ko

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

질 발명은 LED 광원 구조체에 관한 것으로, 특히 전기전도성 및 열전도성이 우수한 금속을 가공하여 양 전극유닛을 제작하고 그 중 플러스 전극으로 이용되는 전극유닛을 이용하여 LED칩에서 발생하는 열을 전극유닛을 통하여 직접 배출하여 방열 특성을 향상시키는 동시에 광원의 안정화 및 전압강하의 방지를 이루어 고광력 출력을 가능하도록 하는 방열특성이 향상된 고광력 LED 광원 구조체에 관한 것이다. 본 발명의 방열특성이 향상된 고광력 LED 광원 구조체는 LED칩을 실장하여 LED칩의 점등에 따라 발생하는 열을 외부로 방출할 수 있도록 하는 LED 광원 구조체로서, 전기전도성을 갖는 재질로 이루어진 제1전극유닛(10)과, 전기전도성 및 열전도성을 갖는 재질로 이루어지며 상기 제1전극유닛(10)과 전기적으로 절연되는 제2전극유닛(20)과, 상기 제1전극유닛(10)과 상기 제2전극유닛(20)을 양 전극으로 사용하도록 설치되는 LED칩(40)으로 이루어져, 상기 제1전극유닛(10) 및/또는 제2전극유닛(20)은 LED칩(40)과 면접촉하여 LED칩(40)에서 발생하는 열이 직접 전도되어 대기중으로 방출되는 것을 특징으로 한다.
PCT/KR2011/006783 2010-09-13 2011-09-14 방열특성이 향상된 고광력 ｌｅｄ 광원 구조체 WO2012036465A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2011800406749A CN103154607A (zh) 2010-09-13 2011-09-14 提高了散热特性的高光度led光源构造体
US13/819,395 US20130153943A1 (en) 2011-02-16 2011-09-14 Led light source structure with high illuminating power and improved heat dissipating characteristics
EP11825425.9A EP2618050A4 (en) 2010-09-13 2011-09-14 LED LIGHT SOURCE STRUCTURE WITH HIGH LIGHTNING POWER AND IMPROVED THERMAL REMOVAL PROPERTIES
JP2013525849A JP5705323B2 (ja) 2010-09-13 2011-09-14 放熱特性が向上した高光力ｌｅｄ光源構造体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020100089576A KR101051188B1 (ko) 2010-09-13 2010-09-13 방열 특성이 향상된 고광력 ｌｅｄ 광원 구조체
KR10-2010-0089576 2010-09-13
KR10-2011-0013577 2011-02-16
KR1020110013577A KR101220834B1 (ko) 2011-02-16 2011-02-16 방열성능의 향상 및 전압강하의 방지를 위한 고광력 엘이디 광원 구조체

Publications (2)

Publication Number Publication Date
WO2012036465A2 WO2012036465A2 (ko) 2012-03-22
WO2012036465A3 true WO2012036465A3 (ko) 2012-05-31

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Country Link
EP (1) EP2618050A4 (ko)
JP (1) JP5705323B2 (ko)
CN (1) CN103154607A (ko)
WO (1) WO2012036465A2 (ko)

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DE102012219459A1 (de) * 2012-10-24 2014-04-24 Osram Gmbh Leuchtvorrichtung mit kühlkörper und mindestens einer halbleiterlichtquelle
CN103807628B (zh) * 2012-11-13 2017-12-22 欧司朗有限公司 Led照明装置
KR20160106396A (ko) * 2015-03-02 2016-09-12 주식회사 비케이테크놀로지 리드프레임 및 이를 포함하는 반도체 패키지
JP6802620B2 (ja) * 2015-05-18 2020-12-16 スタンレー電気株式会社 半導体発光装置の製造方法及び半導体発光装置
CN107131485B (zh) * 2017-06-16 2023-04-25 广州市诺思赛光电科技有限公司 同一基板上的双光源结构
CN107270215A (zh) * 2017-06-27 2017-10-20 佛山肆强科技有限公司 利用传热部件单极导电的led灯体及其导电方法和led车灯
JP7088985B2 (ja) * 2020-06-05 2022-06-21 スタンレー電気株式会社 半導体発光装置の製造方法、積層基板の製造方法、及び半導体発光装置

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Also Published As

Publication number Publication date
WO2012036465A2 (ko) 2012-03-22
EP2618050A2 (en) 2013-07-24
JP5705323B2 (ja) 2015-04-22
CN103154607A (zh) 2013-06-12
JP2013541186A (ja) 2013-11-07
EP2618050A4 (en) 2014-08-27

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