ATE532400T1 - Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper - Google Patents

Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper

Info

Publication number
ATE532400T1
ATE532400T1 AT09732751T AT09732751T ATE532400T1 AT E532400 T1 ATE532400 T1 AT E532400T1 AT 09732751 T AT09732751 T AT 09732751T AT 09732751 T AT09732751 T AT 09732751T AT E532400 T1 ATE532400 T1 AT E532400T1
Authority
AT
Austria
Prior art keywords
thermally conductive
heat
mounting element
pcb
circuit board
Prior art date
Application number
AT09732751T
Other languages
English (en)
Inventor
Johannes Rebergen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE532400T1 publication Critical patent/ATE532400T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT09732751T 2008-04-17 2009-04-10 Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper ATE532400T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP08154716 2008-04-17
PCT/IB2009/051521 WO2009128005A1 (en) 2008-04-17 2009-04-10 Thermally conductive mounting element for attachment of printed circuit board to heat sink

Publications (1)

Publication Number Publication Date
ATE532400T1 true ATE532400T1 (de) 2011-11-15

Family

ID=40886168

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09732751T ATE532400T1 (de) 2008-04-17 2009-04-10 Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper

Country Status (10)

Country Link
US (1) US8410672B2 (de)
EP (1) EP2269429B1 (de)
JP (1) JP5283750B2 (de)
KR (1) KR20100133491A (de)
CN (1) CN102007830B (de)
AT (1) ATE532400T1 (de)
ES (1) ES2376710T3 (de)
RU (1) RU2495507C2 (de)
TW (1) TW201008474A (de)
WO (1) WO2009128005A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009047489B4 (de) * 2009-12-04 2013-07-11 Osram Gmbh Leuchtmodul
WO2012039658A1 (en) * 2010-09-22 2012-03-29 Enercomp Ab Led lamp
US9279543B2 (en) 2010-10-08 2016-03-08 Cree, Inc. LED package mount
US8664838B2 (en) 2010-12-15 2014-03-04 Koninklijke Philips N.V. Illumination apparatus and a method of assembling the illumination apparatus
US8933616B2 (en) 2011-03-03 2015-01-13 Koninklijke Philips N.V. Light emitting device with spring-loaded LED-holder
DE102011051047B4 (de) * 2011-06-14 2015-06-18 Hella Kgaa Hueck & Co. Beleuchtungseinrichtung
WO2013049982A1 (zh) * 2011-10-02 2013-04-11 广州南科集成电子有限公司 Led光电源总成及利用传统路灯改造的led路灯
WO2013053625A2 (en) * 2011-10-13 2013-04-18 Osram Ag Mounting device for lighting sources
KR101921127B1 (ko) * 2012-02-29 2018-11-22 엘지이노텍 주식회사 조명 장치
TWM436127U (en) * 2012-03-14 2012-08-21 Jia-Shing Wong Fastener structure of light-emitting diode lamp
DE102012206098A1 (de) * 2012-04-13 2013-10-17 Trilux Gmbh & Co. Kg Leuchte mit einem Trägerelement für ein LED-Modul
CN203243595U (zh) * 2013-03-07 2013-10-16 杭州华三通信技术有限公司 一种pcb结构
US9435527B1 (en) * 2013-10-04 2016-09-06 Universal Lighting Technologies, Inc. Thermal venting apparatus and method for LED modules
US20150201486A1 (en) * 2014-01-16 2015-07-16 Whelen Engineering Company, Inc. Stacked Heatsink Assembly
EP2918906B1 (de) * 2014-03-12 2019-02-13 TE Connectivity Nederland B.V. Buchsenanordnung und -klemme für eine Klemmenanordnung
CN103836595A (zh) * 2014-03-25 2014-06-04 重庆大学 热沉胀接结构总成
USD744155S1 (en) * 2014-05-28 2015-11-24 Osram Sylvania Inc. Lens
RU2570652C1 (ru) * 2014-07-15 2015-12-10 Владимир Вячеславович Павлов Интегрированный блок для светодиодного светильника и способ его изготовления
WO2016048298A1 (en) * 2014-09-24 2016-03-31 Hewlett Packard Enterprise Development Lp Heat sink with a load spreading bar
CN104363737B (zh) * 2014-10-11 2017-09-12 东莞市柏尔电子科技有限公司 一种新型散热可控硅动补调节器
US9605821B2 (en) 2014-11-19 2017-03-28 GE Lighting Solutions, LLC Outdoor LED luminaire with plastic housing
DE202014106099U1 (de) * 2014-12-17 2016-03-18 Zumtobel Lighting Gmbh Leuchtmittelträger für eine Lichtbandleuchte
WO2017086974A1 (en) 2015-11-19 2017-05-26 Halliburton Energy Services, Inc. Thermal management system for downhole tools
EP3497368B1 (de) * 2016-08-19 2020-05-13 Janse Van Rensburg, Frederick Kühlkörper
CN113097162A (zh) * 2017-10-10 2021-07-09 北京比特大陆科技有限公司 散热片、芯片及电路板
US10638647B1 (en) * 2017-12-30 2020-04-28 Xeleum Lighting Attaching printed circuit board to heat exchanger
US10383252B2 (en) * 2018-01-11 2019-08-13 Comptake Technology Inc. Solid state disk module and heat sink device thereof
US10561045B2 (en) 2018-03-19 2020-02-11 Dolby Laboratories Licensing Corporation Surface mount heatsink attachment
CN112787118A (zh) * 2019-11-08 2021-05-11 泰科电子(上海)有限公司 背板组件和电子装置
CN113314481B (zh) * 2020-02-27 2023-01-24 光宝电子(广州)有限公司 晶体管散热模块及其组装方法
WO2021177863A2 (ru) * 2020-03-05 2021-09-10 Общество с ограниченной ответственностью "ДОНЭЛЕКТРОИНТЕЛ" Печатная плата с радиатором охлаждения
RU198573U1 (ru) * 2020-03-05 2020-07-16 Общество с ограниченной ответственностью "ДОНЭЛЕКТРОИНТЕЛ" Печатная плата с радиатором охлаждения
RU205641U1 (ru) * 2021-03-16 2021-07-26 Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации Устройство охлаждения
WO2024061677A1 (en) * 2022-09-22 2024-03-28 Signify Holding B.V. Pcb clip

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032898A (en) 1979-12-10 1991-07-16 Amp Incorporated Electro-optic device assembly having integral heat sink/retention means
US4878108A (en) 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
DE3733905C1 (en) * 1987-10-07 1989-02-09 Harrier Inc Treatment luminaire emitting linearly polarised light
SU1621192A1 (ru) * 1988-05-04 1991-01-15 Предприятие П/Я В-8751 Термокомпенсированна теплопроводна многослойна плата и способ ее изготовлени
JP2689550B2 (ja) * 1988-12-21 1997-12-10 日本電気株式会社 通信機ケースの放熱構造
US5079567A (en) 1991-03-04 1992-01-07 Eastman Kodak Company Leaf-spring assembly for LED printhead
FR2686765B1 (fr) 1992-01-28 1994-03-18 Alcatel Converters Dispositif de fixation, notamment pour la fixation d'un composant electronique sur une paroi d'un dissipateur thermique .
US5323295A (en) * 1992-07-21 1994-06-21 P & P Marketing, Inc. Assembly for integrating heat generating electronic device with nonheat generating devices
EP0619605B1 (de) 1993-04-05 1996-08-28 STMicroelectronics S.r.l. Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke
JPH07326692A (ja) 1994-05-31 1995-12-12 Aging Tesuta Kaihatsu Kyodo Kumiai ベヤーチップｉｃ用ソケット
US5870285A (en) * 1996-10-25 1999-02-09 International Business Machines Corporation Assembly mounting techniques for heat sinks in electronic packaging
RU2177678C2 (ru) * 1997-12-18 2001-12-27 Грузных Сергей Иванович Бесконтактный пускатель
US6582100B1 (en) 2000-08-09 2003-06-24 Relume Corporation LED mounting system
US6541800B2 (en) 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
JP2003110076A (ja) 2001-10-01 2003-04-11 Fujitsu Ltd 熱拡散器および放熱器
JP2004172459A (ja) * 2002-11-21 2004-06-17 Advics:Kk 電子制御装置における電子部品の放熱構造
JP2005331945A (ja) 2004-05-18 2005-12-02 Samsung Sdi Co Ltd プラズマ表示装置
US7170751B2 (en) 2005-01-05 2007-01-30 Gelcore Llc Printed circuit board retaining device
US7502229B2 (en) * 2004-10-15 2009-03-10 Alcatel Lucent Heat dissipation system for multiple integrated circuits mounted on a printed circuit board
US7677763B2 (en) 2004-10-20 2010-03-16 Timothy Chan Method and system for attachment of light emitting diodes to circuitry for use in lighting
TWI255377B (en) 2004-11-05 2006-05-21 Au Optronics Corp Backlight module
JP2006140291A (ja) * 2004-11-11 2006-06-01 Fujitsu Ltd プリント板ユニット、通信装置及びプリント板
DE102005002812B4 (de) 2005-01-20 2013-07-18 Infineon Technologies Ag Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren
EP1897146A2 (de) * 2005-06-27 2008-03-12 Lamina Lighting, Inc. Lichtemissionsdiodenpackung und herstellungsverfahren dafür
WO2007058438A1 (en) 2005-11-18 2007-05-24 Amosense Co., Ltd. Electronic parts packages
US20070235739A1 (en) 2006-03-31 2007-10-11 Edison Opto Corporation Structure of heat dissipation of implant type light emitting diode package and method for manufacturing the same
BRPI0711321A2 (pt) 2006-05-08 2011-08-23 Koninkl Philips Electronics Nv conjunto de led

Also Published As

Publication number Publication date
WO2009128005A1 (en) 2009-10-22
US8410672B2 (en) 2013-04-02
JP2011518436A (ja) 2011-06-23
TW201008474A (en) 2010-02-16
ES2376710T3 (es) 2012-03-16
JP5283750B2 (ja) 2013-09-04
CN102007830A (zh) 2011-04-06
RU2010146650A (ru) 2012-05-27
RU2495507C2 (ru) 2013-10-10
CN102007830B (zh) 2014-07-09
EP2269429A1 (de) 2011-01-05
US20110031864A1 (en) 2011-02-10
EP2269429B1 (de) 2011-11-02
KR20100133491A (ko) 2010-12-21

Similar Documents

Publication Publication Date Title
ATE532400T1 (de) Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
US7872278B2 (en) Light emitting diode system, method for producing such a system, and backlighting device
TW200709766A (en) Flexible circuit board with heat sink
WO2006089033A3 (en) Led light module assembly
NO20084351L (no) Baererlegeme for komponenter og kretser
US10524349B2 (en) Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the board
DE502007002406D1 (de) Leiterplatte mit zusätzlichen funktionalen elementen sowie herstellverfahren und anwendung
WO2011031417A3 (en) Electronic device submounts with thermally conductive vias and light emitting devices including the same
TW200721946A (en) Electronic device with dual heat dissipating structures
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
CN103133915A (zh) 光源组件及其光源模块
ATE517434T1 (de) Elektronische vorrichtung mit einer bodenplatte
TW200731576A (en) Electronic component substrate and method for manufacturing the same
TW200709774A (en) Printed circuit board with improved thermal dissipating structure and electronic device with the same
ATE426318T1 (de) Leiterplatte
TW200704354A (en) Printed circuit board with improved thermal dissipating structure and electronic device with the same
CN204084030U (zh) Led模组及显示器
WO2008060623A3 (en) High output led based illuminator that replaces ccfls for lcd backlights
EP1715732A3 (de) Gedruckte Leiterplattenstruktur mit einer Schicht auf einer ihrer Oberflächen zur Wärmeableitung durch Konvektion
CN201884987U (zh) 高导热的集成led结构
KR20120000739A (ko) 히트싱크가 장착된 ｌｅｄ 모듈 및 그 제조방법
JP2011014837A5 (de)
KR20100036778A (ko) 인쇄회로기판 조립체
CN102752953A (zh) 用于照明设备的印刷电路板和组件
MY154642A (en) A heat sink and a method of enhancing heat dissipation therof