NO20084351L - Baererlegeme for komponenter og kretser - Google Patents
Baererlegeme for komponenter og kretserInfo
- Publication number
- NO20084351L NO20084351L NO20084351A NO20084351A NO20084351L NO 20084351 L NO20084351 L NO 20084351L NO 20084351 A NO20084351 A NO 20084351A NO 20084351 A NO20084351 A NO 20084351A NO 20084351 L NO20084351 L NO 20084351L
- Authority
- NO
- Norway
- Prior art keywords
- carrier body
- circuits
- components
- support body
- conductive
- Prior art date
Links
- 238000001816 cooling Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Oppfinnelsen vedrører et bærerlegeme (1, 2) for elektriske. eller elektroniske komponentelementer (6a, 6b, 6c, 6d) eller kretser, hvilket bærerlegeme (1, 2) er elektrisk ikke-ledende eller nær sagt ikke-ledende. For å forenkle bærerlegemet (1) samtidig som det tilveiebringes ekstremt forbedret. varmespredning foreslås det i henhold til oppfinnelsen at bærerlegemet (1, 2) er tilveiebrakt integrert med varmespredende eller varmetilførende kjøleelementer (7).
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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DE102006013873 | 2006-03-23 | ||
DE102006055965 | 2006-11-24 | ||
DE102006058417 | 2006-12-08 | ||
PCT/EP2007/052726 WO2007107601A2 (de) | 2006-03-23 | 2007-03-22 | Trägerkörper für bauelemente oder schaltungen |
Publications (1)
Publication Number | Publication Date |
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NO20084351L true NO20084351L (no) | 2008-12-18 |
Family
ID=38051792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20084351A NO20084351L (no) | 2006-03-23 | 2008-10-16 | Baererlegeme for komponenter og kretser |
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SI (1) | SI2397754T1 (no) |
TW (1) | TWI449137B (no) |
WO (1) | WO2007107601A2 (no) |
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