TWI245436B - Package for housing light-emitting element, light-emitting apparatus and illumination apparatus - Google Patents

Package for housing light-emitting element, light-emitting apparatus and illumination apparatus Download PDF

Info

Publication number
TWI245436B
TWI245436B TW093133106A TW93133106A TWI245436B TW I245436 B TWI245436 B TW I245436B TW 093133106 A TW093133106 A TW 093133106A TW 93133106 A TW93133106 A TW 93133106A TW I245436 B TWI245436 B TW I245436B
Authority
TW
Taiwan
Prior art keywords
light
base body
emitting element
emitting
upper surface
Prior art date
Application number
TW093133106A
Other versions
TW200527716A (en
Inventor
Mitsugu Uraya
Daisuke Sakumoto
Akira Miyake
Fumiaki Sekine
Mitsuo Yanagisawa
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003369952 priority Critical
Priority to JP2003396426 priority
Priority to JP2003397232 priority
Priority to JP2003423439 priority
Priority to JP2003428250 priority
Priority to JP2003429420 priority
Priority to JP2004071430A priority patent/JP3921474B2/en
Priority to JP2004071427A priority patent/JP4091926B2/en
Priority to JP2004071433A priority patent/JP2005183901A/en
Priority to JP2004071428 priority
Priority to JP2004071429A priority patent/JP2005210042A/en
Priority to JP2004071434A priority patent/JP2005210043A/en
Priority to JP2004275058A priority patent/JP2005294796A/en
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of TW200527716A publication Critical patent/TW200527716A/en
Application granted granted Critical
Publication of TWI245436B publication Critical patent/TWI245436B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers

Abstract

A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent substances for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 mum.
TW093133106A 2003-09-11 2004-10-29 Package for housing light-emitting element, light-emitting apparatus and illumination apparatus TWI245436B (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2003369952 2003-10-30
JP2003396426 2003-11-26
JP2003397232 2003-11-27
JP2003423439 2003-12-19
JP2003428250 2003-12-24
JP2003429420 2003-12-25
JP2004071433A JP2005183901A (en) 2003-11-27 2004-03-12 Package for housing light emitting element, light emitting device and illuminating device
JP2004071428 2004-03-12
JP2004071429A JP2005210042A (en) 2003-09-11 2004-03-12 Light emitting apparatus and illumination apparatus
JP2004071427A JP4091926B2 (en) 2003-11-26 2004-03-12 A light-emitting device and a lighting device
JP2004071434A JP2005210043A (en) 2003-12-24 2004-03-12 Package for housing light-emitting element, light-emitting apparatus and illumination apparatus
JP2004071430A JP3921474B2 (en) 2003-10-30 2004-03-12 A light-emitting device and a lighting device
JP2004275058A JP2005294796A (en) 2003-12-19 2004-09-22 Package for housing light emitting element, light emitting apparatus, and lighting system

Publications (2)

Publication Number Publication Date
TW200527716A TW200527716A (en) 2005-08-16
TWI245436B true TWI245436B (en) 2005-12-11

Family

ID=34637534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093133106A TWI245436B (en) 2003-09-11 2004-10-29 Package for housing light-emitting element, light-emitting apparatus and illumination apparatus

Country Status (4)

Country Link
KR (2) KR20050041986A (en)
CN (1) CN100392877C (en)
DE (1) DE102004052902B4 (en)
TW (1) TWI245436B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006123917A1 (en) * 2005-05-20 2006-11-23 Luxpia Co., Ltd. Light emitting diode package having a reflector cup by metal thin film and its manufacturing method
WO2006126809A1 (en) * 2005-05-26 2006-11-30 Luxpia Co., Ltd. Very small light emitting diode package and manufacturing methods of it
US7847302B2 (en) * 2005-08-26 2010-12-07 Koninklijke Philips Electronics, N.V. Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature
TWI449137B (en) * 2006-03-23 2014-08-11 Ceramtec Ag Traegerkoerper fuer bauelemente oder schaltungen
US7655957B2 (en) 2006-04-27 2010-02-02 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
KR100820529B1 (en) * 2006-05-11 2008-04-08 엘지이노텍 주식회사 Lighting apparatus and manufacturing method thereof, surface lighting apparatus
WO2008023467A1 (en) 2006-08-24 2008-02-28 Sharp Kabushiki Kaisha Light emitting element, light emitting element array, backlight unit, and liquid crystal display device
CN2911965Y (en) * 2006-11-08 2007-06-13 秦波 White-light LED
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
KR101417003B1 (en) * 2007-08-30 2014-07-09 엘지이노텍 주식회사 Light emitting device package and fabrication method thereof
DE102008022888A1 (en) * 2008-05-08 2009-11-19 Lok-F Gmbh Lighting device comprising a light source surrounded by solid particles comprises a particle number density gradient in at least one direction away from the light source
JP5402109B2 (en) * 2009-02-27 2014-01-29 デクセリアルズ株式会社 The anisotropic conductive film and the light-emitting device
DE102009045175B4 (en) 2009-09-30 2018-07-12 Sirona Dental Systems Gmbh Lighting device for a dental handpiece and a method for producing and assembling a lighting device
CN102412244A (en) * 2010-09-25 2012-04-11 启耀光电股份有限公司 Light-emitting device
CN102468375B (en) * 2010-11-15 2015-06-17 光宝电子(广州)有限公司 Light-emitting diode packaging structure and manufacturing method thereof
KR101108598B1 (en) * 2010-11-25 2012-01-31 (주) 아모엘이디 Method for manufacturing high reflecting semiconductor package
CN102738352B (en) * 2011-04-13 2016-01-06 展晶科技(深圳)有限公司 Led package
KR101241447B1 (en) * 2011-08-03 2013-03-11 장종진 Lighting emitting diode package and Method for manufacturing the same
CN102322581A (en) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 LED (light-emitting diode) light source module with high-whiteness substrate
US20140240995A1 (en) * 2011-09-29 2014-08-28 Kyocera Corporation Light-emitting element mounting substrate and light emitting device
US9857059B2 (en) * 2011-10-31 2018-01-02 Sharp Kabushiki Kaisha Light emitting device, illuminating device and method of manufacturing light emitting device
CN102569600B (en) * 2011-11-11 2014-12-10 深圳市瑞丰光电子股份有限公司 LED (light emitting diode) packaging structure and reflection cup thereof
CN106954982A (en) * 2016-01-08 2017-07-18 芬妮斯钻石公司 Ultraviolet gemstone display box
CN103672609A (en) * 2013-12-02 2014-03-26 深圳市华星光电技术有限公司 Light source with quantum dots and manufacturing method and application of light source with quantum dots
US9680067B2 (en) 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability
US9590148B2 (en) 2014-03-18 2017-03-07 GE Lighting Solutions, LLC Encapsulant modification in heavily phosphor loaded LED packages for improved stability
TWI553793B (en) * 2014-07-24 2016-10-11 Viking Tech Corp A ceramic substrate, a chip carrier, and a semiconductor chip package componet and the manufacturing method thereof
DE202017103633U1 (en) * 2017-06-20 2018-09-24 Tridonic Jennersdorf Gmbh LED module with integrated reflector and color conversion means

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1472204A (en) * 1974-07-16 1977-05-04 Matsushita Electric Ind Co Ltd Ceramic materials
US6184544B1 (en) 1998-01-29 2001-02-06 Rohm Co., Ltd. Semiconductor light emitting device with light reflective current diffusion layer
CN1381904A (en) 2001-04-18 2002-11-27 银河光电有限公司 Package of LED chip and its light-gathering lens
US7554258B2 (en) * 2002-10-22 2009-06-30 Osram Opto Semiconductors Gmbh Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body

Also Published As

Publication number Publication date
KR20060107428A (en) 2006-10-13
KR20050041986A (en) 2005-05-04
TW200527716A (en) 2005-08-16
DE102004052902A1 (en) 2005-06-30
CN100392877C (en) 2008-06-04
CN1612369A (en) 2005-05-04
DE102004052902B4 (en) 2011-12-08

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