FR2814280B1 - Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat - Google Patents

Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat

Info

Publication number
FR2814280B1
FR2814280B1 FR0103184A FR0103184A FR2814280B1 FR 2814280 B1 FR2814280 B1 FR 2814280B1 FR 0103184 A FR0103184 A FR 0103184A FR 0103184 A FR0103184 A FR 0103184A FR 2814280 B1 FR2814280 B1 FR 2814280B1
Authority
FR
France
Prior art keywords
substrate
power
electronic circuit
circuit module
power electronics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0103184A
Other languages
English (en)
Other versions
FR2814280A1 (fr
Inventor
Benoit Boursat
Emmanuel Dutarde
Nathalie Martin
Pierre Solomalala
Jose Saiz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom Transport Technologies SAS
Original Assignee
Alstom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0011802A priority Critical patent/FR2814279B1/fr
Application filed by Alstom SA filed Critical Alstom SA
Priority to FR0103184A priority patent/FR2814280B1/fr
Priority claimed from EP02290188.8A external-priority patent/EP1239515B1/fr
Publication of FR2814280A1 publication Critical patent/FR2814280A1/fr
Application granted granted Critical
Publication of FR2814280B1 publication Critical patent/FR2814280B1/fr
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/064Fluid cooling, e.g. by integral pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
FR0103184A 2000-09-15 2001-03-08 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat Active FR2814280B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0011802A FR2814279B1 (fr) 2000-09-15 2000-09-15 Substrat pour circuit electronique et module electronique utilisant un tel substrat
FR0103184A FR2814280B1 (fr) 2000-09-15 2001-03-08 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR0103184A FR2814280B1 (fr) 2000-09-15 2001-03-08 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat
EP02290188.8A EP1239515B1 (fr) 2001-03-08 2002-01-28 Substrat pour circuit électronique de puissance et module électronique de puissance utilisant un tel substrat
US10/059,359 US6586783B2 (en) 2001-03-08 2002-01-31 Substrate for an electronic power circuit, and an electronic power module using such a substrate
CA 2374143 CA2374143C (fr) 2001-03-08 2002-03-04 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat
JP2002058304A JP2002280500A (ja) 2001-03-08 2002-03-05 電力回路基板及びそのような基板を使用する電力モジュール

Publications (2)

Publication Number Publication Date
FR2814280A1 FR2814280A1 (fr) 2002-03-22
FR2814280B1 true FR2814280B1 (fr) 2003-05-02

Family

ID=26212615

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0103184A Active FR2814280B1 (fr) 2000-09-15 2001-03-08 Substrat pour circuit electronique de puissance et module electronique de puissance utilisant un tel substrat

Country Status (1)

Country Link
FR (1) FR2814280B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449137B (en) * 2006-03-23 2014-08-11 Ceramtec Ag Traegerkoerper fuer bauelemente oder schaltungen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455339B2 (fr) * 1985-01-31 1992-09-03 Tokyo Shibaura Electric Co
JPH01272183A (en) * 1988-04-25 1989-10-31 Toshiba Corp Ceramics circuit board
JPH07202063A (ja) * 1993-12-28 1995-08-04 Toshiba Corp セラミックス回路基板
DE9404717U1 (de) * 1994-03-22 1995-05-04 Tbs Gmbh Kühlelement
US6033764A (en) * 1994-12-16 2000-03-07 Zecal Corp. Bumped substrate assembly
US5912066A (en) * 1996-03-27 1999-06-15 Kabushiki Kaisha Toshiba Silicon nitride circuit board and producing method therefor

Also Published As

Publication number Publication date
FR2814280A1 (fr) 2002-03-22

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Legal Events

Date Code Title Description
CA Change of address
TP Transmission of property

Owner name: ALSTOM TRANSPORT TECHNOLOGIES SAS, FR

Effective date: 20150818

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

CA Change of address

Effective date: 20180103

PLFP Fee payment

Year of fee payment: 18