SE0502703L - Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare - Google Patents

Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare

Info

Publication number
SE0502703L
SE0502703L SE0502703A SE0502703A SE0502703L SE 0502703 L SE0502703 L SE 0502703L SE 0502703 A SE0502703 A SE 0502703A SE 0502703 A SE0502703 A SE 0502703A SE 0502703 L SE0502703 L SE 0502703L
Authority
SE
Sweden
Prior art keywords
circuit board
cooler
electric drive
drive unit
components against
Prior art date
Application number
SE0502703A
Other languages
English (en)
Other versions
SE529394C2 (sv
Inventor
Thord Agne Gustaf Nilson
Ulf Bengt Ingemar Karlsson
Original Assignee
Danaher Motion Stockholm Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danaher Motion Stockholm Ab filed Critical Danaher Motion Stockholm Ab
Priority to SE0502703A priority Critical patent/SE529394C2/sv
Priority to US11/564,743 priority patent/US7548420B2/en
Priority to EP06445071A priority patent/EP1796448A2/en
Publication of SE0502703L publication Critical patent/SE0502703L/sv
Publication of SE529394C2 publication Critical patent/SE529394C2/sv

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SE0502703A 2005-12-08 2005-12-08 Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare SE529394C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0502703A SE529394C2 (sv) 2005-12-08 2005-12-08 Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare
US11/564,743 US7548420B2 (en) 2005-12-08 2006-11-29 Electrical drive unit
EP06445071A EP1796448A2 (en) 2005-12-08 2006-12-01 Electrical drive unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0502703A SE529394C2 (sv) 2005-12-08 2005-12-08 Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare

Publications (2)

Publication Number Publication Date
SE0502703L true SE0502703L (sv) 2007-06-09
SE529394C2 SE529394C2 (sv) 2007-07-31

Family

ID=37885808

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0502703A SE529394C2 (sv) 2005-12-08 2005-12-08 Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare

Country Status (3)

Country Link
US (1) US7548420B2 (sv)
EP (1) EP1796448A2 (sv)
SE (1) SE529394C2 (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101653056B (zh) * 2007-02-15 2011-08-31 日本电气株式会社 电子器件安装设备及其噪声抑制方法
JP5586866B2 (ja) * 2008-09-29 2014-09-10 株式会社日立産機システム 電力変換装置
GB2487185B (en) 2011-01-05 2015-06-03 Penny & Giles Controls Ltd Power Switching Circuitry
EP2648495B1 (en) * 2012-04-04 2015-02-25 Inmotion Technologies AB Switched power converter
US9674990B2 (en) * 2015-01-23 2017-06-06 Rockwell Automation Technoloies, Inc. Devices and methods for cooling bus capacitors
US9652008B2 (en) * 2015-04-02 2017-05-16 Det International Holding Limited Power module
CN106298688B (zh) * 2015-05-28 2018-11-06 台达电子工业股份有限公司 封装型功率电路模块
DE102020005363A1 (de) * 2019-09-12 2021-03-18 Sew-Eurodrive Gmbh & Co Kg Elektrogerät und Verfahren zum Herstellen eines ersten und zweiten Elektrogeräts aus einem Baukasten
CN112105239A (zh) * 2020-09-27 2020-12-18 滁州天陆泓机械有限公司 一种驱动器及驱动器对准安装方法
DE102022203505A1 (de) * 2022-04-07 2023-10-12 Mahle International Gmbh Induktionsladeeinheit sowie Energieübertragungssystem mit derselben

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563725A (en) * 1983-01-06 1986-01-07 Welwyn Electronics Limited Electrical assembly
US4821051A (en) * 1988-09-01 1989-04-11 Eastman Kodak Company Optical printhead having thermal expansion stress relief
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5263245A (en) * 1992-01-27 1993-11-23 International Business Machines Corporation Method of making an electronic package with enhanced heat sinking
US5959840A (en) * 1994-05-17 1999-09-28 Tandem Computers Incorporated Apparatus for cooling multiple printed circuit board mounted electrical components
US6141220A (en) * 1999-04-02 2000-10-31 Global Win Technology Co., Ltd. CPU heat sink mounting arrangement
US6299460B1 (en) * 2000-04-14 2001-10-09 Hewlett Packard Company Spring-loaded backing plate assembly for use with land grid array-type devices
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
US7289335B2 (en) * 2003-07-08 2007-10-30 Hewlett-Packard Development Company, L.P. Force distributing spring element
TWM246687U (en) * 2003-10-28 2004-10-11 Hon Hai Prec Ind Co Ltd Heat dissipation device
US7345885B2 (en) * 2004-12-22 2008-03-18 Hewlett-Packard Development Company, L.P. Heat spreader with multiple stacked printed circuit boards
TWM279164U (en) * 2005-05-31 2005-10-21 Atio System Inc Electronic device with heat-dissipating casing
US7295433B2 (en) * 2005-10-28 2007-11-13 Delphi Technologies, Inc. Electronics assembly having multiple side cooling and method

Also Published As

Publication number Publication date
SE529394C2 (sv) 2007-07-31
US20070133180A1 (en) 2007-06-14
US7548420B2 (en) 2009-06-16
EP1796448A2 (en) 2007-06-13

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