SE0502703L - Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare - Google Patents
Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylareInfo
- Publication number
- SE0502703L SE0502703L SE0502703A SE0502703A SE0502703L SE 0502703 L SE0502703 L SE 0502703L SE 0502703 A SE0502703 A SE 0502703A SE 0502703 A SE0502703 A SE 0502703A SE 0502703 L SE0502703 L SE 0502703L
- Authority
- SE
- Sweden
- Prior art keywords
- circuit board
- cooler
- electric drive
- drive unit
- components against
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0502703A SE529394C2 (sv) | 2005-12-08 | 2005-12-08 | Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare |
US11/564,743 US7548420B2 (en) | 2005-12-08 | 2006-11-29 | Electrical drive unit |
EP06445071A EP1796448A2 (en) | 2005-12-08 | 2006-12-01 | Electrical drive unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0502703A SE529394C2 (sv) | 2005-12-08 | 2005-12-08 | Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare |
Publications (2)
Publication Number | Publication Date |
---|---|
SE0502703L true SE0502703L (sv) | 2007-06-09 |
SE529394C2 SE529394C2 (sv) | 2007-07-31 |
Family
ID=37885808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0502703A SE529394C2 (sv) | 2005-12-08 | 2005-12-08 | Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare |
Country Status (3)
Country | Link |
---|---|
US (1) | US7548420B2 (sv) |
EP (1) | EP1796448A2 (sv) |
SE (1) | SE529394C2 (sv) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101653056B (zh) * | 2007-02-15 | 2011-08-31 | 日本电气株式会社 | 电子器件安装设备及其噪声抑制方法 |
JP5586866B2 (ja) * | 2008-09-29 | 2014-09-10 | 株式会社日立産機システム | 電力変換装置 |
GB2487185B (en) | 2011-01-05 | 2015-06-03 | Penny & Giles Controls Ltd | Power Switching Circuitry |
EP2648495B1 (en) * | 2012-04-04 | 2015-02-25 | Inmotion Technologies AB | Switched power converter |
US9674990B2 (en) * | 2015-01-23 | 2017-06-06 | Rockwell Automation Technoloies, Inc. | Devices and methods for cooling bus capacitors |
US9652008B2 (en) * | 2015-04-02 | 2017-05-16 | Det International Holding Limited | Power module |
CN106298688B (zh) * | 2015-05-28 | 2018-11-06 | 台达电子工业股份有限公司 | 封装型功率电路模块 |
DE102020005363A1 (de) * | 2019-09-12 | 2021-03-18 | Sew-Eurodrive Gmbh & Co Kg | Elektrogerät und Verfahren zum Herstellen eines ersten und zweiten Elektrogeräts aus einem Baukasten |
CN112105239A (zh) * | 2020-09-27 | 2020-12-18 | 滁州天陆泓机械有限公司 | 一种驱动器及驱动器对准安装方法 |
DE102022203505A1 (de) * | 2022-04-07 | 2023-10-12 | Mahle International Gmbh | Induktionsladeeinheit sowie Energieübertragungssystem mit derselben |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4563725A (en) * | 1983-01-06 | 1986-01-07 | Welwyn Electronics Limited | Electrical assembly |
US4821051A (en) * | 1988-09-01 | 1989-04-11 | Eastman Kodak Company | Optical printhead having thermal expansion stress relief |
US5109318A (en) * | 1990-05-07 | 1992-04-28 | International Business Machines Corporation | Pluggable electronic circuit package assembly with snap together heat sink housing |
US5263245A (en) * | 1992-01-27 | 1993-11-23 | International Business Machines Corporation | Method of making an electronic package with enhanced heat sinking |
US5959840A (en) * | 1994-05-17 | 1999-09-28 | Tandem Computers Incorporated | Apparatus for cooling multiple printed circuit board mounted electrical components |
US6141220A (en) * | 1999-04-02 | 2000-10-31 | Global Win Technology Co., Ltd. | CPU heat sink mounting arrangement |
US6299460B1 (en) * | 2000-04-14 | 2001-10-09 | Hewlett Packard Company | Spring-loaded backing plate assembly for use with land grid array-type devices |
US6580611B1 (en) * | 2001-12-21 | 2003-06-17 | Intel Corporation | Dual-sided heat removal system |
US7289335B2 (en) * | 2003-07-08 | 2007-10-30 | Hewlett-Packard Development Company, L.P. | Force distributing spring element |
TWM246687U (en) * | 2003-10-28 | 2004-10-11 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
US7345885B2 (en) * | 2004-12-22 | 2008-03-18 | Hewlett-Packard Development Company, L.P. | Heat spreader with multiple stacked printed circuit boards |
TWM279164U (en) * | 2005-05-31 | 2005-10-21 | Atio System Inc | Electronic device with heat-dissipating casing |
US7295433B2 (en) * | 2005-10-28 | 2007-11-13 | Delphi Technologies, Inc. | Electronics assembly having multiple side cooling and method |
-
2005
- 2005-12-08 SE SE0502703A patent/SE529394C2/sv unknown
-
2006
- 2006-11-29 US US11/564,743 patent/US7548420B2/en not_active Expired - Fee Related
- 2006-12-01 EP EP06445071A patent/EP1796448A2/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
SE529394C2 (sv) | 2007-07-31 |
US20070133180A1 (en) | 2007-06-14 |
US7548420B2 (en) | 2009-06-16 |
EP1796448A2 (en) | 2007-06-13 |
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