ATE538495T1 - Leiterplattenanodrnung umfassend einen wärmeableiter - Google Patents

Leiterplattenanodrnung umfassend einen wärmeableiter

Info

Publication number
ATE538495T1
ATE538495T1 AT09163681T AT09163681T ATE538495T1 AT E538495 T1 ATE538495 T1 AT E538495T1 AT 09163681 T AT09163681 T AT 09163681T AT 09163681 T AT09163681 T AT 09163681T AT E538495 T1 ATE538495 T1 AT E538495T1
Authority
AT
Austria
Prior art keywords
pcb
pin
circuit board
bga
hole
Prior art date
Application number
AT09163681T
Other languages
English (en)
Inventor
Emmanuel Loiselet
Phil Wills
Original Assignee
Thales Holdings Uk Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Holdings Uk Plc filed Critical Thales Holdings Uk Plc
Application granted granted Critical
Publication of ATE538495T1 publication Critical patent/ATE538495T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Paper (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
AT09163681T 2008-07-02 2009-06-24 Leiterplattenanodrnung umfassend einen wärmeableiter ATE538495T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0812139A GB2461548B (en) 2008-07-02 2008-07-02 Printed circuit board assembly

Publications (1)

Publication Number Publication Date
ATE538495T1 true ATE538495T1 (de) 2012-01-15

Family

ID=39707928

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09163681T ATE538495T1 (de) 2008-07-02 2009-06-24 Leiterplattenanodrnung umfassend einen wärmeableiter

Country Status (4)

Country Link
US (1) US8278559B2 (de)
EP (1) EP2146374B1 (de)
AT (1) ATE538495T1 (de)
GB (1) GB2461548B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8077460B1 (en) 2010-07-19 2011-12-13 Toyota Motor Engineering & Manufacturing North America, Inc. Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same
US8199505B2 (en) 2010-09-13 2012-06-12 Toyota Motor Engineering & Manufacturing Norh America, Inc. Jet impingement heat exchanger apparatuses and power electronics modules
US8659896B2 (en) 2010-09-13 2014-02-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules
US10433414B2 (en) * 2010-12-24 2019-10-01 Rayben Technologies (HK) Limited Manufacturing method of printing circuit board with micro-radiators
US8427832B2 (en) 2011-01-05 2013-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Cold plate assemblies and power electronics modules
US8391008B2 (en) 2011-02-17 2013-03-05 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics modules and power electronics module assemblies
US8482919B2 (en) 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US8929077B2 (en) * 2012-01-02 2015-01-06 Tem Products Inc. Thermal connector
US20130308274A1 (en) * 2012-05-21 2013-11-21 Triquint Semiconductor, Inc. Thermal spreader having graduated thermal expansion parameters
US8643173B1 (en) 2013-01-04 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features
US20140190727A1 (en) * 2013-01-10 2014-07-10 Starlite Led Usa Method of fabricating flexible metal core printed circuit board
US9131631B2 (en) 2013-08-08 2015-09-08 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
EP3310140B1 (de) * 2016-10-14 2021-07-14 Vitesco Technologies GmbH Montageanordnung mit einem kühlkörper
US10269678B1 (en) * 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
US11683911B2 (en) * 2018-10-26 2023-06-20 Magna Electronics Inc. Vehicular sensing device with cooling feature
US10651110B1 (en) 2018-12-31 2020-05-12 Juniper Networks, Inc. Efficient heat-sinking in PIN diode
US11089671B2 (en) * 2019-11-26 2021-08-10 Eridan Communications, Inc. Integrated circuit / printed circuit board assembly and method of manufacture
US12362655B2 (en) 2020-04-15 2025-07-15 The Trustees Of Princeton University System and method for vertical power delivery to electronic systems
TWI738307B (zh) * 2020-04-24 2021-09-01 欣興電子股份有限公司 線路板結構
KR102812686B1 (ko) * 2020-06-22 2025-05-27 엘지이노텍 주식회사 통신 모듈
JP7447785B2 (ja) * 2020-12-25 2024-03-12 株式会社デンソー 電子装置
US11910518B2 (en) * 2021-05-26 2024-02-20 Huawei Technologies Canada Co., Ltd. Method and apparatus for heat sink mounting
CN114245562B (zh) * 2021-11-03 2024-04-26 马瑞利汽车零部件(芜湖)有限公司 电子元器件散热装置
US12581591B2 (en) * 2022-05-05 2026-03-17 Nvidia Corp. Circuit system and method of manufacturing a printed circuit board

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US6097089A (en) * 1998-01-28 2000-08-01 Mitsubishi Gas Chemical Company, Inc. Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
US5784260A (en) * 1996-05-29 1998-07-21 International Business Machines Corporation Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate
US5856911A (en) * 1996-11-12 1999-01-05 National Semiconductor Corporation Attachment assembly for integrated circuits
US6376908B1 (en) * 1997-12-10 2002-04-23 Mitsubishi Gas Chemical Company, Inc. Semiconductor plastic package and process for the production thereof
JP3677403B2 (ja) * 1998-12-07 2005-08-03 パイオニア株式会社 発熱素子の放熱構造
JP3196762B2 (ja) * 1999-04-20 2001-08-06 日本電気株式会社 半導体チップ冷却構造
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
JP3520039B2 (ja) * 2000-10-05 2004-04-19 三洋電機株式会社 半導体装置および半導体モジュール
JP3653460B2 (ja) * 2000-10-26 2005-05-25 三洋電機株式会社 半導体モジュールおよびその製造方法
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
US6490161B1 (en) * 2002-01-08 2002-12-03 International Business Machines Corporation Peripheral land grid array package with improved thermal performance
US6762939B2 (en) * 2002-02-20 2004-07-13 Intel Corporation Thermal solution for a mezzanine card
US7268425B2 (en) * 2003-03-05 2007-09-11 Intel Corporation Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
JP4218434B2 (ja) * 2003-06-16 2009-02-04 株式会社日立製作所 電子装置

Also Published As

Publication number Publication date
EP2146374A1 (de) 2010-01-20
GB2461548B (en) 2010-10-13
EP2146374B1 (de) 2011-12-21
GB0812139D0 (en) 2008-08-06
US20100000766A1 (en) 2010-01-07
GB2461548A (en) 2010-01-06
US8278559B2 (en) 2012-10-02

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