WO2008136419A1 - 半導体装置及び製造方法並びにリペア方法 - Google Patents

半導体装置及び製造方法並びにリペア方法 Download PDF

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Publication number
WO2008136419A1
WO2008136419A1 PCT/JP2008/058091 JP2008058091W WO2008136419A1 WO 2008136419 A1 WO2008136419 A1 WO 2008136419A1 JP 2008058091 W JP2008058091 W JP 2008058091W WO 2008136419 A1 WO2008136419 A1 WO 2008136419A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor device
conductive resin
resin bump
bump
pad
Prior art date
Application number
PCT/JP2008/058091
Other languages
English (en)
French (fr)
Inventor
Akira Ouchi
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009512984A priority Critical patent/JPWO2008136419A1/ja
Priority to US12/597,716 priority patent/US20100052163A1/en
Publication of WO2008136419A1 publication Critical patent/WO2008136419A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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Abstract

　対向する半導体部品（１）のパッド（５）と配線基板（２）のパッド（６）とがバンプを介して導通するように構成された半導体装置であって、半導体部品（１）のパッド（５）上に設けられた第１の導電性樹脂バンプ（３）と、配線基板（２）のパッド（６）上に設けられた第２の導電性樹脂バンプ（４）と、を備える。第２の導電性樹脂バンプ（４）は、第１の導電性樹脂バンプ（３）よりガラス転移温度が４０℃以上低く、半導体部品（１）の搭載時の加熱荷重により、半導体部品（１）側の第１の導電性樹脂バンプ（３）の表面形状に沿うように変形している。また同様の考え方で、第１の導電性樹脂バンプ（３）のガラス転移温度を第２の導電性樹脂バンプ（４）より低くして変形させることも可能である。
PCT/JP2008/058091 2007-04-27 2008-04-25 半導体装置及び製造方法並びにリペア方法 WO2008136419A1 (ja)

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US12/597,716 US20100052163A1 (en) 2007-04-27 2008-04-25 Semiconductor device, method of manufacturing same and method of repairing same

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JP5572979B2 (ja) * 2009-03-30 2014-08-20 ソニー株式会社 半導体装置の製造方法
JP5532744B2 (ja) * 2009-08-20 2014-06-25 富士通株式会社 マルチチップモジュール及びマルチチップモジュールの製造方法
AU2011245293B2 (en) * 2010-04-30 2014-06-19 Second Sight Medical Products, Inc. Improved biocompatible bonding method
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WO2018079046A1 (ja) * 2016-10-28 2018-05-03 株式会社村田製作所 電子部品装置
WO2019239909A1 (ja) * 2018-06-13 2019-12-19 国立研究開発法人産業技術総合研究所 電子回路の接続方法及び電子回路
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JP2001217281A (ja) * 2000-01-31 2001-08-10 Matsushita Electric Ind Co Ltd 半導体装置とその製造方法

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