WO2009057654A1 - 部品内蔵配線板、部品内蔵配線板の製造方法 - Google Patents

部品内蔵配線板、部品内蔵配線板の製造方法 Download PDF

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Publication number
WO2009057654A1
WO2009057654A1 PCT/JP2008/069678 JP2008069678W WO2009057654A1 WO 2009057654 A1 WO2009057654 A1 WO 2009057654A1 JP 2008069678 W JP2008069678 W JP 2008069678W WO 2009057654 A1 WO2009057654 A1 WO 2009057654A1
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WO
WIPO (PCT)
Prior art keywords
insulating layer
wiring board
part built
mounting
electric
Prior art date
Application number
PCT/JP2008/069678
Other languages
English (en)
French (fr)
Inventor
Kenji Sasaoka
Original Assignee
Dai Nippon Printing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007284754A external-priority patent/JP2009111307A/ja
Priority claimed from JP2007302883A external-priority patent/JP5176500B2/ja
Priority claimed from JP2007322062A external-priority patent/JP5515210B2/ja
Application filed by Dai Nippon Printing Co., Ltd. filed Critical Dai Nippon Printing Co., Ltd.
Priority to CN200880113984.7A priority Critical patent/CN101843181B/zh
Priority to US12/740,694 priority patent/US8350388B2/en
Priority to KR1020157002082A priority patent/KR101611804B1/ko
Publication of WO2009057654A1 publication Critical patent/WO2009057654A1/ja
Priority to US13/685,917 priority patent/US8987901B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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    • H01—ELECTRIC ELEMENTS
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　第１の絶縁層と、第１の絶縁層に対して積層状に位置する第２の絶縁層と、第２の絶縁層に埋設され、かつ、端子パッドを有する半導体チップと、該端子パッドに電気的接続された、グリッド状配列の表面実装用端子とを備えた半導体素子と、第２の絶縁層にさらに埋設された電気／電子部品と、第１の絶縁層と第２の絶縁層とに挟まれて設けられた、半導体素子用の第１の実装用ランドと電気／電子部品用の第２の実装用ランドとを含む配線パターンと、半導体素子の表面実装用端子と第１の実装用ランドとを電気的に接続する第１の接続部材と、電気／電子部品の端子と第２の実装用ランドとを電気的に接続し、かつ第１の部材と同一の材料である第２の接続部材とを具備する部品内蔵配線板が開示される。
PCT/JP2008/069678 2007-11-01 2008-10-29 部品内蔵配線板、部品内蔵配線板の製造方法 WO2009057654A1 (ja)

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CN200880113984.7A CN101843181B (zh) 2007-11-01 2008-10-29 内置元件电路板
US12/740,694 US8350388B2 (en) 2007-11-01 2008-10-29 Component built-in wiring board and manufacturing method of component built-in wiring board
KR1020157002082A KR101611804B1 (ko) 2007-11-01 2008-10-29 부품 내장 배선판, 부품 내장 배선판의 제조 방법
US13/685,917 US8987901B2 (en) 2007-11-01 2012-11-27 Component built-in wiring board and manufacturing method of component built-in wiring board

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JP2007-284754 2007-11-01
JP2007284754A JP2009111307A (ja) 2007-11-01 2007-11-01 部品内蔵配線板
JP2007302883A JP5176500B2 (ja) 2007-11-22 2007-11-22 部品内蔵配線板、部品内蔵配線板の製造方法
JP2007-302883 2007-11-22
JP2007-322062 2007-12-13
JP2007322062A JP5515210B2 (ja) 2007-12-13 2007-12-13 部品内蔵配線板、部品内蔵配線板の製造方法

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US13/685,917 Division US8987901B2 (en) 2007-11-01 2012-11-27 Component built-in wiring board and manufacturing method of component built-in wiring board

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US8987901B2 (en) 2015-03-24
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