WO2009054236A1 - 平面アンテナおよびその製造方法 - Google Patents
平面アンテナおよびその製造方法 Download PDFInfo
- Publication number
- WO2009054236A1 WO2009054236A1 PCT/JP2008/067747 JP2008067747W WO2009054236A1 WO 2009054236 A1 WO2009054236 A1 WO 2009054236A1 JP 2008067747 W JP2008067747 W JP 2008067747W WO 2009054236 A1 WO2009054236 A1 WO 2009054236A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- planar antenna
- metal layer
- manufacturing
- same
- antenna
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
- H01Q9/285—Planar dipole
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/739,844 US8427374B2 (en) | 2007-10-26 | 2008-09-30 | Planar antenna and method of manufacturing the same |
JP2008547802A JP5428339B2 (ja) | 2007-10-26 | 2008-09-30 | 平面アンテナおよびその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-278531 | 2007-10-26 | ||
JP2007278531 | 2007-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009054236A1 true WO2009054236A1 (ja) | 2009-04-30 |
Family
ID=40579342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/067747 WO2009054236A1 (ja) | 2007-10-26 | 2008-09-30 | 平面アンテナおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8427374B2 (ja) |
JP (1) | JP5428339B2 (ja) |
TW (1) | TWI483462B (ja) |
WO (1) | WO2009054236A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011082848A (ja) * | 2009-10-08 | 2011-04-21 | Toray Ind Inc | 平面アンテナ用金属積層樹脂フィルム |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI394316B (zh) * | 2009-09-28 | 2013-04-21 | Amphenol Taiwan Corp | 天線形成方法 |
TW201249275A (en) * | 2011-05-16 | 2012-12-01 | Jieng Tai Internat Electric Corp | Method for forming component-mounting device with antenna |
FR3049739B1 (fr) * | 2016-03-30 | 2021-03-12 | Linxens Holding | Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce |
WO2020008691A1 (ja) * | 2018-07-06 | 2020-01-09 | 株式会社村田製作所 | 無線通信デバイス |
CN113506974A (zh) * | 2021-05-25 | 2021-10-15 | 厦门凯纳石墨烯技术股份有限公司 | 一种用于电子标签的天线结构、制备方法以及电子标签 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01196845A (ja) * | 1988-02-02 | 1989-08-08 | Seiko Epson Corp | 電子部品の接続法 |
JPH08213426A (ja) * | 1995-02-03 | 1996-08-20 | Fujitsu Ten Ltd | 集積回路の実装方法 |
JP2006509280A (ja) * | 2002-12-05 | 2006-03-16 | ミュールバウアー・アクチエンゲゼルシャフト | スマートカード及びスマートカードの製造方法 |
WO2006103981A1 (ja) * | 2005-03-25 | 2006-10-05 | Toray Industries, Inc. | 平面アンテナおよびその製造方法 |
WO2006109627A1 (ja) * | 2005-04-06 | 2006-10-19 | Toagosei Co., Ltd. | 導電性ペースト及び回路基板並びに回路物品及びその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61145838A (ja) * | 1984-12-20 | 1986-07-03 | Fujitsu Ltd | 半導体素子の接続方法 |
JPH0429338A (ja) * | 1990-05-24 | 1992-01-31 | Nippon Mektron Ltd | Icの搭載用回路基板及びその搭載方法 |
JP3064854B2 (ja) | 1995-02-08 | 2000-07-12 | 松下電器産業株式会社 | 変圧器油温計測装置 |
JPH10135269A (ja) * | 1996-10-31 | 1998-05-22 | Sumitomo Bakelite Co Ltd | ガラス基板半導体素子、高密度実装基板及びその製造方法 |
JP3434704B2 (ja) * | 1998-05-06 | 2003-08-11 | 住友ベークライト株式会社 | 導電性要素配列シート製造装置 |
JP4815891B2 (ja) * | 2005-06-22 | 2011-11-16 | 株式会社日立製作所 | 無線icタグ及びアンテナの製造方法 |
JP2007012965A (ja) * | 2005-07-01 | 2007-01-18 | Nec Tokin Corp | Icチップの実装方法 |
US8786510B2 (en) * | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
-
2008
- 2008-09-30 JP JP2008547802A patent/JP5428339B2/ja not_active Expired - Fee Related
- 2008-09-30 WO PCT/JP2008/067747 patent/WO2009054236A1/ja active Application Filing
- 2008-09-30 US US12/739,844 patent/US8427374B2/en not_active Expired - Fee Related
- 2008-10-24 TW TW097140774A patent/TWI483462B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01196845A (ja) * | 1988-02-02 | 1989-08-08 | Seiko Epson Corp | 電子部品の接続法 |
JPH08213426A (ja) * | 1995-02-03 | 1996-08-20 | Fujitsu Ten Ltd | 集積回路の実装方法 |
JP2006509280A (ja) * | 2002-12-05 | 2006-03-16 | ミュールバウアー・アクチエンゲゼルシャフト | スマートカード及びスマートカードの製造方法 |
WO2006103981A1 (ja) * | 2005-03-25 | 2006-10-05 | Toray Industries, Inc. | 平面アンテナおよびその製造方法 |
WO2006109627A1 (ja) * | 2005-04-06 | 2006-10-19 | Toagosei Co., Ltd. | 導電性ペースト及び回路基板並びに回路物品及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011082848A (ja) * | 2009-10-08 | 2011-04-21 | Toray Ind Inc | 平面アンテナ用金属積層樹脂フィルム |
Also Published As
Publication number | Publication date |
---|---|
TWI483462B (zh) | 2015-05-01 |
TW200926512A (en) | 2009-06-16 |
JP5428339B2 (ja) | 2014-02-26 |
JPWO2009054236A1 (ja) | 2011-03-03 |
US20100245206A1 (en) | 2010-09-30 |
US8427374B2 (en) | 2013-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009057654A1 (ja) | 部品内蔵配線板、部品内蔵配線板の製造方法 | |
WO2011084235A3 (en) | Glass core substrate for integrated circuit devices and methods of making the same | |
WO2009066504A1 (ja) | 部品内蔵モジュール | |
WO2009001621A1 (ja) | 部品内蔵基板の製造方法 | |
IN2012DN03251A (ja) | ||
TWI260056B (en) | Module structure having an embedded chip | |
WO2012074783A3 (en) | Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same | |
DE502008000072D1 (de) | Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu | |
WO2008120755A1 (ja) | 機能素子内蔵回路基板及びその製造方法、並びに電子機器 | |
WO2009002381A3 (en) | Mold compound circuit structure for enhanced electrical and thermal performance | |
WO2007149362A3 (en) | Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements | |
TW200721399A (en) | Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device | |
TW200629662A (en) | Electronic device package and electronic equipment | |
WO2010048653A3 (de) | Verfahren zur integration eines elektronischen bauteils in eine leiterplatte | |
EP1978472A3 (en) | Semiconductor device and method for manufacturing the same | |
WO2009054236A1 (ja) | 平面アンテナおよびその製造方法 | |
WO2006094025A3 (en) | Fabricated adhesive microstructures for making an electrical connection | |
TW200637448A (en) | Method for fabricating conducting bump structures of circuit board | |
EP1724832A3 (en) | Multilayer module formed of modules stacked on top of each other and method of manufacturing the same | |
WO2011112409A3 (en) | Wiring substrate with customization layers | |
TW200731423A (en) | Circuit board with a semiconductor chip embedded therein | |
WO2012148644A3 (en) | Conductive polymer fuse | |
WO2012065041A3 (en) | Rfid devices and methods for manufacturing | |
WO2009158551A3 (en) | Integrated circuit with ribtan interconnects | |
TW200612440A (en) | Polymer-matrix conductive film and method for fabricating the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2008547802 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08842379 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12739844 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08842379 Country of ref document: EP Kind code of ref document: A1 |