ATE427646T1 - Gedruckte leiterplatte - Google Patents
Gedruckte leiterplatteInfo
- Publication number
- ATE427646T1 ATE427646T1 AT06253437T AT06253437T ATE427646T1 AT E427646 T1 ATE427646 T1 AT E427646T1 AT 06253437 T AT06253437 T AT 06253437T AT 06253437 T AT06253437 T AT 06253437T AT E427646 T1 ATE427646 T1 AT E427646T1
- Authority
- AT
- Austria
- Prior art keywords
- metal substrates
- insulating layer
- outer lead
- base insulating
- circuit board
- Prior art date
Links
- 239000002184 metal Substances 0.000 abstract 6
- 229910052751 metal Inorganic materials 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005194567A JP4619214B2 (ja) | 2005-07-04 | 2005-07-04 | 配線回路基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE427646T1 true ATE427646T1 (de) | 2009-04-15 |
Family
ID=37038310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06253437T ATE427646T1 (de) | 2005-07-04 | 2006-06-30 | Gedruckte leiterplatte |
Country Status (8)
Country | Link |
---|---|
US (1) | US7551452B2 (de) |
EP (1) | EP1742521B1 (de) |
JP (1) | JP4619214B2 (de) |
KR (1) | KR101227326B1 (de) |
CN (1) | CN100561726C (de) |
AT (1) | ATE427646T1 (de) |
DE (1) | DE602006005993D1 (de) |
TW (1) | TWI397965B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007088631A1 (ja) * | 2006-02-03 | 2007-08-09 | Matsushita Electric Industrial Co., Ltd. | 回路基板の接続部および回路基板の接続構造 |
JP5010925B2 (ja) * | 2007-01-12 | 2012-08-29 | 株式会社ジャパンディスプレイイースト | 液晶表示モジュール |
JP5025399B2 (ja) * | 2007-09-27 | 2012-09-12 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
JP5095460B2 (ja) * | 2008-01-17 | 2012-12-12 | シャープ株式会社 | 半導体装置および表示装置 |
JP5184115B2 (ja) * | 2008-01-31 | 2013-04-17 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP5139102B2 (ja) | 2008-02-05 | 2013-02-06 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
JP4981744B2 (ja) * | 2008-05-09 | 2012-07-25 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
CA2726173C (en) * | 2008-05-29 | 2016-02-23 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board |
JP2010186789A (ja) * | 2009-02-10 | 2010-08-26 | Hitachi Ltd | 絶縁回路基板、インバータ装置、及びパワー半導体装置 |
JP2017135322A (ja) | 2016-01-29 | 2017-08-03 | 株式会社東芝 | 電子機器及び半導体記憶装置 |
JP2019062056A (ja) * | 2017-09-26 | 2019-04-18 | ブラザー工業株式会社 | 電極接続方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3657807A (en) * | 1970-06-12 | 1972-04-25 | North American Rockwell | Process for forming interstitial conductors between plated memory wires |
JPS6242482A (ja) * | 1985-08-19 | 1987-02-24 | 松下電器産業株式会社 | フレキシブル配線板 |
US4814855A (en) * | 1986-04-29 | 1989-03-21 | International Business Machines Corporation | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape |
EP0545328B1 (de) * | 1991-11-29 | 1997-03-19 | Hitachi Chemical Co., Ltd. | Herstellungsverfahren für eine gedruckte Schaltung |
US5262722A (en) * | 1992-04-03 | 1993-11-16 | General Electric Company | Apparatus for near surface nondestructive eddy current scanning of a conductive part using a multi-layer eddy current probe array |
JPH0888448A (ja) * | 1994-09-16 | 1996-04-02 | Fuji Photo Optical Co Ltd | フレキシブルプリント基板 |
WO1997001437A1 (en) * | 1995-06-28 | 1997-01-16 | Fraivillig Materials Company | Circuit board laminates and method of making |
JPH09245943A (ja) * | 1996-03-06 | 1997-09-19 | Nippon Tungsten Co Ltd | 発熱体の絶縁構造 |
US6055722A (en) * | 1998-05-20 | 2000-05-02 | Trw Inc. | Stripline flexible cable to printed circuit board attachment system |
US6317248B1 (en) * | 1998-07-02 | 2001-11-13 | Donnelly Corporation | Busbars for electrically powered cells |
JP2000114413A (ja) * | 1998-09-29 | 2000-04-21 | Sony Corp | 半導体装置、その製造方法および部品の実装方法 |
US6480359B1 (en) * | 2000-05-09 | 2002-11-12 | 3M Innovative Properties Company | Hard disk drive suspension with integral flexible circuit |
US20040247921A1 (en) * | 2000-07-18 | 2004-12-09 | Dodsworth Robert S. | Etched dielectric film in hard disk drives |
JP3866058B2 (ja) * | 2001-07-05 | 2007-01-10 | シャープ株式会社 | 半導体装置、配線基板及びテープキャリア |
JP2003068804A (ja) * | 2001-08-22 | 2003-03-07 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用基板 |
JP2003198070A (ja) * | 2001-12-26 | 2003-07-11 | Iwaki Electronics Corp | フレキシブルプリント配線板 |
JP3694286B2 (ja) * | 2002-10-08 | 2005-09-14 | 日東電工株式会社 | Tab用テープキャリア |
JP3638276B2 (ja) * | 2002-12-24 | 2005-04-13 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープ |
JP2004281941A (ja) * | 2003-03-18 | 2004-10-07 | Fuji Photo Film Co Ltd | 電磁波シールド材を有する画像表示装置及びその製造方法 |
JP3829940B2 (ja) * | 2003-11-14 | 2006-10-04 | セイコーエプソン株式会社 | 半導体装置の製造方法及び製造装置 |
JP2006080440A (ja) * | 2004-09-13 | 2006-03-23 | Casio Micronics Co Ltd | 回路基板及び半導体装置 |
JP4407471B2 (ja) * | 2004-10-29 | 2010-02-03 | パナソニック株式会社 | フレキシブル配線基板とそれを用いた電子機器およびその製造方法 |
-
2005
- 2005-07-04 JP JP2005194567A patent/JP4619214B2/ja active Active
-
2006
- 2006-06-21 TW TW095122311A patent/TWI397965B/zh active
- 2006-06-29 US US11/427,448 patent/US7551452B2/en active Active
- 2006-06-30 EP EP06253437A patent/EP1742521B1/de not_active Not-in-force
- 2006-06-30 DE DE602006005993T patent/DE602006005993D1/de active Active
- 2006-06-30 AT AT06253437T patent/ATE427646T1/de not_active IP Right Cessation
- 2006-07-03 KR KR1020060061767A patent/KR101227326B1/ko active IP Right Grant
- 2006-07-04 CN CNB2006100957649A patent/CN100561726C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR101227326B1 (ko) | 2013-01-28 |
TW200705589A (en) | 2007-02-01 |
EP1742521B1 (de) | 2009-04-01 |
CN100561726C (zh) | 2009-11-18 |
CN1893054A (zh) | 2007-01-10 |
TWI397965B (zh) | 2013-06-01 |
KR20070004435A (ko) | 2007-01-09 |
US7551452B2 (en) | 2009-06-23 |
US20070000689A1 (en) | 2007-01-04 |
EP1742521A1 (de) | 2007-01-10 |
JP2007013018A (ja) | 2007-01-18 |
DE602006005993D1 (de) | 2009-05-14 |
JP4619214B2 (ja) | 2011-01-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |