TW200638822A - Printed circuit board arrangement - Google Patents

Printed circuit board arrangement

Info

Publication number
TW200638822A
TW200638822A TW094144919A TW94144919A TW200638822A TW 200638822 A TW200638822 A TW 200638822A TW 094144919 A TW094144919 A TW 094144919A TW 94144919 A TW94144919 A TW 94144919A TW 200638822 A TW200638822 A TW 200638822A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
conductor
board arrangement
buried
Prior art date
Application number
TW094144919A
Other languages
Chinese (zh)
Inventor
Samber Marc Andre De
Os Koen Van
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200638822A publication Critical patent/TW200638822A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Abstract

The present invention relates to printed circuit board arrangement with a multi-layer substrate(1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).
TW094144919A 2004-12-21 2005-12-16 Printed circuit board arrangement TW200638822A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04106756 2004-12-21

Publications (1)

Publication Number Publication Date
TW200638822A true TW200638822A (en) 2006-11-01

Family

ID=36588696

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094144919A TW200638822A (en) 2004-12-21 2005-12-16 Printed circuit board arrangement

Country Status (4)

Country Link
JP (1) JP2008524841A (en)
CN (1) CN101088310A (en)
TW (1) TW200638822A (en)
WO (1) WO2006067689A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669039B (en) * 2014-09-08 2019-08-11 德商羅伯特博斯奇股份有限公司 Process for solder-free electrical press-in contacting of electrically conducting press-in pins in circuit boards

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011084326A1 (en) * 2011-10-12 2013-04-18 Osram Opto Semiconductors Gmbh Flexible printed circuit board for electrical contacting and mechanical fastening of a lamp in a luminaire
CN109156081A (en) * 2016-05-30 2019-01-04 三菱电机株式会社 The manufacturing method of electronic module and electronic module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107162A (en) * 1995-10-13 1997-04-22 Murata Mfg Co Ltd Printed circuit board
US6045240A (en) * 1996-06-27 2000-04-04 Relume Corporation LED lamp assembly with means to conduct heat away from the LEDS
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6212076B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Enhanced heat-dissipating printed circuit board package
JP3573034B2 (en) * 1999-11-17 2004-10-06 日本電気株式会社 Multilayer printed wiring board and its heat dissipation structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI669039B (en) * 2014-09-08 2019-08-11 德商羅伯特博斯奇股份有限公司 Process for solder-free electrical press-in contacting of electrically conducting press-in pins in circuit boards

Also Published As

Publication number Publication date
WO2006067689A2 (en) 2006-06-29
JP2008524841A (en) 2008-07-10
CN101088310A (en) 2007-12-12
WO2006067689A3 (en) 2006-09-21

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