WO2004038798A3 - Stacked electronic structures including offset substrates - Google Patents
Stacked electronic structures including offset substrates Download PDFInfo
- Publication number
- WO2004038798A3 WO2004038798A3 PCT/US2003/033211 US0333211W WO2004038798A3 WO 2004038798 A3 WO2004038798 A3 WO 2004038798A3 US 0333211 W US0333211 W US 0333211W WO 2004038798 A3 WO2004038798 A3 WO 2004038798A3
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- WIPO (PCT)
- Prior art keywords
- electronic
- substrates
- substrate
- electronic substrate
- structures including
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003301632A AU2003301632A1 (en) | 2002-10-22 | 2003-10-21 | Stacked electronic structures including offset substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42042202P | 2002-10-22 | 2002-10-22 | |
US60/420,422 | 2002-10-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004038798A2 WO2004038798A2 (en) | 2004-05-06 |
WO2004038798A3 true WO2004038798A3 (en) | 2004-07-29 |
Family
ID=32176567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/033211 WO2004038798A2 (en) | 2002-10-22 | 2003-10-21 | Stacked electronic structures including offset substrates |
Country Status (3)
Country | Link |
---|---|
US (1) | US7495326B2 (en) |
AU (1) | AU2003301632A1 (en) |
WO (1) | WO2004038798A2 (en) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4110992B2 (en) * | 2003-02-07 | 2008-07-02 | セイコーエプソン株式会社 | Semiconductor device, electronic device, electronic apparatus, semiconductor device manufacturing method, and electronic device manufacturing method |
EP1471778A1 (en) * | 2003-04-24 | 2004-10-27 | Infineon Technologies AG | Memory module having space-saving arrangement of memory chips and memory chip therefor |
TW200511531A (en) * | 2003-09-08 | 2005-03-16 | Advanced Semiconductor Eng | Package stack module |
KR100832845B1 (en) * | 2006-10-03 | 2008-05-28 | 삼성전자주식회사 | Semiconductor Package Structure And Method Of Fabricating The Same |
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Also Published As
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---|---|
WO2004038798A2 (en) | 2004-05-06 |
US7495326B2 (en) | 2009-02-24 |
US20040124520A1 (en) | 2004-07-01 |
AU2003301632A1 (en) | 2004-05-13 |
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