ATE517434T1 - Elektronische vorrichtung mit einer bodenplatte - Google Patents

Elektronische vorrichtung mit einer bodenplatte

Info

Publication number
ATE517434T1
ATE517434T1 AT07121276T AT07121276T ATE517434T1 AT E517434 T1 ATE517434 T1 AT E517434T1 AT 07121276 T AT07121276 T AT 07121276T AT 07121276 T AT07121276 T AT 07121276T AT E517434 T1 ATE517434 T1 AT E517434T1
Authority
AT
Austria
Prior art keywords
base plate
spacer elements
cooling plate
electronic device
plate
Prior art date
Application number
AT07121276T
Other languages
English (en)
Inventor
Makan Chen
Daniel Schneider
Raymond Zehringer
Original Assignee
Abb Technology Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Technology Ag filed Critical Abb Technology Ag
Application granted granted Critical
Publication of ATE517434T1 publication Critical patent/ATE517434T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT07121276T 2006-12-22 2007-11-22 Elektronische vorrichtung mit einer bodenplatte ATE517434T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06026658A EP1936683A1 (de) 2006-12-22 2006-12-22 Bodenplatte für eine Wärmesenke und elektronische Vorrichtung mit einer Bodenplatte

Publications (1)

Publication Number Publication Date
ATE517434T1 true ATE517434T1 (de) 2011-08-15

Family

ID=37964618

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07121276T ATE517434T1 (de) 2006-12-22 2007-11-22 Elektronische vorrichtung mit einer bodenplatte

Country Status (5)

Country Link
US (1) US8050054B2 (de)
EP (1) EP1936683A1 (de)
CN (1) CN101221933B (de)
AT (1) ATE517434T1 (de)
ES (1) ES2369422T3 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
US20120026692A1 (en) 2010-07-28 2012-02-02 Wolverine Tube, Inc. Electronics substrate with enhanced direct bonded metal
US9681580B2 (en) 2010-07-28 2017-06-13 Wolverine Tube, Inc. Method of producing an enhanced base plate
EP2447990B1 (de) * 2010-11-02 2020-12-23 ABB Power Grids Switzerland AG Grundplatte
CN102394235A (zh) * 2011-11-15 2012-03-28 株洲南车时代电气股份有限公司 一种绝缘栅双极晶体管模块及其制作方法
US8938880B2 (en) 2012-02-20 2015-01-27 Wolverine Tube, Inc. Method of manufacturing an integrated cold plate for electronics
JP6754769B2 (ja) * 2016-03-24 2020-09-16 パナソニックセミコンダクターソリューションズ株式会社 半導体モジュールおよびその製造方法
JP2018195717A (ja) * 2017-05-17 2018-12-06 富士電機株式会社 半導体モジュール、半導体モジュールのベース板および半導体装置の製造方法
US11834987B2 (en) * 2021-03-16 2023-12-05 Rolls-Royce Corporation Electrical current converter/rectifier with integrated features

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4632294A (en) * 1984-12-20 1986-12-30 International Business Machines Corporation Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
US5201451A (en) * 1987-03-11 1993-04-13 International Business Machines Corp. Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US4759491A (en) * 1987-05-18 1988-07-26 American Telephone And Telegraph Company Method and apparatus for applying bonding material to component leads
US5505248A (en) * 1990-05-09 1996-04-09 Lanxide Technology Company, Lp Barrier materials for making metal matrix composites
JPH05507123A (ja) * 1990-05-09 1993-10-14 ランキサイド　テクノロジー　カンパニー，リミティド　パートナーシップ 金属マトリックス複合材を得るためのバリヤ材料
US5361824A (en) * 1990-05-10 1994-11-08 Lanxide Technology Company, Lp Method for making internal shapes in a metal matrix composite body
US5200365A (en) * 1990-05-14 1993-04-06 Vlsi Technology, Inc. System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink
JPH07211832A (ja) * 1994-01-03 1995-08-11 Motorola Inc 電力放散装置とその製造方法
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
KR0156622B1 (ko) * 1995-04-27 1998-10-15 문정환 반도체 패키지,리드프레임 및 제조방법
JPH09321187A (ja) * 1996-05-27 1997-12-12 Mitsubishi Electric Corp 混成集積回路の製造方法およびその構造
JPH1060570A (ja) * 1996-08-23 1998-03-03 Injietsukusu:Kk 焼結体およびその製造方法
JPH11330283A (ja) * 1998-05-15 1999-11-30 Toshiba Corp 半導体モジュール及び大型半導体モジュール
JP2000082774A (ja) * 1998-06-30 2000-03-21 Sumitomo Electric Ind Ltd パワ―モジュ―ル用基板およびその基板を用いたパワ―モジュ―ル
US6807059B1 (en) * 1998-12-28 2004-10-19 James L. Dale Stud welded pin fin heat sink
US6723279B1 (en) * 1999-03-15 2004-04-20 Materials And Electrochemical Research (Mer) Corporation Golf club and other structures, and novel methods for making such structures
US6462410B1 (en) * 2000-08-17 2002-10-08 Sun Microsystems Inc Integrated circuit component temperature gradient reducer
JP2002203942A (ja) * 2000-12-28 2002-07-19 Fuji Electric Co Ltd パワー半導体モジュール
WO2002067324A1 (en) * 2001-02-22 2002-08-29 Ngk Insulators, Ltd. Member for electronic circuit, method for manufacturing the member, and electronic part
US7069645B2 (en) * 2001-03-29 2006-07-04 Ngk Insulators, Ltd. Method for producing a circuit board
US6874910B2 (en) * 2001-04-12 2005-04-05 Matsushita Electric Works, Ltd. Light source device using LED, and method of producing same
US6753507B2 (en) * 2001-04-27 2004-06-22 Kyocera Corporation Wafer heating apparatus
JP2003068919A (ja) * 2001-08-27 2003-03-07 Nec Yamagata Ltd 半導体装置
US6622786B1 (en) * 2002-04-17 2003-09-23 International Business Machines Corporation Heat sink structure with pyramidic and base-plate cut-outs
US6817405B2 (en) * 2002-06-03 2004-11-16 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
CN1212555C (zh) * 2002-07-08 2005-07-27 英业达股份有限公司 散热器
JP4262453B2 (ja) * 2002-07-15 2009-05-13 三菱電機株式会社 電力半導体装置
KR100902766B1 (ko) * 2002-09-27 2009-06-15 페어차일드코리아반도체 주식회사 절연성 세라믹 히트 싱크를 갖는 디스크리트 패키지
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
JP3971296B2 (ja) * 2002-12-27 2007-09-05 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合基板およびその製造方法
US20040134976A1 (en) 2003-01-14 2004-07-15 Frank Keyser Method and system for solder connecting electrical devices
JP2004228352A (ja) * 2003-01-23 2004-08-12 Mitsubishi Electric Corp 電力半導体装置
WO2004097324A1 (en) * 2003-04-28 2004-11-11 Showa Denko K.K. Side plate for heat exchanger, heat exchanger and process for fabricating the heat exchanger
US6903271B2 (en) * 2003-09-30 2005-06-07 Intel Corporation Electronic assembly with thermally separated support
WO2005088711A1 (ja) * 2004-03-16 2005-09-22 Matsushita Electric Industrial Co., Ltd. ドライバモジュール構造
JP4941724B2 (ja) * 2004-06-24 2012-05-30 株式会社安川電機 モータ制御装置
JP4617209B2 (ja) * 2005-07-07 2011-01-19 株式会社豊田自動織機 放熱装置
JP4711792B2 (ja) * 2005-09-26 2011-06-29 三洋電機株式会社 回路装置
US20070121299A1 (en) * 2005-11-30 2007-05-31 International Business Machines Corporation Heat transfer apparatus, cooled electronic module and methods of fabrication thereof employing thermally conductive composite fins

Also Published As

Publication number Publication date
US8050054B2 (en) 2011-11-01
ES2369422T3 (es) 2011-11-30
EP1936683A1 (de) 2008-06-25
CN101221933A (zh) 2008-07-16
US20080291640A1 (en) 2008-11-27
CN101221933B (zh) 2012-07-11

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