TW200833210A - Process for making substrates for chips of high power - Google Patents
Process for making substrates for chips of high powerInfo
- Publication number
- TW200833210A TW200833210A TW96102424A TW96102424A TW200833210A TW 200833210 A TW200833210 A TW 200833210A TW 96102424 A TW96102424 A TW 96102424A TW 96102424 A TW96102424 A TW 96102424A TW 200833210 A TW200833210 A TW 200833210A
- Authority
- TW
- Taiwan
- Prior art keywords
- high thermal
- ceramic layer
- chips
- high power
- deposition
- Prior art date
Links
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
This disclosure relates to the deposition of a thin ceramic layer of high thermal conductivity on a metallic heat spreading medium of high thermal conductivity by thermal spraying, and, subsequently, the development of electrical conducting patterns on the surface of the ceramic layer. Such deposition of thin ceramic layer and development of electrical conducting patterns can be repeated on the substrate, or a mother board of multiple layer can be soldered to the substrate, in order to form single-layered or multi-layered substrates of high thermal dissipation capability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96102424A TW200833210A (en) | 2007-01-23 | 2007-01-23 | Process for making substrates for chips of high power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96102424A TW200833210A (en) | 2007-01-23 | 2007-01-23 | Process for making substrates for chips of high power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200833210A true TW200833210A (en) | 2008-08-01 |
Family
ID=44819054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96102424A TW200833210A (en) | 2007-01-23 | 2007-01-23 | Process for making substrates for chips of high power |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200833210A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117335A (en) * | 2011-11-16 | 2013-05-22 | 和淞科技股份有限公司 | Preparation method of compound type metal ceramic substrate provided with circuit and structure thereof |
| CN103114261A (en) * | 2011-11-16 | 2013-05-22 | 和淞科技股份有限公司 | Preparation method and structure of composite metal ceramic substrate |
| TWI831247B (en) * | 2022-06-16 | 2024-02-01 | 先豐通訊股份有限公司 | Power module and method for manufacturing the same |
-
2007
- 2007-01-23 TW TW96102424A patent/TW200833210A/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117335A (en) * | 2011-11-16 | 2013-05-22 | 和淞科技股份有限公司 | Preparation method of compound type metal ceramic substrate provided with circuit and structure thereof |
| CN103114261A (en) * | 2011-11-16 | 2013-05-22 | 和淞科技股份有限公司 | Preparation method and structure of composite metal ceramic substrate |
| TWI831247B (en) * | 2022-06-16 | 2024-02-01 | 先豐通訊股份有限公司 | Power module and method for manufacturing the same |
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