CN103114261A - Preparation method and structure of composite metal ceramic substrate - Google Patents
Preparation method and structure of composite metal ceramic substrate Download PDFInfo
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- CN103114261A CN103114261A CN201110375148XA CN201110375148A CN103114261A CN 103114261 A CN103114261 A CN 103114261A CN 201110375148X A CN201110375148X A CN 201110375148XA CN 201110375148 A CN201110375148 A CN 201110375148A CN 103114261 A CN103114261 A CN 103114261A
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Abstract
The invention relates to a preparation method and a structure of a composite metal ceramic substrate. The preparation method comprises the steps of (a) providing a metal substrate; (b) carrying out pretreatment on the metal substrate, so as to remove various objects and greasy dirt on the surface of the metal substrate; (c) spraying and sputtering ceramic materials to the surface of the metal substrate; and (d) carrying out drying treatment on the metal substrate, thereby obtaining the composite metal ceramic substrate with an excellent heat dissipation effect by utilizing the steps.
Description
Technical field
The present invention relates to a kind of method for making and structure thereof of composite metal ceramic substrate, especially be suitable for being applied in the manufacture method of circuit substrate.
Background technology
Manufacturing technology by the LED lamp reaches its maturity in recent years, and LED has advantages of that current consumption is low, the heating degree is low, long service life, startup speed are fast, rich color and brightness good, simultaneously and can save in a large number the power consumption of lighting.Therefore LED replaces the main flow that conventional lamp becomes the future market gradually.
Though LED has above-mentioned various advantages, but when LED is used in lighting use, mainly to form the LED light fixture by a plurality of LED lamp modules, provide required illumination by the Modular LED light fixture, and the LED light fixture also can produce heat energy luminous when illumination is provided, if the effectively dissipation of heat energy that produces, getting off for a long time to affect the work-ing life of LED light fixture.In existing LED heat dissipation technology, be all generally to dispel the heat with ceramic heat sink or with aluminium fin; The radiating mode of aluminium fin is the radiating fin of aluminum to be installed in the surface of LED module, when LED module is luminous, by the radiating fin of aluminum, the heat that LED module produces is given dissipation.Although the heat that such radiating mode can produce LED module is distributed, the aluminum radiating fin is except can dispelling the heat and have the function of conduction, therefore must carry out insulation between LED module and radiating fin, occurs with the situation that prevents from shocking by electricity.
And traditional ceramic heat sink is printed on ceramic heat sink with elargol with circuit, and the long-time sintering of high temperature more than spending with 700 after printing is completed, and circuit is solidified in ceramic heat sink.Yet such production method is consuming time, manufacturing processed is complicated, and the weight of the ceramic heat sink of making itself is heavier.
Hence one can see that, problem and deficiency that existing LED scatterer is derived, real non-one kindhearted design and demand urgently being improved.
Summary of the invention
Main purpose of the present invention is providing a kind of method for making of making the composite metal ceramic substrate of the substrate with good heat-radiating effect.
Secondary objective of the present invention is providing a kind of structure that is coated with the composite metal ceramic substrate of heat dissipating layer in metallic substrate surfaces.
For achieving the above object, the present invention includes the following step: a, provide metal substrate; B, metal substrate is carried out pre-treatment, to remove various materials and the greasy dirt of metallic substrate surfaces; C, stupalith is sprayed sputter to metallic substrate surfaces; And d, metal substrate is carried out drying treatment; By this, by above-mentioned steps with the composite metal ceramic substrate person of an excellent heat radiation performance.The method for making of composite metal ceramic substrate as above, step b pre-treatment comprises degreasing, scrubbing or eliminates rust any.
The method for making of composite metal ceramic substrate as above, step c is wherein any mode of using plasma spray, spraying or plasma oxidation sintering.
The method for making of composite metal ceramic substrate as above, step c utilizes different voltage powers, size of current, pulse wave frequency size and stupalith is sprayed sputter to metallic substrate surfaces.
The method for making of composite metal ceramic substrate as above, step c also comprises the variation of finishing electric power, frequency, to control the ceramic thickness of metallic substrate surfaces.
The method for making of composite metal ceramic substrate as above, the metal substrate thickness of step a is more than 6mm, the ceramic thickness of step c is below 2mm.
The method for making of composite metal ceramic substrate as above also comprises step e after steps d, this step e is the measurement that Surface Structures carries out hardness, scratch, impedance, thermal resistance.
The method for making of composite metal ceramic substrate as above, step e also comprises step f afterwards, this step f detects for crystal plane being carried out EMC.
The method for making of composite metal ceramic substrate as above, the EMC of step f crystal plane detects and comprises: sticking power detects, rough degree detects, slight crack detects and color detection.
For achieving the above object, composite metal ceramic substrate structure of the present invention comprises: a metal substrate; And a ceramic coating layer, metal substrate is enveloped fully.
Composite metal ceramic substrate structure as above, metal substrate are aluminium alloy base plate.
The method for making of composite metal ceramic substrate as above, the thickness of metal substrate are more than 6mm, and the thickness of ceramic coating layer is below 2mm.
Composite metal ceramic substrate structure as above, boring a hole wears for the power supply source line.
The present invention compared to the outstanding advantage of prior art is:
1, by plasma treatment, make the surface of metal substrate form the stupalith coating layer, make substrate become the composite metal ceramic substrate.
2, by the formation of ceramic coating layer on metal substrate, the rate of heat dissipation of metal substrate is attained a yet higher goal.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 manufacturing process skeleton diagram of the present invention;
The longitudinal sectional view of Fig. 2 metal substrate of the present invention;
The longitudinal sectional view of Fig. 3 embodiment of the present invention;
The stereo appearance figure of Fig. 4 embodiment of the present invention;
The use schematic diagram of Fig. 5 embodiment of the present invention.
Wherein, Reference numeral
Step a～e
1, composite metal ceramic substrate
11, base belongs to substrate
111, perforation
12, ceramic coating layer
But 121 solderability copper glue
13, supply lead
14, supply lead
15, led chip
Embodiment
The invention will be further described with specific embodiment for the below:
Please refer to the drawing 1, the method for making of composite metal ceramic substrate of the present invention comprises the following step:
A, provide metal substrate, metal substrate to have at least one perforation;
B, metal substrate is carried out pre-treatment, to remove various materials (comprising organic substance) and the greasy dirt of metallic substrate surfaces; Pre-treatment is comprise degreasing, scrubbing or eliminate rust any;
C, utilize different voltage powers, size of current, pulse wave frequency size, stupalith is sprayed sputter to metallic substrate surfaces; And the variation of finishing electric power, frequency, control the ceramic thickness of metallic substrate surfaces, so that the pottery of metallic substrate surfaces is evenly smooth;
D, metal substrate is carried out drying treatment;
E, Surface Structures carry out the measurement of hardness, scratch, impedance, thermal resistance; And
F, crystal plane is carried out EMC detect, it is to comprise that sticking power detects, rough degree detects, slight crack detects and color detection that EMC detects.
Please refer to the drawing 2～Fig. 4, be preferred embodiment of the present invention, mainly to be provided with a metal substrate 11, metal substrate 11 is an aluminium alloy base plate, has at least one perforation 111 on it, the perforation 111 of the present embodiment is provided with one, one ceramic coating layer 12 is to utilize wherein a kind of mode of plasma spray, spraying or plasma oxidation sintering and the top layer that is attached to metal substrate 11, and the thickness of metal substrate 11 is roughly more than 6mm, be attached to ceramic coating layer 12 thickness on metal substrate 11 roughly below 2mm, to form a composite metal ceramic substrate 1.
Again, please join again Fig. 5, but be to be provided with many solderability copper glue 121 on the ceramic coating layer 12 of composite metal ceramic substrate 1, but by solderability copper glue 121 so that in conjunction with electronic component, for example the led chip 15, moreover, and 111 make supply lead 13,14 wear being incorporated into composite metal ceramic substrate 1 by boring a hole, with complete one connect power supply after, with many led chip 15 of composite metal ceramic substrate 1 electrically connect person that sends the light.
Certainly; the present invention also can have other various embodiments; in the situation that do not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (10)
1. the method for making of a composite metal ceramic substrate, is characterized in that, comprises the following steps:
A, provide metal substrate;
B, metal substrate is carried out pre-treatment, to remove various materials and the greasy dirt of metallic substrate surfaces;
C, stupalith is sprayed sputter to metallic substrate surfaces, and metal substrate is enveloped fully; And
D, metal substrate is carried out drying treatment.
2. the method for making of composite metal ceramic substrate according to claim 1, is characterized in that, step a metal substrate has at least one perforation, and step b pre-treatment comprises degreasing, scrubbing or eliminates rust any.
3. the method for making of composite metal ceramic substrate according to claim 1, it is characterized in that, step c is wherein any mode of using plasma spray, spraying or plasma oxidation sintering, and utilizes different voltage powers, size of current, pulse wave frequency size and stupalith is sprayed sputter to metallic substrate surfaces.
4. the method for making of composite metal ceramic substrate according to claim 1, is characterized in that, step c also comprises the variation of finishing electric power, frequency, to control the ceramic thickness of metallic substrate surfaces.
5. the method for making of composite metal ceramic substrate according to claim 1, is characterized in that, also comprises step e after steps d, and this step e is the measurement that Surface Structures carries out hardness, scratch, impedance, thermal resistance.
6. the method for making of composite metal ceramic substrate according to claim 5, is characterized in that, also comprises step f after step e, and this step f detects for crystal plane being carried out EMC.
7. the method for making of composite metal ceramic substrate according to claim 1, is characterized in that, the EMC of step f crystal plane detects and comprises: sticking power detects, rough degree detects, slight crack detects and color detection.
8. a composite metal ceramic substrate structure, is characterized in that, comprising:
One metal substrate; And
One ceramic coating layer envelopes metal substrate fully.
9. composite metal ceramic substrate structure according to claim 8, is characterized in that, metal substrate has at least one perforation, and this metal substrate is aluminium alloy base plate.
10. composite metal ceramic substrate structure according to claim 8, is characterized in that, metal substrate thickness is more than 6mm, and the thickness of ceramic coating layer is below 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110375148XA CN103114261A (en) | 2011-11-16 | 2011-11-16 | Preparation method and structure of composite metal ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110375148XA CN103114261A (en) | 2011-11-16 | 2011-11-16 | Preparation method and structure of composite metal ceramic substrate |
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| Publication Number | Publication Date |
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| CN103114261A true CN103114261A (en) | 2013-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110375148XA Pending CN103114261A (en) | 2011-11-16 | 2011-11-16 | Preparation method and structure of composite metal ceramic substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585626A (en) * | 2017-09-29 | 2019-04-05 | 李宜臻 | The compound material-strap structure of cermet and its manufacturing method and its light emitting diode |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101233612A (en) * | 2005-06-06 | 2008-07-30 | 同和电子科技有限公司 | Metal-ceramic composite substrate and method for manufacturing same |
| TW200833210A (en) * | 2007-01-23 | 2008-08-01 | Tysun Inc | Process for making substrates for chips of high power |
| TWM364272U (en) * | 2009-03-16 | 2009-09-01 | Lead Data Inc | Heat dissipation substrate having superior heat dissipation capability |
| TWM373097U (en) * | 2009-08-20 | 2010-01-21 | guo-zhen Zhang | Dissipation plate |
-
2011
- 2011-11-16 CN CN201110375148XA patent/CN103114261A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101233612A (en) * | 2005-06-06 | 2008-07-30 | 同和电子科技有限公司 | Metal-ceramic composite substrate and method for manufacturing same |
| TW200833210A (en) * | 2007-01-23 | 2008-08-01 | Tysun Inc | Process for making substrates for chips of high power |
| TWM364272U (en) * | 2009-03-16 | 2009-09-01 | Lead Data Inc | Heat dissipation substrate having superior heat dissipation capability |
| TWM373097U (en) * | 2009-08-20 | 2010-01-21 | guo-zhen Zhang | Dissipation plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585626A (en) * | 2017-09-29 | 2019-04-05 | 李宜臻 | The compound material-strap structure of cermet and its manufacturing method and its light emitting diode |
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Application publication date: 20130522 |