WO2009028612A1 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
WO2009028612A1
WO2009028612A1 PCT/JP2008/065419 JP2008065419W WO2009028612A1 WO 2009028612 A1 WO2009028612 A1 WO 2009028612A1 JP 2008065419 W JP2008065419 W JP 2008065419W WO 2009028612 A1 WO2009028612 A1 WO 2009028612A1
Authority
WO
WIPO (PCT)
Prior art keywords
led chips
placing
light emitting
emitting device
solder
Prior art date
Application number
PCT/JP2008/065419
Other languages
English (en)
French (fr)
Inventor
Takanori Aketa
Youji Urano
Tomonori Suzuki
Original Assignee
Panasonic Electric Works Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007221865A external-priority patent/JP4915670B2/ja
Priority claimed from JP2007221866A external-priority patent/JP4844506B2/ja
Application filed by Panasonic Electric Works Co., Ltd. filed Critical Panasonic Electric Works Co., Ltd.
Priority to EP08828205.8A priority Critical patent/EP2197045A4/en
Priority to US12/733,402 priority patent/US8664674B2/en
Publication of WO2009028612A1 publication Critical patent/WO2009028612A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

ＬＥＤチップと絶縁基材に設けられた金属層との接合部にボイドが発生するのを抑制し、隣り合うＬＥＤチップ間の間隔を狭くしながらＬＥＤチップ間の短絡を防止できる発光装置を提供する。発光装置は、複数個のＬＥＤチップ１０と、絶縁性材料により形成され複数個のＬＥＤチップ１０を搭載する１個の絶縁基材（サブマウント部材）３０とを備える。絶縁基材３０には、複数のＬＥＤチップ１０をそれぞれ搭載する載置台が設けられ、各載置台にはＬＥＤチップ１０が半田により接合される金属層３１が形成される。隣り合う載置台間に溝３４が形成され、載置台の側面には載置台に比べて半田濡れ性が高い材料からなる半田誘導部３２が形成されている。
PCT/JP2008/065419 2007-08-28 2008-08-28 発光装置 WO2009028612A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP08828205.8A EP2197045A4 (en) 2007-08-28 2008-08-28 DEVICE EMITTING LIGHT
US12/733,402 US8664674B2 (en) 2007-08-28 2008-08-28 Light emitting diode device preventing short circuiting between adjacent light emitting diode chips

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-221866 2007-08-28
JP2007-221865 2007-08-28
JP2007221865A JP4915670B2 (ja) 2007-08-28 2007-08-28 発光装置
JP2007221866A JP4844506B2 (ja) 2007-08-28 2007-08-28 発光装置

Publications (1)

Publication Number Publication Date
WO2009028612A1 true WO2009028612A1 (ja) 2009-03-05

Family

ID=40387326

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065419 WO2009028612A1 (ja) 2007-08-28 2008-08-28 発光装置

Country Status (3)

Country Link
US (1) US8664674B2 (ja)
EP (1) EP2197045A4 (ja)
WO (1) WO2009028612A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102713430A (zh) * 2010-01-19 2012-10-03 松下电器产业株式会社 照明装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008057140A1 (de) * 2008-11-13 2010-05-20 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP6107060B2 (ja) * 2011-12-26 2017-04-05 日亜化学工業株式会社 発光装置の製造方法
JP2013206925A (ja) * 2012-03-27 2013-10-07 Nitto Denko Corp 半導体基板、半導体装置、および、半導体装置の製造方法
TW201616682A (zh) * 2014-10-24 2016-05-01 Edison Opto Corp 光線發射裝置
CN105428508B (zh) * 2015-12-02 2018-08-24 开发晶照明（厦门）有限公司 封装基板以及led倒装封装结构
DE102016121510A1 (de) * 2016-11-10 2018-05-17 Osram Opto Semiconductors Gmbh Leiterrahmen, optoelektronisches Bauelement mit einem Leiterrahmen und Verfahren zur Herstellung eines optoelektronischen Bauelements
WO2019147589A1 (en) * 2018-01-24 2019-08-01 Apple Inc. Micro led based display panel
JP7373677B2 (ja) * 2020-05-08 2023-11-02 シグニファイ ホールディング ビー ヴィ 照明ユニット及び照明器具
TWI790671B (zh) * 2021-07-04 2023-01-21 郭明騰 光源模組

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5965490A (ja) * 1982-10-05 1984-04-13 Ricoh Co Ltd 半導体発光素子アレイの製造方法
JPH03160768A (ja) * 1989-11-09 1991-07-10 Oerlikon Contraves Ag 同じ電子部品のアレーで混成回路装置を作製する方法
JPH0513820A (ja) * 1991-07-02 1993-01-22 Omron Corp 半導体装置
JPH0888409A (ja) 1994-09-16 1996-04-02 Hitachi Cable Ltd Ｌｅｄアレイヘッド
JP2003347650A (ja) * 2002-05-29 2003-12-05 Rohm Co Ltd 半導体発光装置
JP2006502567A (ja) 2002-09-30 2006-01-19 シーメンス　アクチエンゲゼルシヤフト 画像再生装置を後方照明するための照明装置
JP2007088080A (ja) * 2005-09-20 2007-04-05 Matsushita Electric Works Ltd 発光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102787A (ja) 1984-10-26 1986-05-21 Matsushita Electric Ind Co Ltd 発光半導体装置
DE19519549A1 (de) 1995-05-27 1996-11-28 Bosch Gmbh Robert Anordnung zur Montage eines optoelektronischen Bauelements auf einem Träger
JP2002232068A (ja) 2000-11-29 2002-08-16 Mitsubishi Chemicals Corp 半導体発光装置
JP4486451B2 (ja) 2004-09-07 2010-06-23 スタンレー電気株式会社 発光装置、その発光装置に使用するリードフレーム、及びリードフレームの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5965490A (ja) * 1982-10-05 1984-04-13 Ricoh Co Ltd 半導体発光素子アレイの製造方法
JPH03160768A (ja) * 1989-11-09 1991-07-10 Oerlikon Contraves Ag 同じ電子部品のアレーで混成回路装置を作製する方法
JPH0513820A (ja) * 1991-07-02 1993-01-22 Omron Corp 半導体装置
JPH0888409A (ja) 1994-09-16 1996-04-02 Hitachi Cable Ltd Ｌｅｄアレイヘッド
JP2003347650A (ja) * 2002-05-29 2003-12-05 Rohm Co Ltd 半導体発光装置
JP2006502567A (ja) 2002-09-30 2006-01-19 シーメンス　アクチエンゲゼルシヤフト 画像再生装置を後方照明するための照明装置
JP2007088080A (ja) * 2005-09-20 2007-04-05 Matsushita Electric Works Ltd 発光装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2197045A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102713430A (zh) * 2010-01-19 2012-10-03 松下电器产业株式会社 照明装置
EP2527729A1 (en) * 2010-01-19 2012-11-28 Panasonic Corporation Illumination apparatus
EP2527729A4 (en) * 2010-01-19 2014-03-26 Panasonic Corp ILLUMINATION DEVICE

Also Published As

Publication number Publication date
EP2197045A1 (en) 2010-06-16
US8664674B2 (en) 2014-03-04
US20100207135A1 (en) 2010-08-19
EP2197045A4 (en) 2013-05-29

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