JP2006502567A - 画像再生装置を後方照明するための照明装置 - Google Patents
画像再生装置を後方照明するための照明装置 Download PDFInfo
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Crystallography & Structural Chemistry (AREA)
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
- Led Devices (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
Description
図1 本発明による照明装置によって後方照明されるディスプレイの非常に概略的な図である。
Claims (25)
- 光バルブを有する画像再生装置を後方照明するための照明装置において、
熱伝導性の担体(7)上に、それぞれ少なくとも1つの発光ダイオード(9)によって構成された発光点(6)が、ラスタの形状で配置されていることを特徴とする照明装置。 - 該発光点(6)の面積はそれぞれ、ラスタによって得られた面積より小さい、請求項1記載の照明装置。
- 絶縁性の担体上において、発光点(6)によって占有されていない該担体(7)の面積に線路(14)が、該発光ダイオード(9)の給電のために配置されている、請求項2記載の照明装置。
- 前記線路(14)は、フレキシブルなフィルムに挿入されて案内されており、該担体の外側にフラットライン(8)として続けられている、請求項3記載の照明装置。
- 該発光点(6)は、良好な熱伝導性を有し該担体(7)と良好に熱伝導結合されるサブマウント(10)上に取り付けられている、請求項2から4までのいずれか1項記載の照明装置。
- 該少なくとも1つの発光ダイオード(9)は電気的に絶縁されて、前記サブマウント(10)上に配置されている、請求項5記載の照明装置。
- 前記サブマウント(10)はシリコンから成る、請求項5または6記載の照明装置。
- 該担体(7)は、超高純度のアルミニウムから成る、請求項5から7までのいずれか1項記載の照明装置。
- 該担体(7)は銅から成る、請求項5から7までのいずれか1項記載の照明装置。
- 該担体(7)はヒートシンクに接続されている、請求項5から9までのいずれか1項記載の照明装置。
- 該発光点(6)間のスペースには、プラスチック(5,12)が充填されている、請求項2から10までのいずれか1項記載の照明装置。
- 各1つの発光点(6)は、複数の発光ダイオード(9)から構成されている、請求項1から11までのいずれか1項記載の照明装置。
- 各1つの発光点(6)の発光ダイオード(9)は、異なる色の光を送出する、請求項12記載の照明装置。
- 4つの発光ダイオード(9)が1つの発光点(6)を形成する、請求項12または13記載の照明装置。
- 2つの緑色発光ダイオードと、1つの青色発光ダイオードと、1つの赤色発光ダイオードとが、各発光点(6)ごとに設けられている、請求項14記載の照明装置。
- 該発光点(6)はそれぞれ1つの反射器(15)によって包囲されている、請求項1から15までのいずれか1項記載の照明装置。
- 前記反射器(15)によって形成され該発光点を含む凹入部に、透明なプラスチック(13)が充填されている、請求項16記載の照明装置。
- 該発光ダイオードはグループごとに、それぞれ1つの電流回路に直列接続されている、請求項1から17までのいずれか1項記載の照明装置。
- それぞれグループに所属する発光ダイオードを有する該発光点は、別のグループの発光点に交互に接続されている、請求項18記載の照明装置。
- 発光点ごとに複数の同色の発光ダイオードが設けられている場合、該同色の発光ダイオードは異なる電流回路に接続されている、請求項18または19記載の照明装置。
- 個々の電流回路に供給される電流を制御するための制御装置が設けられており、
前記制御装置は、同色の発光ダイオードのための電流回路のうち1つが遮断された場合、電流回路へ流れる電流を、同色の発光ダイオードのための少なくとも1つの別の電流回路と、別の色の発光ダイオードのための少なくとも1つの別の電流回路とに関して、遮断に起因する色偏差が補償されるように制御する、請求項20記載の照明装置。 - 同色の発光ダイオードの前記少なくとも1つの別の電流回路へ流れる電流が上昇される、請求項21記載の照明装置。
- 別の色の発光ダイオードのための電流回路へ流れる電流が低減される、請求項21記載の照明装置。
- 4×8個の発光点のラスタが設けられており、各発光点は2つの緑色発光ダイオードと2つの赤色発光ダイオードとを有する場合、前記赤色発光ダイオードに対して4つの電流回路が設けられており、
同じ発光点の発光ダイオードにそれぞれ2つの電流回路が割り当てられており、
前記発光ダイオードは、チェス盤状に前記ラスタ全体に分布されている、請求項18から23までのいずれか1項記載の照明装置。 - 緑色発光ダイオードは8つの電流回路に接続されており、
8つの発光点の緑色発光ダイオードは各1つずつ、1つの電流回路に接続されており、
同じ発光点の別の緑色発光ダイオードは、別の電流回路に接続されている、請求項24記載の照明装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE10245892A DE10245892A1 (de) | 2002-09-30 | 2002-09-30 | Beleuchtungseinrichtung zur Hinterleuchtung einer Bildwiedergabevorrichtung |
PCT/DE2003/002886 WO2004031844A1 (de) | 2002-09-30 | 2003-09-01 | Beleuchtungseinrichtung zur hinterleuchtung einer bildwiedergabevorrichtung |
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JP2008214602A Division JP4741640B2 (ja) | 2002-09-30 | 2008-08-22 | 画像再生装置を後方照明するための照明装置 |
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JP2006502567A true JP2006502567A (ja) | 2006-01-19 |
JP4206380B2 JP4206380B2 (ja) | 2009-01-07 |
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JP2004540476A Expired - Fee Related JP4206380B2 (ja) | 2002-09-30 | 2003-09-01 | 画像再生装置を後方照明するための照明装置 |
JP2008214602A Expired - Fee Related JP4741640B2 (ja) | 2002-09-30 | 2008-08-22 | 画像再生装置を後方照明するための照明装置 |
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US (1) | US8042964B2 (ja) |
EP (1) | EP1546796B1 (ja) |
JP (2) | JP4206380B2 (ja) |
KR (1) | KR100998386B1 (ja) |
CN (1) | CN100412644C (ja) |
DE (1) | DE10245892A1 (ja) |
TW (1) | TWI316766B (ja) |
WO (1) | WO2004031844A1 (ja) |
Cited By (5)
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WO2007116556A1 (ja) * | 2006-04-10 | 2007-10-18 | Sharp Kabushiki Kaisha | Ledパッケージ並びにこれを備えた照明装置および液晶表示装置 |
WO2009028612A1 (ja) | 2007-08-28 | 2009-03-05 | Panasonic Electric Works Co., Ltd. | 発光装置 |
JP2015112953A (ja) * | 2013-12-10 | 2015-06-22 | 株式会社デンソー | 車両用投影装置 |
JP2015185760A (ja) * | 2014-03-25 | 2015-10-22 | 東芝ライテック株式会社 | 発光モジュール |
JP2017069394A (ja) * | 2015-09-30 | 2017-04-06 | ローム株式会社 | Led照明器具およびその製造方法 |
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WO2002069030A2 (en) | 2001-02-27 | 2002-09-06 | The University Of British Columbia | High dynamic range display devices |
CN1643565B (zh) | 2002-03-13 | 2013-09-04 | 杜比实验室特许公司 | 高动态范围显示装置 |
US8687271B2 (en) | 2002-03-13 | 2014-04-01 | Dolby Laboratories Licensing Corporation | N-modulation displays and related methods |
DE10229067B4 (de) * | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
DE10245933B4 (de) * | 2002-09-30 | 2013-10-10 | Osram Opto Semiconductors Gmbh | Einrichtung zur Erzeugung eines gebündelten Lichtstroms |
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JP2006005290A (ja) * | 2004-06-21 | 2006-01-05 | Citizen Electronics Co Ltd | 発光ダイオード |
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WO2006013503A2 (en) * | 2004-07-27 | 2006-02-09 | Koninklijke Philips Electronics N.V. | Light emitting diode assembly |
KR100643238B1 (ko) * | 2004-10-05 | 2006-11-10 | 삼성전자주식회사 | 백라이트유닛 |
EP1800180A4 (en) | 2004-10-05 | 2008-03-26 | Samsung Electronics Co Ltd | TAIL LIGHT UNIT |
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DE102006002275A1 (de) | 2005-01-19 | 2006-07-20 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung |
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KR100691191B1 (ko) * | 2005-07-15 | 2007-03-09 | 삼성전기주식회사 | Led를 이용한 면광원 및 이를 구비하는 lcd 백라이트유닛 |
US20070019129A1 (en) * | 2005-07-20 | 2007-01-25 | Cree, Inc. | Independent control of light emitting diodes for backlighting of color displays |
DE102005042066A1 (de) * | 2005-09-03 | 2007-03-15 | Osram Opto Semiconductors Gmbh | Hinterleuchtungsanordnung mit in Leuchtgruppen angeordneten Halbleiterlichtquellen |
DE102006033893B4 (de) | 2005-12-16 | 2017-02-23 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung |
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- 2003-09-01 KR KR1020057005379A patent/KR100998386B1/ko active IP Right Grant
- 2003-09-01 CN CNB038233894A patent/CN100412644C/zh not_active Expired - Fee Related
- 2003-09-01 JP JP2004540476A patent/JP4206380B2/ja not_active Expired - Fee Related
- 2003-09-01 US US10/529,675 patent/US8042964B2/en not_active Expired - Fee Related
- 2003-09-01 WO PCT/DE2003/002886 patent/WO2004031844A1/de active Application Filing
- 2003-09-23 TW TW092126180A patent/TWI316766B/zh not_active IP Right Cessation
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US8664674B2 (en) | 2007-08-28 | 2014-03-04 | Panasonic Corporation | Light emitting diode device preventing short circuiting between adjacent light emitting diode chips |
JP2015112953A (ja) * | 2013-12-10 | 2015-06-22 | 株式会社デンソー | 車両用投影装置 |
JP2015185760A (ja) * | 2014-03-25 | 2015-10-22 | 東芝ライテック株式会社 | 発光モジュール |
JP2017069394A (ja) * | 2015-09-30 | 2017-04-06 | ローム株式会社 | Led照明器具およびその製造方法 |
Also Published As
Publication number | Publication date |
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CN1685280A (zh) | 2005-10-19 |
US8042964B2 (en) | 2011-10-25 |
JP4206380B2 (ja) | 2009-01-07 |
US20060232969A1 (en) | 2006-10-19 |
TWI316766B (en) | 2009-11-01 |
EP1546796A1 (de) | 2005-06-29 |
WO2004031844A1 (de) | 2004-04-15 |
KR100998386B1 (ko) | 2010-12-03 |
KR20050061491A (ko) | 2005-06-22 |
TW200409386A (en) | 2004-06-01 |
DE10245892A1 (de) | 2004-05-13 |
JP4741640B2 (ja) | 2011-08-03 |
JP2008288618A (ja) | 2008-11-27 |
CN100412644C (zh) | 2008-08-20 |
EP1546796B1 (de) | 2014-01-22 |
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