JP2006005290A - 発光ダイオード - Google Patents
発光ダイオード Download PDFInfo
- Publication number
- JP2006005290A JP2006005290A JP2004182403A JP2004182403A JP2006005290A JP 2006005290 A JP2006005290 A JP 2006005290A JP 2004182403 A JP2004182403 A JP 2004182403A JP 2004182403 A JP2004182403 A JP 2004182403A JP 2006005290 A JP2006005290 A JP 2006005290A
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- Prior art keywords
- light emitting
- emitting diode
- hole
- heat
- emitting element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】 ダイボンド用の実装面22aを有する高熱伝導性の放熱基台22と、この放熱基台22上に載置され、前記実装面22aの一部を露出する孔部27及び前記放熱基台22の外周縁より外方に張り出す張出部29を有する回路基板24と、前記孔部27を通して前記実装面22a上に実装される発光素子23と、この発光素子23の上方を封止する透光性の樹脂体25とを備え、前記張出部29の外周縁に前記発光素子23と導通するスルーホール28を形成し、このスルーホール28の上面及び下面に外部接続電極28a,28bを設けた。
【選択図】 図1
Description
22,52,62 放熱基台
22a 実装面
22b 放熱面
23,43 発光素子
24 回路基板
25 樹脂体
26 ボンディングワイヤ
27 孔部
28 スルーホール
28a,28b 外部接続電極
29,69 張出部
30,70 封止枠体
44 サブマウント基板
Claims (8)
- ダイボンド用の実装面を有する高熱伝導性の放熱基台と、この放熱基台上に載置され、前記実装面の一部を露出する孔部及び前記放熱基台の外周縁より外方に張り出す張出部を有する回路基板と、前記孔部を通して前記実装面上に実装される発光素子と、この発光素子の上方を封止する透光性の樹脂体とを備え、
前記張出部の外周縁に前記発光素子と導通するスルーホールを形成し、このスルーホールの上面及び下面に外部接続電極を設けたことを特徴とする発光ダイオード。 - 前記放熱基台は、金属、金属合金、または、セラミックで形成される請求項1記載の発光ダイオード。
- 前記放熱基台は、銅、銅合金、アルミニウム、アルミニウム合金、アルミ系セラミックスのいずれかによって形成される請求項1または2記載の発光ダイオード。
- 前記実装面上にサブマウント基板を載置し、このサブマウント基板を介して前記発光素子を実装した請求項1記載の発光ダイオード。
- 前記サブマウント基板は、アルミ系セラミックス、または、シリコンで形成される請求項4記載の発光ダイオード。
- 前記樹脂体の周囲に封止枠体、または、内周面に光反射部材を有する反射枠体を配設した請求項1記載の発光ダイオード。
- 前記発光素子が、前記孔部から露出する実装面内に複数実装される請求項1記載の発光ダイオード。
- 前記張出部に、前記発光素子と導通するスルーホールが複数形成される請求項1または7記載の発光ダイオード。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004182403A JP2006005290A (ja) | 2004-06-21 | 2004-06-21 | 発光ダイオード |
KR1020050052218A KR101124510B1 (ko) | 2004-06-21 | 2005-06-17 | 발광 다이오드 |
DE102005028176A DE102005028176A1 (de) | 2004-06-21 | 2005-06-17 | Leuchtdiode |
CNB200510078962XA CN100435362C (zh) | 2004-06-21 | 2005-06-21 | 发光二极管 |
US11/157,171 US7642704B2 (en) | 2004-06-21 | 2005-06-21 | Light-emitting diode with a base |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004182403A JP2006005290A (ja) | 2004-06-21 | 2004-06-21 | 発光ダイオード |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006005290A true JP2006005290A (ja) | 2006-01-05 |
Family
ID=35513168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004182403A Pending JP2006005290A (ja) | 2004-06-21 | 2004-06-21 | 発光ダイオード |
Country Status (5)
Country | Link |
---|---|
US (1) | US7642704B2 (ja) |
JP (1) | JP2006005290A (ja) |
KR (1) | KR101124510B1 (ja) |
CN (1) | CN100435362C (ja) |
DE (1) | DE102005028176A1 (ja) |
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WO2006129690A1 (ja) * | 2005-05-31 | 2006-12-07 | Showa Denko K.K. | Led用基板およびledパッケージ |
JP2007088079A (ja) * | 2005-09-20 | 2007-04-05 | Matsushita Electric Works Ltd | 発光装置 |
JP2007208061A (ja) * | 2006-02-02 | 2007-08-16 | Sharp Corp | 半導体発光素子,その製造方法,半導体発光素子アセンブリ |
JP2007281471A (ja) * | 2006-04-03 | 2007-10-25 | Ivoclar Vivadent Ag | 半導体光放射線源ならびに光硬化装置 |
JP2007281472A (ja) * | 2006-04-03 | 2007-10-25 | Ivoclar Vivadent Ag | 半導体放射源ならびに光硬化装置 |
JP2007281473A (ja) * | 2006-04-03 | 2007-10-25 | Ivoclar Vivadent Ag | 半導体放射線源 |
JP2007300106A (ja) * | 2006-04-28 | 2007-11-15 | Taida Electronic Ind Co Ltd | 発光装置 |
JP2007317573A (ja) * | 2006-05-26 | 2007-12-06 | Matsushita Electric Works Ltd | Led点灯ユニット及びそれを用いた照明器具 |
JP2008235827A (ja) * | 2007-03-23 | 2008-10-02 | Matsushita Electric Works Ltd | 発光装置 |
JP2009239036A (ja) * | 2008-03-27 | 2009-10-15 | Hitachi Aic Inc | Led基板 |
JP2010003968A (ja) * | 2008-06-23 | 2010-01-07 | Panasonic Electric Works Co Ltd | 発光装置 |
JP2010129583A (ja) * | 2008-11-25 | 2010-06-10 | Citizen Electronics Co Ltd | 照明装置 |
JP2010287584A (ja) * | 2009-06-09 | 2010-12-24 | Nichia Corp | 発光装置 |
JP2011505072A (ja) * | 2007-11-28 | 2011-02-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | チップアセンブリ、接続アセンブリ、led、およびチップアセンブリの製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
US7642704B2 (en) | 2010-01-05 |
DE102005028176A1 (de) | 2006-02-16 |
KR101124510B1 (ko) | 2012-03-15 |
US20060001361A1 (en) | 2006-01-05 |
CN1713406A (zh) | 2005-12-28 |
CN100435362C (zh) | 2008-11-19 |
KR20060046473A (ko) | 2006-05-17 |
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