ATE388487T1 - Vorrichtung zur kühlung von halbleiterbauteilen auf leiterplatten - Google Patents

Vorrichtung zur kühlung von halbleiterbauteilen auf leiterplatten

Info

Publication number
ATE388487T1
ATE388487T1 AT03018046T AT03018046T ATE388487T1 AT E388487 T1 ATE388487 T1 AT E388487T1 AT 03018046 T AT03018046 T AT 03018046T AT 03018046 T AT03018046 T AT 03018046T AT E388487 T1 ATE388487 T1 AT E388487T1
Authority
AT
Austria
Prior art keywords
circuit board
printed circuit
cooling
circuit boards
semiconductor device
Prior art date
Application number
AT03018046T
Other languages
English (en)
Inventor
Stefan Schmidberger
Original Assignee
Harman Becker Automotive Sys
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harman Becker Automotive Sys filed Critical Harman Becker Automotive Sys
Application granted granted Critical
Publication of ATE388487T1 publication Critical patent/ATE388487T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT03018046T 2003-08-07 2003-08-07 Vorrichtung zur kühlung von halbleiterbauteilen auf leiterplatten ATE388487T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03018046A EP1508916B1 (de) 2003-08-07 2003-08-07 Vorrichtung zur Kühlung von Halbleiterbauteilen auf Leiterplatten

Publications (1)

Publication Number Publication Date
ATE388487T1 true ATE388487T1 (de) 2008-03-15

Family

ID=34042843

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03018046T ATE388487T1 (de) 2003-08-07 2003-08-07 Vorrichtung zur kühlung von halbleiterbauteilen auf leiterplatten

Country Status (4)

Country Link
US (1) US7187553B2 (de)
EP (1) EP1508916B1 (de)
AT (1) ATE388487T1 (de)
DE (1) DE60319523T2 (de)

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US7321492B2 (en) * 2005-02-15 2008-01-22 Inventec Corporation Heat sink module for an electronic device
JP2006245356A (ja) * 2005-03-04 2006-09-14 Hitachi Ltd 電子デバイスの冷却装置
US7515418B2 (en) 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
WO2007055625A1 (en) * 2005-11-11 2007-05-18 Telefonaktiebolaget Lm Ericsson (Publ) Cooling assembly
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
TW200834285A (en) * 2007-02-02 2008-08-16 Compal Electronics Inc Fastening structure for reducing surface temperature of housing
JP4400662B2 (ja) * 2007-09-12 2010-01-20 株式会社デンソー 電子回路部品実装構造
JP5324773B2 (ja) * 2007-11-06 2013-10-23 インターナショナル・ビジネス・マシーンズ・コーポレーション 回路モジュールとその製造方法
AT507352B1 (de) * 2008-10-01 2013-04-15 Siemens Ag Kühlanordnung
JP5402200B2 (ja) * 2009-04-20 2014-01-29 株式会社リコー 熱移動機構及び情報機器
US7957148B1 (en) * 2009-12-08 2011-06-07 International Business Machines Corporation Low profile computer processor retention device
US20110162828A1 (en) * 2010-01-06 2011-07-07 Graham Charles Kirk Thermal plug for use with a heat sink and method of assembling same
WO2011106082A1 (en) * 2010-02-25 2011-09-01 Thomson Licensing Miniature multilayer radiative cooling case with hidden quick release snaps
US8451600B1 (en) * 2010-03-04 2013-05-28 Amazon Technologies, Inc. Heat spreading chassis for rack-mounted computer system
CN103262675B (zh) 2010-05-19 2016-03-30 汤姆森特许公司 能散失热负荷的机顶盒
US20130077256A1 (en) * 2010-06-09 2013-03-28 Sharp Kabushiki Kaisha Heat dissipation structure for electronic device
US9209107B2 (en) * 2010-06-14 2015-12-08 Sharp Kabushiki Kaisha Electronic device, display device, and television receiver
JP5530517B2 (ja) * 2010-06-18 2014-06-25 シャープ株式会社 電子機器の放熱構造
WO2012008205A1 (ja) * 2010-07-14 2012-01-19 シャープ株式会社 電子機器および表示装置
JP5510432B2 (ja) * 2011-02-28 2014-06-04 株式会社豊田自動織機 半導体装置
WO2012122230A2 (en) 2011-03-09 2012-09-13 Thompson Licensing Set top box or server having snap-in heat sink and smart card reader
CN103703875B (zh) 2011-07-14 2016-10-12 汤姆逊许可公司 具有扣合式散热器和智能卡读卡器、带有用于保持散热器的固定部件的机顶盒
JP5644706B2 (ja) * 2011-07-19 2014-12-24 株式会社豊田自動織機 電動圧縮機用の電子部品固定構造
US8541875B2 (en) * 2011-09-30 2013-09-24 Alliance For Sustainable Energy, Llc Integrated three-dimensional module heat exchanger for power electronics cooling
TWI504852B (zh) * 2012-09-07 2015-10-21 Compal Electronics Inc 散熱模組
US9049811B2 (en) * 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
JP5751273B2 (ja) * 2013-04-02 2015-07-22 トヨタ自動車株式会社 半導体装置
US9379039B2 (en) * 2013-09-04 2016-06-28 Cisco Technology, Inc. Heat transfer for electronic equipment
US10455686B2 (en) * 2016-08-19 2019-10-22 Panasonic Automotive Systems Company Of America, Division Of Panasonic Corporation Of North America Clamping spring design to apply clamping force to SMT power amplifier device
JP6898162B2 (ja) * 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造
US10638647B1 (en) * 2017-12-30 2020-04-28 Xeleum Lighting Attaching printed circuit board to heat exchanger
JP7000931B2 (ja) * 2018-03-12 2022-01-19 富士通株式会社 冷却機構付き基板
WO2019204686A1 (en) * 2018-04-19 2019-10-24 The Research Foundation For The State University Of New York Solderless circuit connector
DE112018007572T5 (de) * 2018-05-08 2021-01-21 Mitsubishi Electric Corporation Befestigungsstruktur und Energieumwandlungsvorrichtung, welches die Befestigungsstruktur verwendet
JP7193730B2 (ja) * 2019-03-26 2022-12-21 三菱電機株式会社 半導体装置
DE102019205411A1 (de) 2019-04-15 2020-10-15 Volkswagen Aktiengesellschaft Halbleiteranordnung
US11495519B2 (en) 2019-06-07 2022-11-08 Dana Canada Corporation Apparatus for thermal management of electronic components
DE102020212652A1 (de) * 2020-10-07 2022-04-07 Vitesco Technologies GmbH Halbleiterbaugruppe und Verfahren zur Herstellung einer Halbleiterbaugruppe
US11576282B2 (en) * 2021-06-25 2023-02-07 Intel Corporation Cold plate attachment with stabilizing arm
DE102021129117A1 (de) * 2021-11-09 2023-05-11 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung
SE2151443A1 (en) 2021-11-26 2023-05-27 Wivid Ab A printed circuit board with improved cooling properties and method for manufacture thereof
GB2628604A (en) * 2023-03-30 2024-10-02 Rolls Royce Deutschland Ltd & Co Kg Holding down construction for a printed circuit board
FR3147663A1 (fr) * 2023-04-07 2024-10-11 Stmicroelectronics International N.V. Dissipateur thermique fixe sur le substrat d’un boitier de circuits integres

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Publication number Priority date Publication date Assignee Title
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
FR2679729B1 (fr) * 1991-07-23 1994-04-29 Alcatel Telspace Dissipateur thermique.
US6046905A (en) * 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US5883782A (en) * 1997-03-05 1999-03-16 Intel Corporation Apparatus for attaching a heat sink to a PCB mounted semiconductor package
US5883783A (en) * 1997-07-15 1999-03-16 Intel Corporation GT clip design for an electronic packaging assembly
US5920120A (en) * 1997-12-19 1999-07-06 Intel Corporation Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved
US6154365A (en) * 1999-02-26 2000-11-28 Intel Corporation Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly
US6256199B1 (en) * 1999-10-01 2001-07-03 Intel Corporation Integrated circuit cartridge and method of fabricating the same
JP3602771B2 (ja) * 2000-05-12 2004-12-15 富士通株式会社 携帯型電子機器
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
TW560643U (en) * 2002-01-30 2003-11-01 Hon Hai Prec Ind Co Ltd Backplate of heat sink
DE60209423T2 (de) * 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Mikrochip-Kühlung auf Leiterplatte
US6885557B2 (en) * 2003-04-24 2005-04-26 Intel Corporaiton Heatsink assembly

Also Published As

Publication number Publication date
US7187553B2 (en) 2007-03-06
US20050128713A1 (en) 2005-06-16
EP1508916A1 (de) 2005-02-23
EP1508916B1 (de) 2008-03-05
DE60319523T2 (de) 2009-03-26
DE60319523D1 (de) 2008-04-17

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties