JP5751273B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5751273B2 JP5751273B2 JP2013077106A JP2013077106A JP5751273B2 JP 5751273 B2 JP5751273 B2 JP 5751273B2 JP 2013077106 A JP2013077106 A JP 2013077106A JP 2013077106 A JP2013077106 A JP 2013077106A JP 5751273 B2 JP5751273 B2 JP 5751273B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cooler
- column
- semiconductor module
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4338—Pistons, e.g. spring-loaded members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
2 バネ(皿バネ:バネ部材)
3 半導体モジュール
4 冷却器
4A 被押圧部
4B 支柱固定部
41 上板
42 冷却フィン
42A 冷却フィン(剛性大)
42B 冷却フィン(剛性小)
43 下板
5 支柱
5a 雌ネジ
6 ボルト
6a 雄ネジ
7 梁部材
7a ボルト穴
8 グリス
Claims (1)
- バネ部材により半導体モジュールが冷却器に押圧されてなる半導体装置であって、前記バネ部材は前記冷却器に固定された支柱に接続された梁部材により圧縮されるものであるとともに、前記冷却器は前記半導体モジュールが押圧される被押圧部と前記支柱が固定される支柱固定部とを有して、前記支柱固定部は前記被押圧部よりも剛性が高く、前記冷却器は冷却フィンを含み、当該冷却フィンの寸法諸元に基づいて前記剛性が調節される、半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013077106A JP5751273B2 (ja) | 2013-04-02 | 2013-04-02 | 半導体装置 |
US14/225,519 US8963324B2 (en) | 2013-04-02 | 2014-03-26 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013077106A JP5751273B2 (ja) | 2013-04-02 | 2013-04-02 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014203892A JP2014203892A (ja) | 2014-10-27 |
JP5751273B2 true JP5751273B2 (ja) | 2015-07-22 |
Family
ID=51620002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013077106A Expired - Fee Related JP5751273B2 (ja) | 2013-04-02 | 2013-04-02 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8963324B2 (ja) |
JP (1) | JP5751273B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015198724A1 (ja) * | 2014-06-23 | 2015-12-30 | 富士電機株式会社 | 冷却器一体型半導体モジュール |
JP6459843B2 (ja) * | 2015-08-11 | 2019-01-30 | 三菱電機株式会社 | 半導体装置 |
US9913361B2 (en) | 2016-01-06 | 2018-03-06 | International Business Machines Corporation | Integrated circuit device assembly |
US10109556B2 (en) * | 2016-03-07 | 2018-10-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems and methods for spring-based device attachment |
DE102017117667B4 (de) * | 2017-08-03 | 2021-11-18 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit einer auf eine Schalteinrichtung einwirkenden Druckeinrichtung |
JP7147722B2 (ja) * | 2019-09-17 | 2022-10-05 | 株式会社デンソー | 表示装置 |
JP7359647B2 (ja) * | 2019-10-30 | 2023-10-11 | 日立Astemo株式会社 | パワー半導体装置およびパワー半導体装置の製造方法 |
JP7452373B2 (ja) * | 2020-10-19 | 2024-03-19 | 株式会社デンソー | 電力変換装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4310446C1 (de) * | 1993-03-31 | 1994-05-05 | Export Contor Ausenhandelsgese | Schaltungsanordnung |
JPH0786471A (ja) * | 1993-09-20 | 1995-03-31 | Hitachi Ltd | 半導体モジュ−ル |
US5646826A (en) * | 1995-01-26 | 1997-07-08 | Northern Telecom Limited | Printed circuit board and heat sink arrangement |
US5883782A (en) * | 1997-03-05 | 1999-03-16 | Intel Corporation | Apparatus for attaching a heat sink to a PCB mounted semiconductor package |
US6472742B1 (en) * | 1999-09-30 | 2002-10-29 | Intel Corporation | Thermal gap control |
US6459582B1 (en) * | 2000-07-19 | 2002-10-01 | Fujitsu Limited | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
US6386890B1 (en) * | 2001-03-12 | 2002-05-14 | International Business Machines Corporation | Printed circuit board to module mounting and interconnecting structure and method |
US6631078B2 (en) * | 2002-01-10 | 2003-10-07 | International Business Machines Corporation | Electronic package with thermally conductive standoff |
US6885557B2 (en) * | 2003-04-24 | 2005-04-26 | Intel Corporaiton | Heatsink assembly |
DE60319523T2 (de) * | 2003-08-07 | 2009-03-26 | Harman Becker Automotive Systems Gmbh | Vorrichtung zur Kühlung von Halbleiterbauteilen auf Leiterplatten |
JP2005085908A (ja) * | 2003-09-05 | 2005-03-31 | Nisshin:Kk | 集積回路の冷却装置及び筐体装置 |
US7361985B2 (en) * | 2004-10-27 | 2008-04-22 | Freescale Semiconductor, Inc. | Thermally enhanced molded package for semiconductors |
US7518235B2 (en) * | 2005-03-08 | 2009-04-14 | International Business Machines Corporation | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments |
US7777329B2 (en) * | 2006-07-27 | 2010-08-17 | International Business Machines Corporation | Heatsink apparatus for applying a specified compressive force to an integrated circuit device |
EP2144483A4 (en) * | 2007-03-29 | 2011-06-08 | Fujitsu Ltd | DECAY-REDUCING FIXATION STRUCTURE |
JP2008258241A (ja) * | 2007-04-02 | 2008-10-23 | Mitsubishi Electric Corp | 半導体装置 |
US7795724B2 (en) * | 2007-08-30 | 2010-09-14 | International Business Machines Corporation | Sandwiched organic LGA structure |
JP4643703B2 (ja) * | 2008-11-21 | 2011-03-02 | 株式会社東芝 | 半導体装置の固定具及びその取付構造 |
US8576565B2 (en) * | 2009-08-18 | 2013-11-05 | Panasonic Corporation | Electronic device cooling structure |
US7957148B1 (en) * | 2009-12-08 | 2011-06-07 | International Business Machines Corporation | Low profile computer processor retention device |
JP2011165988A (ja) * | 2010-02-11 | 2011-08-25 | Denso Corp | 半導体装置 |
JP2011249496A (ja) * | 2010-05-26 | 2011-12-08 | Panasonic Corp | 電子機器の冷却構造 |
JP5971190B2 (ja) * | 2012-06-07 | 2016-08-17 | 株式会社豊田自動織機 | 半導体装置 |
-
2013
- 2013-04-02 JP JP2013077106A patent/JP5751273B2/ja not_active Expired - Fee Related
-
2014
- 2014-03-26 US US14/225,519 patent/US8963324B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8963324B2 (en) | 2015-02-24 |
US20140291833A1 (en) | 2014-10-02 |
JP2014203892A (ja) | 2014-10-27 |
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