KR100984880B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR100984880B1 KR100984880B1 KR1020080077478A KR20080077478A KR100984880B1 KR 100984880 B1 KR100984880 B1 KR 100984880B1 KR 1020080077478 A KR1020080077478 A KR 1020080077478A KR 20080077478 A KR20080077478 A KR 20080077478A KR 100984880 B1 KR100984880 B1 KR 100984880B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor module
- semiconductor device
- semiconductor
- plate
- fixed
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (8)
- 반도체 장치에 있어서,반도체 소자가 수지 밀봉된 반도체 모듈과,상기 반도체 모듈의 상면에 고정되는 보강 비임(reinforcing beam)과,상기 반도체 모듈 및 이 반도체 모듈에 고정된 상기 보강 비임의 외주를 둘러싸도록 배치되고, 상기 보강 비임이 고정되는 프레임부를 구비한 것을 특징으로 하는반도체 장치.
- 제 1 항에 있어서,상기 반도체 모듈과 상기 보강 비임은 판 형상 스프링을 거쳐서 고정되는 것을 특징으로 하는반도체 장치.
- 제 2 항에 있어서,상기 반도체 모듈과 상기 판 형상 스프링과의 사이에 간극을 마련한 상태로 상기 반도체 모듈과 보강 비임이 고정되고, 상기 판 형상 스프링의 변형에 의해 상기 반도체 모듈이 상기 프레임부에 대하여 상하 방향으로 이동가능한 것을 특징으로 하는반도체 장치.
- 제 2 항 또는 3 항에 있어서,상기 판 형상 스프링의 변형량을 부분적으로 변화시킨 것을 특징으로 하는반도체 장치.
- 제 1 항에 있어서,상기 프레임부는 합성 수지로 형성되고, 상기 프레임부의 내부에는 상기 반도체 모듈과 전기적으로 접속되는 도통부가 인서트 성형에 의해 구성되어 있는 것을 특징으로 하는반도체 장치.
- 제 1 항에 있어서,상기 프레임부는 금속재로 형성되어 있는 것을 특징으로 하는반도체 장치
- 제 1 항에 있어서,상기 프레임부는 상기 보강 비임과 일체로 형성되어 있는 것을 특징으로 하는반도체 장치.
- 제 1 항에 있어서,상기 프레임부는 상기 반도체 모듈의 제어를 실행하는 제어부를 지지하는 지지부를 구비한 것을 특징으로 하는반도체 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007206163A JP5014016B2 (ja) | 2007-08-08 | 2007-08-08 | 半導体装置 |
JPJP-P-2007-00206163 | 2007-08-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090015844A KR20090015844A (ko) | 2009-02-12 |
KR100984880B1 true KR100984880B1 (ko) | 2010-10-01 |
Family
ID=40070805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080077478A KR100984880B1 (ko) | 2007-08-08 | 2008-08-07 | 반도체 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7880299B2 (ko) |
EP (1) | EP2023389B1 (ko) |
JP (1) | JP5014016B2 (ko) |
KR (1) | KR100984880B1 (ko) |
CN (1) | CN101364575B (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5267283B2 (ja) * | 2009-04-02 | 2013-08-21 | 三菱電機株式会社 | パワーモジュール |
DE102009002993B4 (de) * | 2009-05-11 | 2012-10-04 | Infineon Technologies Ag | Leistungshalbleitermodul mit beabstandeten Schaltungsträgern |
JP4968316B2 (ja) * | 2009-12-14 | 2012-07-04 | アンデン株式会社 | 電子回路装置 |
US8198725B2 (en) * | 2009-12-31 | 2012-06-12 | Star Technologies Inc. | Heat sink and integrated circuit assembly using the same |
JP2012054262A (ja) * | 2010-08-31 | 2012-03-15 | Mitsubishi Electric Corp | 半導体装置 |
JP5510432B2 (ja) * | 2011-02-28 | 2014-06-04 | 株式会社豊田自動織機 | 半導体装置 |
JP5832215B2 (ja) * | 2011-09-28 | 2015-12-16 | 株式会社ケーヒン | 半導体制御装置 |
KR101228841B1 (ko) * | 2011-10-04 | 2013-02-04 | 엘에스산전 주식회사 | 일체형 탄성클립을 이용한 전력용반도체 고정장치 |
JP5971190B2 (ja) * | 2012-06-07 | 2016-08-17 | 株式会社豊田自動織機 | 半導体装置 |
JP2014064463A (ja) * | 2013-12-20 | 2014-04-10 | Panasonic Corp | 給電制御装置 |
JP6645315B2 (ja) * | 2016-03-29 | 2020-02-14 | アイシン・エィ・ダブリュ株式会社 | インバータ装置、及び、インバータ装置の製造方法 |
JP6920790B2 (ja) * | 2016-05-24 | 2021-08-18 | ローム株式会社 | インテリジェントパワーモジュール、電気自動車またはハイブリッドカー、およびインテリジェントパワーモジュールの組み立て方法 |
DE112017007459T5 (de) * | 2017-04-21 | 2020-01-02 | Mitsubishi Electric Corporation | Leistungsumwandlungsvorrichtung |
WO2019215805A1 (ja) * | 2018-05-08 | 2019-11-14 | 三菱電機株式会社 | 締結構造体および締結構造体を用いた電力変換装置 |
DE102019122640A1 (de) * | 2019-08-22 | 2021-02-25 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Haltevorrichtung zur thermischen Kontaktierung eines auf einer Leiterplatte montierten elektronischen Bauteils mit einem Kühlkörper |
CN111225544B (zh) * | 2019-12-06 | 2021-11-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | 用于电子元件的散热装置 |
US11444002B2 (en) * | 2020-07-29 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
JP7452373B2 (ja) | 2020-10-19 | 2024-03-19 | 株式会社デンソー | 電力変換装置 |
JP7468433B2 (ja) | 2021-03-30 | 2024-04-16 | 株式会社豊田自動織機 | 電動圧縮機 |
JP2023009908A (ja) * | 2021-07-08 | 2023-01-20 | 株式会社豊田自動織機 | 電動圧縮機 |
EP4164349A1 (en) | 2021-10-06 | 2023-04-12 | MAHLE International GmbH | Control device for an electric machine |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02140856U (ko) * | 1989-04-27 | 1990-11-26 | ||
JP2001160696A (ja) | 1999-12-02 | 2001-06-12 | Kenwood Corp | 電子部品取付機構 |
JP2004087552A (ja) | 2002-08-23 | 2004-03-18 | Mitsubishi Electric Corp | 半導体装置 |
JP2005235992A (ja) | 2004-02-19 | 2005-09-02 | Mitsubishi Electric Corp | 半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6223079Y2 (ko) * | 1981-01-27 | 1987-06-12 | ||
JPH0289356A (ja) * | 1988-09-26 | 1990-03-29 | Mitsubishi Electric Corp | 半導体装置 |
US6043981A (en) * | 1997-11-13 | 2000-03-28 | Chrysler Corporation | Heat sink assembly for electrical components |
US5977640A (en) * | 1998-06-26 | 1999-11-02 | International Business Machines Corporation | Highly integrated chip-on-chip packaging |
JP3881488B2 (ja) * | 1999-12-13 | 2007-02-14 | 株式会社東芝 | 回路モジュールの冷却装置およびこの冷却装置を有する電子機器 |
US7265981B2 (en) | 2005-07-05 | 2007-09-04 | Cheng-Ping Lee | Power supply with heat sink |
DE102005055713B4 (de) * | 2005-11-23 | 2011-11-17 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Anschlusselementen |
JP4589239B2 (ja) * | 2006-01-12 | 2010-12-01 | 株式会社日立製作所 | 電子機器の冷却構造 |
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2007
- 2007-08-08 JP JP2007206163A patent/JP5014016B2/ja active Active
-
2008
- 2008-07-15 US US12/173,495 patent/US7880299B2/en active Active
- 2008-08-04 EP EP08161714.4A patent/EP2023389B1/en active Active
- 2008-08-07 CN CN2008101453535A patent/CN101364575B/zh active Active
- 2008-08-07 KR KR1020080077478A patent/KR100984880B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02140856U (ko) * | 1989-04-27 | 1990-11-26 | ||
JP2001160696A (ja) | 1999-12-02 | 2001-06-12 | Kenwood Corp | 電子部品取付機構 |
JP2004087552A (ja) | 2002-08-23 | 2004-03-18 | Mitsubishi Electric Corp | 半導体装置 |
JP2005235992A (ja) | 2004-02-19 | 2005-09-02 | Mitsubishi Electric Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101364575B (zh) | 2011-10-12 |
EP2023389A3 (en) | 2013-03-20 |
JP2009043863A (ja) | 2009-02-26 |
KR20090015844A (ko) | 2009-02-12 |
EP2023389A2 (en) | 2009-02-11 |
JP5014016B2 (ja) | 2012-08-29 |
US20090039504A1 (en) | 2009-02-12 |
EP2023389B1 (en) | 2015-01-21 |
CN101364575A (zh) | 2009-02-11 |
US7880299B2 (en) | 2011-02-01 |
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