JP6898162B2 - 電子部品の固定構造 - Google Patents
電子部品の固定構造 Download PDFInfo
- Publication number
- JP6898162B2 JP6898162B2 JP2017123551A JP2017123551A JP6898162B2 JP 6898162 B2 JP6898162 B2 JP 6898162B2 JP 2017123551 A JP2017123551 A JP 2017123551A JP 2017123551 A JP2017123551 A JP 2017123551A JP 6898162 B2 JP6898162 B2 JP 6898162B2
- Authority
- JP
- Japan
- Prior art keywords
- fixing
- substrate
- electronic component
- heat sink
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 79
- 238000003825 pressing Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2/00—Friction-grip releasable fastenings
- F16B2/02—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening
- F16B2/06—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action
- F16B2/065—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action using screw-thread elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
- F16B5/06—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips
- F16B5/0607—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips joining sheets or plates to each other
- F16B5/0621—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips joining sheets or plates to each other in parallel relationship
- F16B5/0642—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of clamps or clips joining sheets or plates to each other in parallel relationship the plates being arranged one on top of the other and in full close contact with each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
上記実施例にかかる電子部品ユニット1は、図示例に限定されるものではない。上記実施例では、複数の電子部品30を基板20に配置し、固定金具40は一対の押圧部42を有することを説明したが、これに限定されるものではない。固定部12、電子部品30、押圧部42、締結部材50、放熱シート60は、それぞれ少なくとも1つ以上有していればよい。
10 ヒートシンク
11 本体部
12 固定部
13 ねじ穴
14 凹部
20 基板
21 貫通孔
30 電子部品
40 固定金具
41 基部
42 押圧部
43 貫通孔
44 凸部
50 締結部材
60 放熱シート
Claims (3)
- ヒートシンクと、
少なくとも1以上の電子部品を搭載した基板と、
前記電子部品および前記基板を前記ヒートシンクに固定する固定金具と、
前記固定金具を前記ヒートシンクに固定する締結部材と、を備え、
前記ヒートシンクは、本体部と、前記本体部から前記基板側に突出し、且つ、前記固定金具が固定される固定部と、を有し、
前記基板は、前記本体部に載置された状態で、前記固定部が貫通する貫通孔を有し、
前記固定金具は、前記固定部に当接し、前記締結部材により前記固定部に固定される基部と、前記基部の一端から延在し、且つ、前記基部に対して弾性変形し、前記電子部品を前記基板側へ押圧する押圧部と、を有し、
前記固定部の前記基部側の面と前記基部の前記固定部側の面のうち、どちらか一方の面に凸部を形成し、他方の面に前記凸部と嵌合する凹部を形成し、
前記凹部と前記凸部は少なくとも1組以上形成されることを特徴とする電子部品の固定構造。 - 前記電子部品は、前記貫通孔を挟んで少なくとも一組が前記基板に対して搭載され、
前記押圧部は、前記電子部品にそれぞれ対応して一組が前記基部に対して形成されることを特徴とする請求項1に記載の電子部品の固定構造。 - 前記固定部は、前記貫通孔に貫通された状態で、前記基板が前記固定部に対して、回転することを規制する回転規制形状に形成されることを特徴とする請求項1または2に記載の電子部品の固定構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017123551A JP6898162B2 (ja) | 2017-06-23 | 2017-06-23 | 電子部品の固定構造 |
US15/960,729 US10939585B2 (en) | 2017-06-23 | 2018-04-24 | Fixing structure of electronic component |
DE102018209805.0A DE102018209805A1 (de) | 2017-06-23 | 2018-06-18 | Befestigungsstruktur eines elektronischen Bauelements |
CN201810643220.4A CN109119391B (zh) | 2017-06-23 | 2018-06-21 | 电子元件的固定构造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017123551A JP6898162B2 (ja) | 2017-06-23 | 2017-06-23 | 電子部品の固定構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019009279A JP2019009279A (ja) | 2019-01-17 |
JP6898162B2 true JP6898162B2 (ja) | 2021-07-07 |
Family
ID=64567578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017123551A Active JP6898162B2 (ja) | 2017-06-23 | 2017-06-23 | 電子部品の固定構造 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10939585B2 (ja) |
JP (1) | JP6898162B2 (ja) |
CN (1) | CN109119391B (ja) |
DE (1) | DE102018209805A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6548146B2 (ja) * | 2016-05-17 | 2019-07-24 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
CN108107055B (zh) * | 2017-11-20 | 2019-11-15 | 珠海格力电器股份有限公司 | 智能功率模块的控制方法、装置、存储介质和处理器 |
EP3629686A1 (de) * | 2018-09-26 | 2020-04-01 | Siemens Aktiengesellschaft | Vorrichtung zum anpressen von bauelementen |
EP3629687A1 (de) * | 2018-09-26 | 2020-04-01 | Siemens Aktiengesellschaft | Verfahren für eine montage eines elektrischen geräts |
CN111050468A (zh) * | 2020-01-02 | 2020-04-21 | 台达电子企业管理(上海)有限公司 | 电子装置及电子装置的组装方法 |
WO2021186935A1 (ja) * | 2020-03-19 | 2021-09-23 | 富士電機株式会社 | 電力変換装置 |
EP4128499A4 (en) * | 2020-04-01 | 2024-05-29 | Atlas Copco (Wuxi) Compressor Co., Ltd. | DRIVE UNIT |
CN213754350U (zh) * | 2020-11-19 | 2021-07-20 | 阳光电源(上海)有限公司 | 一种逆变器 |
JP7433735B2 (ja) * | 2021-09-01 | 2024-02-20 | 矢崎総業株式会社 | 電子部品の固定構造、及び車載充電器 |
Family Cites Families (19)
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EP0654176B1 (de) | 1993-06-07 | 1998-05-20 | Melcher Ag | Befestigungsvorrichtung für halbleiter-schaltelemente |
JP2001160696A (ja) * | 1999-12-02 | 2001-06-12 | Kenwood Corp | 電子部品取付機構 |
DE10123198A1 (de) * | 2001-05-12 | 2002-12-19 | Hella Kg Hueck & Co | Anordnung aus einem Gehäuse und einem Schaltungsträger |
JP2003289190A (ja) * | 2002-03-28 | 2003-10-10 | Keihin Corp | 発熱性電子部品の取付け用部材および取付け方法 |
ATE388487T1 (de) * | 2003-08-07 | 2008-03-15 | Harman Becker Automotive Sys | Vorrichtung zur kühlung von halbleiterbauteilen auf leiterplatten |
JP4387777B2 (ja) * | 2003-11-28 | 2009-12-24 | 株式会社東芝 | 電子機器 |
JP2006133409A (ja) * | 2004-11-04 | 2006-05-25 | Funai Electric Co Ltd | プロジェクタ |
JP2006294754A (ja) * | 2005-04-07 | 2006-10-26 | Denso Corp | 電子装置の放熱構造 |
US7612440B2 (en) * | 2005-05-18 | 2009-11-03 | Texas Instruments Incorporated | Package for an integrated circuit |
US7983048B2 (en) | 2007-02-15 | 2011-07-19 | Nec Corporation | Structure for mounting semiconductor package |
JP4385058B2 (ja) * | 2007-05-07 | 2009-12-16 | 三菱電機株式会社 | 電子制御装置 |
US7746653B2 (en) * | 2008-01-02 | 2010-06-29 | Harman International Industries Incorporated | Clamp for electrical devices |
CN102131366B (zh) * | 2010-01-15 | 2014-02-12 | 纬创资通股份有限公司 | 散热装置与散热系统 |
EP2458632B1 (en) * | 2010-11-24 | 2013-07-31 | Gefran S.p.A. | Heat sink module for electronic semiconductor devices |
JP2012182224A (ja) * | 2011-02-28 | 2012-09-20 | Tdk Corp | 電子部品の固定用ばね具及び放熱構造体 |
CN202135072U (zh) * | 2011-08-05 | 2012-02-01 | 南京国睿新能电子有限公司 | 一种模块并联的逆变电源主电路单元装置 |
JP2013243264A (ja) * | 2012-05-21 | 2013-12-05 | Yaskawa Electric Corp | 電子部品取付モジュールおよび電力変換装置 |
WO2016162991A1 (ja) * | 2015-04-08 | 2016-10-13 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
EP3208843A1 (de) * | 2016-02-17 | 2017-08-23 | ELinter AG | Halteklammer |
-
2017
- 2017-06-23 JP JP2017123551A patent/JP6898162B2/ja active Active
-
2018
- 2018-04-24 US US15/960,729 patent/US10939585B2/en active Active
- 2018-06-18 DE DE102018209805.0A patent/DE102018209805A1/de active Pending
- 2018-06-21 CN CN201810643220.4A patent/CN109119391B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US10939585B2 (en) | 2021-03-02 |
DE102018209805A1 (de) | 2018-12-27 |
JP2019009279A (ja) | 2019-01-17 |
CN109119391B (zh) | 2022-06-10 |
US20180376613A1 (en) | 2018-12-27 |
CN109119391A (zh) | 2019-01-01 |
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