ATE265132T1 - Wärmeableitung in elektrischem gerät - Google Patents
Wärmeableitung in elektrischem gerätInfo
- Publication number
- ATE265132T1 ATE265132T1 AT00311330T AT00311330T ATE265132T1 AT E265132 T1 ATE265132 T1 AT E265132T1 AT 00311330 T AT00311330 T AT 00311330T AT 00311330 T AT00311330 T AT 00311330T AT E265132 T1 ATE265132 T1 AT E265132T1
- Authority
- AT
- Austria
- Prior art keywords
- heat dissipation
- electrical device
- housing
- mounting
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9929800.2A GB9929800D0 (en) | 1999-12-17 | 1999-12-17 | Heat dissipation in electrical apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE265132T1 true ATE265132T1 (de) | 2004-05-15 |
Family
ID=10866473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00311330T ATE265132T1 (de) | 1999-12-17 | 2000-12-18 | Wärmeableitung in elektrischem gerät |
Country Status (5)
Country | Link |
---|---|
US (1) | US6498726B2 (de) |
EP (1) | EP1109432B1 (de) |
AT (1) | ATE265132T1 (de) |
DE (1) | DE60010025T2 (de) |
GB (1) | GB9929800D0 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES1050831Y (es) * | 2001-12-27 | 2002-09-16 | Lear Automotive Eeds Spain | Conector electronico integrado |
WO2003079436A1 (en) * | 2002-03-13 | 2003-09-25 | Tiqit Computers, Inc. | Computer assembly for facilitating heat dissipation |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
DE10246577A1 (de) * | 2002-10-05 | 2004-04-15 | Hella Kg Hueck & Co. | Leiterplatte mit Metallgehäuse |
US6700782B1 (en) * | 2002-11-27 | 2004-03-02 | Intel Corporation | Apparatus and method to retain an electronic component in a precise position during assembly manufacturing |
TW556475B (en) * | 2003-02-19 | 2003-10-01 | Accton Technology Corp | A cover apparatus for dissipating heat and shielding electromagnetic interference |
US6976532B2 (en) * | 2003-06-26 | 2005-12-20 | The Regents Of The University Of California | Anisotropic thermal applications of composites of ceramics and carbon nanotubes |
US7481267B2 (en) * | 2003-06-26 | 2009-01-27 | The Regents Of The University Of California | Anisotropic thermal and electrical applications of composites of ceramics and carbon nanotubes |
US6898084B2 (en) * | 2003-07-17 | 2005-05-24 | The Bergquist Company | Thermal diffusion apparatus |
US7760507B2 (en) * | 2007-12-26 | 2010-07-20 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
JP2011077578A (ja) * | 2009-09-29 | 2011-04-14 | Mitsumi Electric Co Ltd | チューナモジュール |
DE102013006539B4 (de) * | 2012-05-08 | 2022-11-17 | Sew-Eurodrive Gmbh & Co Kg | Kühlanordnung und Elektrogerät mit Gehäuseteil |
CN104655683B (zh) * | 2015-03-06 | 2017-11-21 | 金陵科技学院 | 能够降温的检测便携装置 |
DE102015213164A1 (de) * | 2015-07-14 | 2017-01-19 | Conti Temic Microelectronic Gmbh | Leistungselektronikanordnung, Wechselrichter mit einer Leistungselektronikanordnung |
DE102015218937A1 (de) | 2015-09-30 | 2017-03-30 | Continental Teves Ag & Co. Ohg | Elektronischer Schaltungsträger, Kühlkörper und elektrische Vorrichtung |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2625038B1 (fr) | 1987-12-22 | 1990-08-17 | Cit Alcatel | Procede et dispositif de refroidissement d'un boitier de circuit integre |
JP3017837B2 (ja) * | 1991-05-31 | 2000-03-13 | 株式会社日立製作所 | 電子機器装置 |
FR2679729B1 (fr) * | 1991-07-23 | 1994-04-29 | Alcatel Telspace | Dissipateur thermique. |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
KR19980701642A (ko) | 1995-01-25 | 1998-06-25 | 씨. 더블유. 준킨 | 인쇄회로기판 및 흡열 장치 |
US5673176A (en) | 1995-12-06 | 1997-09-30 | Dell Usa, L.P. | Integrated circuit dual cooling paths and method for constructing same |
US5991155A (en) | 1996-12-13 | 1999-11-23 | Mitsubishi Denki Kabushiki Kaisha | Heat sink assembly including flexible heat spreader sheet |
DE19701731A1 (de) | 1997-01-20 | 1998-07-23 | Bosch Gmbh Robert | Steuergerät bestehend aus mindestens zwei Gehäuseteilen |
JP3597368B2 (ja) * | 1998-02-16 | 2004-12-08 | アルプス電気株式会社 | 電子機器 |
JP3722616B2 (ja) * | 1998-03-09 | 2005-11-30 | 松下電器産業株式会社 | 情報端末機器 |
US6156980A (en) * | 1998-06-04 | 2000-12-05 | Delco Electronics Corp. | Flip chip on circuit board with enhanced heat dissipation and method therefor |
-
1999
- 1999-12-17 GB GBGB9929800.2A patent/GB9929800D0/en not_active Ceased
-
2000
- 2000-12-14 US US09/737,203 patent/US6498726B2/en not_active Expired - Lifetime
- 2000-12-18 AT AT00311330T patent/ATE265132T1/de not_active IP Right Cessation
- 2000-12-18 EP EP00311330A patent/EP1109432B1/de not_active Expired - Lifetime
- 2000-12-18 DE DE60010025T patent/DE60010025T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20010008481A1 (en) | 2001-07-19 |
US6498726B2 (en) | 2002-12-24 |
DE60010025D1 (de) | 2004-05-27 |
EP1109432A1 (de) | 2001-06-20 |
GB9929800D0 (en) | 2000-02-09 |
DE60010025T2 (de) | 2005-03-31 |
EP1109432B1 (de) | 2004-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE265132T1 (de) | Wärmeableitung in elektrischem gerät | |
EP0827373A1 (de) | Elektronisches Steuergerät mit Kühlkörper | |
EP0962123A4 (de) | Kühlkorpermontageanordnung für oberflächenmontierte elektronische packungen | |
DK0654819T3 (da) | Fremgangsmåde til fremstilling af en anordning til varmeafledning | |
DE602004005126D1 (de) | Elektronisches Leistungssystem mit passiver Kühlung | |
DK231287D0 (da) | System til aftagelig montering af halvledere paa ledersubstrater | |
ATE230554T1 (de) | Elektrisches bauteil und elektrischer schaltungsmodul mit verbundenen erdungsflächen | |
EP1487017A3 (de) | Thermisch verbessertes Substrat für ein "BGA" | |
KR970060465A (ko) | 표면 보상형 열 분산 장치 | |
DE58909004D1 (de) | Verfahren und Leiterplatte zum Montieren eines Halbleiter-Bauelements. | |
SE9800709D0 (sv) | Ledare | |
SE0203370D0 (sv) | Anordning | |
ATE368284T1 (de) | Elektronisches gerät mit einer datenspeichervorrichtung | |
FR2525852B1 (fr) | Appareil de montage de broches de section carree sur des plaquettes de circuit imprime | |
EP1715732A3 (de) | Gedruckte Leiterplattenstruktur mit einer Schicht auf einer ihrer Oberflächen zur Wärmeableitung durch Konvektion | |
ATE348503T1 (de) | Elektronisches gerät mit sicherer wärmeableitung | |
KR960013150A (ko) | 히트 싱크에 전자동력 부품의 체결장치 및 인쇄회로판에서의 장착방법 | |
KR970003769U (ko) | 회로기판 집적회로소자의 방열장치 | |
ES2046027T3 (es) | Dispositivo que utiliza unos componentes electronicos montados en superficie y que comprende un dispositivo de enfriamiento perfeccionado. | |
DE59400802D1 (de) | Kühlvorrichtung für eine elektrische Baugruppe | |
KR950029030U (ko) | 인쇄회로기판의 위치 고정장치 | |
ES1050831U (es) | Conector electronico integrado | |
TW491529U (en) | Fan heat dissipation device for integrated circuit | |
JP2830686B2 (ja) | 電子機器 | |
JP2001257490A (ja) | 電子機器の放熱構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |