TW200735736A - Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly - Google Patents

Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly

Info

Publication number
TW200735736A
TW200735736A TW095136704A TW95136704A TW200735736A TW 200735736 A TW200735736 A TW 200735736A TW 095136704 A TW095136704 A TW 095136704A TW 95136704 A TW95136704 A TW 95136704A TW 200735736 A TW200735736 A TW 200735736A
Authority
TW
Taiwan
Prior art keywords
assembly
leat
procedure
manufacturing
component
Prior art date
Application number
TW095136704A
Other languages
Chinese (zh)
Inventor
Thomas Leohken
Claus Lichtenberg
Peter Schibli
Andreas Frei
Original Assignee
Alphasem Gmbh
P U Schibli Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alphasem Gmbh, P U Schibli Engineering filed Critical Alphasem Gmbh
Publication of TW200735736A publication Critical patent/TW200735736A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

In an assembly, there are one semiconductor chip(2) and other compoment(3), for example a rigid or flexible printed circle board or a leadfram, are connected each other by one connection track(4). The connection track(4) is made of a electric conductive compound, which is spreadable in pasty or liquid form.
TW095136704A 2005-10-10 2006-10-03 Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly TW200735736A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/055133 WO2007042071A1 (en) 2005-10-10 2005-10-10 Assembly comprising at least two components that are electrically conductively operatively connected, and method for producing the assembly

Publications (1)

Publication Number Publication Date
TW200735736A true TW200735736A (en) 2007-09-16

Family

ID=36570941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136704A TW200735736A (en) 2005-10-10 2006-10-03 Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly

Country Status (2)

Country Link
TW (1) TW200735736A (en)
WO (1) WO2007042071A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509837B (en) * 2011-01-17 2015-11-21 Advanced Optoelectronic Tech Led chip, method for manufactruing thereof and led package
TWI806793B (en) * 2018-08-28 2023-06-21 晶元光電股份有限公司 Semiconductor device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150062838A1 (en) * 2013-09-04 2015-03-05 Osram Sylvania Inc. System for attaching devices to flexible substrates
EP3556186A1 (en) * 2016-12-14 2019-10-23 OSRAM GmbH A method of connecting electrically conductive formations, corresponding support structure and lighting device
EP3429322A1 (en) * 2017-07-11 2019-01-16 OSRAM GmbH A method for producing support structures for lighting devices and corresponding device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2761498B1 (en) * 1997-03-27 1999-06-18 Gemplus Card Int ELECTRONIC MODULE AND ITS MANUFACTURING PROCESS AND CHIP CARD INCLUDING SUCH A MODULE
FR2818801B1 (en) * 2000-12-21 2003-04-04 Gemplus Card Int INTERCONNECTION BY CUT-OUT INSULATION DEVICE AND CONDUCTION CORD
FR2823011B1 (en) * 2001-03-30 2004-11-19 Gemplus Card Int CONNECTION BY CONDUCTIVE CORD DEPOSIT ON CONNECTION AREA DEDICATED BY INSULATING MASK
JP3854103B2 (en) * 2001-06-28 2006-12-06 住友ベークライト株式会社 Conductive paste and semiconductor device using the paste

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI509837B (en) * 2011-01-17 2015-11-21 Advanced Optoelectronic Tech Led chip, method for manufactruing thereof and led package
TWI806793B (en) * 2018-08-28 2023-06-21 晶元光電股份有限公司 Semiconductor device

Also Published As

Publication number Publication date
WO2007042071A1 (en) 2007-04-19

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