TW200710876A - Electrically conductive paste, and flexible printed wiring board obtained using the same - Google Patents

Electrically conductive paste, and flexible printed wiring board obtained using the same

Info

Publication number
TW200710876A
TW200710876A TW095114875A TW95114875A TW200710876A TW 200710876 A TW200710876 A TW 200710876A TW 095114875 A TW095114875 A TW 095114875A TW 95114875 A TW95114875 A TW 95114875A TW 200710876 A TW200710876 A TW 200710876A
Authority
TW
Taiwan
Prior art keywords
electrically conductive
conductive paste
pts
same
wiring board
Prior art date
Application number
TW095114875A
Other languages
Chinese (zh)
Inventor
Yoichi Kamikoriyama
Kei Anai
Shigeki Nakayama
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200710876A publication Critical patent/TW200710876A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Abstract

To provide an electrically conductive paste which has high adhesiveness to polyimide of which a board is made, good bending-proof nature and good solvent resistance. The electrically conductive paste contains electrically conductive powder and a binder resin, wherein the binder resin is epoxide resin composite which includes one or more kinds of aluminum compounds and silane coupling agents. The electrically conductive paste is preferably composed of solvent of 5 to 100 pts.wt. The aluminum compounds of 0.01 to 5 pts.wt. And the silane coupling agents of 0.01 to 5 pts.wt. When the electrically conductive powder is 100 pts.wt.
TW095114875A 2005-04-27 2006-04-26 Electrically conductive paste, and flexible printed wiring board obtained using the same TW200710876A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005129627A JP2006310022A (en) 2005-04-27 2005-04-27 Electrically conductive paste, and flexible printed wiring board obtained using the same

Publications (1)

Publication Number Publication Date
TW200710876A true TW200710876A (en) 2007-03-16

Family

ID=37307979

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114875A TW200710876A (en) 2005-04-27 2006-04-26 Electrically conductive paste, and flexible printed wiring board obtained using the same

Country Status (3)

Country Link
JP (1) JP2006310022A (en)
TW (1) TW200710876A (en)
WO (1) WO2006118181A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009066396A1 (en) * 2007-11-22 2009-05-28 Asahi Glass Company, Limited Ink for conductive film formation and process for producing printed wiring board
JP5115676B1 (en) * 2011-07-29 2013-01-09 日立化成工業株式会社 Adhesive composition, film-like adhesive and circuit connecting material using the same, circuit member connection structure, and manufacturing method thereof
JP6263146B2 (en) * 2015-04-06 2018-01-17 株式会社ノリタケカンパニーリミテド Substrate with conductive film, method for producing the same, and conductive paste for polyimide substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63228525A (en) * 1987-03-17 1988-09-22 東洋インキ製造株式会社 Electron beam hardening type conducting paste
JP3697401B2 (en) * 2001-02-22 2005-09-21 株式会社ノリタケカンパニーリミテド Conductor paste and method for producing the same
DE10297544B4 (en) * 2001-12-18 2015-10-29 Asahi Kasei Kabushiki Kaisha Process for producing a metal thin film
JP4219822B2 (en) * 2003-01-14 2009-02-04 シャープ株式会社 Wiring material, wiring board, manufacturing method thereof, and display panel

Also Published As

Publication number Publication date
JP2006310022A (en) 2006-11-09
WO2006118181A1 (en) 2006-11-09

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