DE69304304T2 - Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke - Google Patents

Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke

Info

Publication number
DE69304304T2
DE69304304T2 DE69304304T DE69304304T DE69304304T2 DE 69304304 T2 DE69304304 T2 DE 69304304T2 DE 69304304 T DE69304304 T DE 69304304T DE 69304304 T DE69304304 T DE 69304304T DE 69304304 T2 DE69304304 T2 DE 69304304T2
Authority
DE
Germany
Prior art keywords
combination
semiconductor device
heat sink
electronic semiconductor
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69304304T
Other languages
English (en)
Other versions
DE69304304D1 (de
Inventor
Paolo Casati
Giuseppe Marchisi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
SGS Thomson Microelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SRL filed Critical SGS Thomson Microelectronics SRL
Publication of DE69304304D1 publication Critical patent/DE69304304D1/de
Application granted granted Critical
Publication of DE69304304T2 publication Critical patent/DE69304304T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69304304T 1993-04-05 1993-04-05 Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke Expired - Fee Related DE69304304T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP93830145A EP0619605B1 (de) 1993-04-05 1993-04-05 Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke

Publications (2)

Publication Number Publication Date
DE69304304D1 DE69304304D1 (de) 1996-10-02
DE69304304T2 true DE69304304T2 (de) 1997-01-02

Family

ID=8215141

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69304304T Expired - Fee Related DE69304304T2 (de) 1993-04-05 1993-04-05 Kombination einer elektronischen Halbleiteranordnung und einer Wärmesenke

Country Status (4)

Country Link
US (1) US5521439A (de)
EP (1) EP0619605B1 (de)
JP (1) JPH06310632A (de)
DE (1) DE69304304T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2732184B1 (fr) * 1995-03-21 1997-04-30 Asulab Sa Module electrique de puissance
AU5740396A (en) * 1995-05-11 1996-11-29 International Electronic Research Corporation Enhanced heat sink
GB2300974B (en) * 1995-05-16 1999-12-29 Redpoint Thermalloy Ltd A heatsink and a method of forming the same
DE69530490D1 (de) * 1995-11-30 2003-05-28 St Microelectronics Srl Wärmeableiter für elektronische Anordnungen
DE19612259A1 (de) * 1996-03-28 1997-10-02 Sel Alcatel Ag IC-Bauelement mit Kühlanordnung
KR0181092B1 (ko) * 1996-04-30 1999-05-15 배순훈 전자 회로부품의 방열 장치
US5664622A (en) * 1996-05-30 1997-09-09 Chiou; Ming Der Heat sink with deformable hangers for mounting
US5734556A (en) * 1996-06-26 1998-03-31 Sun Microsystems, Inc. Mechanical heat sink attachment having two pin headers and a spring clip
US5777844A (en) * 1996-08-30 1998-07-07 General Electric Company Electronic control with heat sink
US5932925A (en) * 1996-09-09 1999-08-03 Intricast, Inc. Adjustable-pressure mount heatsink system
US5664624A (en) * 1996-11-04 1997-09-09 Chin-Fu Tsai Sloped wall type heat radiating member for chip
US6082440A (en) * 1997-02-06 2000-07-04 Thermalloy, Incorporated Heat dissipation system having releasable attachment assembly
US6075703A (en) * 1997-03-26 2000-06-13 Samsung Electronics Co., Ltd. Heat sink assembly
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US5898571A (en) * 1997-04-28 1999-04-27 Lsi Logic Corporation Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages
US6061239A (en) * 1997-05-16 2000-05-09 Psc Computer Products Cam-type retainer clip for heat sinks for electronic integrated circuits
US5959350A (en) * 1997-05-21 1999-09-28 Hon Hai Precision Ind. Co., Ltd. Fixing device for securing a heat sink to a CPU module
US5860472A (en) * 1997-09-03 1999-01-19 Batchelder; John Samual Fluid transmissive apparatus for heat transfer
US5909358A (en) * 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip
KR100310101B1 (ko) 1998-07-21 2001-11-15 윤종용 히트 싱크 고정 장치
US6222734B1 (en) 1999-11-29 2001-04-24 Intel Corporation Clamping heat sinks to circuit boards over processors
US6385047B1 (en) 1999-12-06 2002-05-07 Cool Shield, Inc. U-shaped heat sink assembly
US6892796B1 (en) * 2000-02-23 2005-05-17 General Motors Corporation Apparatus and method for mounting a power module
EP1128432B1 (de) 2000-02-24 2016-04-06 Infineon Technologies AG Befestigung von Halbleitermodulen an einem Kühlkörper
US6347036B1 (en) 2000-03-29 2002-02-12 Dell Products L.P. Apparatus and method for mounting a heat generating component in a computer system
US6675885B2 (en) * 2001-04-12 2004-01-13 Ching-Sung Kuo Heat-dissipating device for electronic components
KR20050027110A (ko) * 2002-07-17 2005-03-17 스미또모 가가꾸 가부시끼가이샤 포르밀시클로프로판카르복실산 에스테르 화합물의 제조방법
US6798663B1 (en) * 2003-04-21 2004-09-28 Hewlett Packard Development Company, L.P. Heat sink hold-down with fan-module attach location
US7480143B2 (en) * 2003-04-21 2009-01-20 Hewlett-Packard Development Company, L.P. Variable-gap thermal-interface device
US20040226688A1 (en) * 2003-04-30 2004-11-18 Arthur Fong Application specific apparatus for dissipating heat from multiple electronic components
US7203065B1 (en) 2003-11-24 2007-04-10 Ciena Corporation Heatsink assembly
TW200525338A (en) * 2004-01-29 2005-08-01 Asustek Comp Inc Fan fasten device and electrical apparatus thereof
EP2269429B1 (de) * 2008-04-17 2011-11-02 Koninklijke Philips Electronics N.V. Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
US10684086B2 (en) * 2017-07-19 2020-06-16 Craig D. Churchill Spent casing catch and release trap mechanism with clip
JP6939392B2 (ja) 2017-10-17 2021-09-22 三菱電機株式会社 パワーモジュール

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7610306A (nl) * 1976-09-16 1978-03-20 Du Pont Contactinrichting voor een geintegreerde schakeling.
DE3423725A1 (de) * 1984-06-27 1986-01-09 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum loesbaren befestigen eines kuehlkoerpers auf einem integrierten baustein
DE3434792A1 (de) * 1984-06-27 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum loesbaren befestigen eines kuehlkoerpers auf einem integrierten baustein
US4745456A (en) * 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
US4933746A (en) * 1988-09-12 1990-06-12 Aavid Engineering, Inc. Three-legged clip
JPH0298053A (ja) * 1988-10-04 1990-04-10 Matsushita Electric Ind Co Ltd 燃料電池用白金ルテニウム触媒の製造法
JPH0394456A (ja) * 1989-09-06 1991-04-19 Matsushita Electron Corp 半導体装置
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
EP0484180A1 (de) * 1990-11-01 1992-05-06 Fujitsu Limited Verkapselte Halbleiteranordnung mit optimierter Wärmeabführung
US5276585A (en) * 1992-11-16 1994-01-04 Thermalloy, Inc. Heat sink mounting apparatus

Also Published As

Publication number Publication date
DE69304304D1 (de) 1996-10-02
EP0619605A1 (de) 1994-10-12
JPH06310632A (ja) 1994-11-04
US5521439A (en) 1996-05-28
EP0619605B1 (de) 1996-08-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee