KR950031766U - 회로기판의 방열판 고정장치 - Google Patents

회로기판의 방열판 고정장치

Info

Publication number
KR950031766U
KR950031766U KR2019940009733U KR19940009733U KR950031766U KR 950031766 U KR950031766 U KR 950031766U KR 2019940009733 U KR2019940009733 U KR 2019940009733U KR 19940009733 U KR19940009733 U KR 19940009733U KR 950031766 U KR950031766 U KR 950031766U
Authority
KR
South Korea
Prior art keywords
circuit board
heat sink
fixing device
sink fixing
heat
Prior art date
Application number
KR2019940009733U
Other languages
English (en)
Other versions
KR200141280Y1 (ko
Inventor
신영대
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019940009733U priority Critical patent/KR200141280Y1/ko
Publication of KR950031766U publication Critical patent/KR950031766U/ko
Application granted granted Critical
Publication of KR200141280Y1 publication Critical patent/KR200141280Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR2019940009733U 1994-04-28 1994-04-28 회로기판의 방열판 고정장치 KR200141280Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940009733U KR200141280Y1 (ko) 1994-04-28 1994-04-28 회로기판의 방열판 고정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940009733U KR200141280Y1 (ko) 1994-04-28 1994-04-28 회로기판의 방열판 고정장치

Publications (2)

Publication Number Publication Date
KR950031766U true KR950031766U (ko) 1995-11-22
KR200141280Y1 KR200141280Y1 (ko) 1999-05-15

Family

ID=19382443

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940009733U KR200141280Y1 (ko) 1994-04-28 1994-04-28 회로기판의 방열판 고정장치

Country Status (1)

Country Link
KR (1) KR200141280Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180007579A (ko) * 2016-07-13 2018-01-23 삼성전기주식회사 인쇄회로기판

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180007579A (ko) * 2016-07-13 2018-01-23 삼성전기주식회사 인쇄회로기판

Also Published As

Publication number Publication date
KR200141280Y1 (ko) 1999-05-15

Similar Documents

Publication Publication Date Title
KR970003769U (ko) 회로기판 집적회로소자의 방열장치
KR950031766U (ko) 회로기판의 방열판 고정장치
KR940018672U (ko) 집적 회로 소자의 방열판
KR960003540U (ko) 인쇄회로기판 고정장치
KR960026375U (ko) 전자부품용 방열판의 고정구조
KR970060185U (ko) 히트싱크 고정장치
KR970015763U (ko) 발열회로부품용 히트싱크
KR950007662U (ko) 집적회로의 일괄 방열구조
KR950007666U (ko) 집적회로의 방열구조
KR950007667U (ko) 집적회로의 방열구조
KR970048634U (ko) 회로기판 실장용 방열판의 고정 단자
KR960019545U (ko) 회로기판의 고정장치
KR960009592U (ko) 모니터의 메인회로기판 고정장치
KR950034619U (ko) 모니터의 메인회로기판 고정장치
KR970015765U (ko) 히트 싱크의 회로 소자 부착구조
KR970011737U (ko) 모니터용 회로소자의 방열판
KR950034684U (ko) 메인 회로기판의 와이어 고정장치
KR950002534U (ko) 인쇄회로 기판과 방열판의 접합장치
KR970064628U (ko) 회로기판에 설치되는 발열 히트싱크의 고정장치
KR950007663U (ko) 회로 소자용 방열판 취부구조
KR970015761U (ko) 회로기판 고정장치
KR950031683U (ko) 모니터의 회로기판 고정장치
KR940019869U (ko) 전자기기용 방열판
KR960003548U (ko) 전력용 반도체소자의 방열판 고정장치
KR960012949U (ko) 방열성이 우수한 전력용 회로기판

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20071129

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee