AU5740396A - Enhanced heat sink - Google Patents

Enhanced heat sink

Info

Publication number
AU5740396A
AU5740396A AU57403/96A AU5740396A AU5740396A AU 5740396 A AU5740396 A AU 5740396A AU 57403/96 A AU57403/96 A AU 57403/96A AU 5740396 A AU5740396 A AU 5740396A AU 5740396 A AU5740396 A AU 5740396A
Authority
AU
Australia
Prior art keywords
heat sink
enhanced heat
enhanced
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU57403/96A
Inventor
Peter S. Chow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Electronic Research Corp
Original Assignee
International Electronic Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Electronic Research Corp filed Critical International Electronic Research Corp
Publication of AU5740396A publication Critical patent/AU5740396A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU57403/96A 1995-05-11 1996-05-10 Enhanced heat sink Abandoned AU5740396A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43927895A 1995-05-11 1995-05-11
US439278 1995-05-11
PCT/US1996/006696 WO1996036205A1 (en) 1995-05-11 1996-05-10 Enhanced heat sink

Publications (1)

Publication Number Publication Date
AU5740396A true AU5740396A (en) 1996-11-29

Family

ID=23744063

Family Applications (1)

Application Number Title Priority Date Filing Date
AU57403/96A Abandoned AU5740396A (en) 1995-05-11 1996-05-10 Enhanced heat sink

Country Status (2)

Country Link
AU (1) AU5740396A (en)
WO (1) WO1996036205A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62274798A (en) * 1986-05-19 1987-11-28 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション Heatsink structure
DE69209042T2 (en) * 1991-12-16 1996-10-02 At & T Corp Heat dissipation through narrow-channel cooling fins to cool electronic high-performance components
GB2276763B (en) * 1993-03-30 1997-05-07 Thermalloy Inc Method and apparatus for dissipating thermal energy
EP0619605B1 (en) * 1993-04-05 1996-08-28 STMicroelectronics S.r.l. Combination of an electronic semiconductor device and a heat sink
US5486981A (en) * 1994-08-12 1996-01-23 International Electronic Research Corporation Heat dissipating assembly

Also Published As

Publication number Publication date
WO1996036205A1 (en) 1996-11-14

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