AU3330695A - Heat sink - Google Patents

Heat sink

Info

Publication number
AU3330695A
AU3330695A AU33306/95A AU3330695A AU3330695A AU 3330695 A AU3330695 A AU 3330695A AU 33306/95 A AU33306/95 A AU 33306/95A AU 3330695 A AU3330695 A AU 3330695A AU 3330695 A AU3330695 A AU 3330695A
Authority
AU
Australia
Prior art keywords
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU33306/95A
Inventor
Barbara Kiiskila Lograsso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iowa State University Research Foundation ISURF
Original Assignee
University of Iowa Research Foundation UIRF
Iowa State University Research Foundation ISURF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Iowa Research Foundation UIRF, Iowa State University Research Foundation ISURF filed Critical University of Iowa Research Foundation UIRF
Publication of AU3330695A publication Critical patent/AU3330695A/en
Abandoned legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU33306/95A 1994-08-22 1995-08-18 Heat sink Abandoned AU3330695A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29398294A 1994-08-22 1994-08-22
US293982 1994-08-22
PCT/US1995/010511 WO1996006321A1 (en) 1994-08-22 1995-08-18 Heat sink

Publications (1)

Publication Number Publication Date
AU3330695A true AU3330695A (en) 1996-03-14

Family

ID=23131387

Family Applications (1)

Application Number Title Priority Date Filing Date
AU33306/95A Abandoned AU3330695A (en) 1994-08-22 1995-08-18 Heat sink

Country Status (2)

Country Link
AU (1) AU3330695A (en)
WO (1) WO1996006321A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7108055B2 (en) * 2002-03-29 2006-09-19 Advanced Energy Technology Inc. Optimized heat sink using high thermal conducting base and low thermal conducting fins
US6919504B2 (en) 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
USD906269S1 (en) 2019-08-28 2020-12-29 Carbice Corporation Flexible heat sink
USD904322S1 (en) 2019-08-28 2020-12-08 Carbice Corporation Flexible heat sink
US20210063099A1 (en) 2019-08-28 2021-03-04 Carbice Corporation Flexible and conformable polymer-based heat sinks and methods of making and using thereof
USD903610S1 (en) 2019-08-28 2020-12-01 Carbice Corporation Flexible heat sink

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614587B2 (en) * 1967-08-24 1976-05-13 Siemens AG, 1000 Berlin und 8000 München HOUSING FOR A SEMICONDUCTOR COMPONENT
US3694182A (en) * 1971-04-20 1972-09-26 Ford Motor Co Glass tempering die construction
DE2511010A1 (en) * 1975-03-13 1976-09-23 Bosch Gmbh Robert Cooling for electronic components - involves using components embedded in heat conductive mass of metal powder in resin which has large heat transfer surface
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
US4838347A (en) * 1987-07-02 1989-06-13 American Telephone And Telegraph Company At&T Bell Laboratories Thermal conductor assembly
US4869954A (en) * 1987-09-10 1989-09-26 Chomerics, Inc. Thermally conductive materials
US5285108A (en) * 1991-06-21 1994-02-08 Compaq Computer Corporation Cooling system for integrated circuits

Also Published As

Publication number Publication date
WO1996006321A1 (en) 1996-02-29

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