CN110431664A - 将led元件安装在平的载体上 - Google Patents

将led元件安装在平的载体上 Download PDF

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CN110431664A
CN110431664A CN201880019846.6A CN201880019846A CN110431664A CN 110431664 A CN110431664 A CN 110431664A CN 201880019846 A CN201880019846 A CN 201880019846A CN 110431664 A CN110431664 A CN 110431664A
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electrical contact
contact portion
installation
carrier
lighting apparatus
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CN110431664B (zh
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M.德克斯
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Lumileds Holding BV
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Abstract

描述了一种照明设备和一种制造照明设备（10）的方法。平的载体（14）具有面向前部和后部相反方向的前部和后部表面（16，18）。载体（14）包括切口（40）。在后部表面（18）上提供有载体侧电接触部分（26）。安装元件（30）包括LED元件（12）和电连接至该LED元件（12）的安装侧电接触部分（36）。安装元件（30）被布置在后部表面（18）上，使得在载体侧和安装侧电接触部分（26，36）之间形成电接触，并且使得LED元件（12）被布置在切口（40）上或其内以发射光至前部方向。散热片元件以热接触的方式置于安装元件的后部。

Description

将LED元件安装在平的载体上
技术领域
本发明涉及一种照明设备和一种制造照明设备的方法。更具体地，本发明涉及安装在平的载体上的照明设备。
背景技术
诸如电路板的平的载体被广泛用于安装电子组件。通过在与安装的电子组件相互连接的电路板上提供导体轨道，形成电子电路。电路板一般地由诸如纤维增强环氧树脂材料的非导电材料制成。导电轨道可以例如提供为在平的载体的一侧或两侧的层压铜片。
越来越多地用于照明用途的LED元件可以例如通过SMD 焊连接而安装在电路板上。
参考US 2011/0 215 354 A1示出了发光器件（LED）封装组件，其包括LED芯片和载体芯片。载体芯片包括载体芯片的表面上的四个焊盘，其中第三和第四焊盘分别电连接至第一和第二焊盘。第一、第二、第三和第四焊盘被布置在载体芯片的相同表面上。LED封装组件进一步包括第一和第二金属凸块，其通过倒装式焊接而分别将第一和第二焊盘焊接到LED芯片上。附加地，窗口型模块基板通过倒装式焊接被焊接到第三和第四焊盘上。窗口型模块基板包括窗口，其中LED芯片被配置为朝向该窗口发射光。参考WO 2006/105 644 A1示出了用于一个或多个发光元件的安装配件，其中安装配件被配置使得该一个或多个发光元件在下方连接至载体。该载体包括一个或多个光传输区域，其中一个或多个发光元件的每个发光元件与光传输区域对准，使得光能够穿过载体。发光元件的下方安装可以通过热管理系统来提供对于与一个或多个发光元件相关联的冷却接口的容易的热访问。
发明内容
提出一种照明设备和一种制造其的方法可以是所考虑的目的，所述照明设备允许以非常适于照明应用的方式在平的载体上容易地安装LED元件。
这可以通过根据权利要求1的照明设备和根据权利要求13的制造方法来实现。从属权利要求提及优选的实施例。
本发明的发明人考虑到具有充足操作功率以在照明应用需求中使用的LED元件除电连接之外还要求允许消散操作中生成的热量的热接口。虽然这可以通过使用具有良好导热性的材料(诸如陶瓷基板)作为LED元件的载体来解决，但是在昂贵的陶瓷基板上提供诸如连接器或驱动器电子器件的附加组件会显著增加成本。特别地，对于多个LED元件，成本和尺寸会增加。
发明人已经认识到如果LED元件不像往常一样安装为背离于其上安装的载体表面，而是如果LED元件以反向模式安装，则电和热连接都可以被简化。
根据本发明的照明设备包括具有相对的前部表面和后部表面的平的载体。特别地，平的载体可以是任何材料制作的电路板，优选地是电绝缘材料，特别是塑料材料。在平的载体的表面的至少一个表面上提供电接触部分，该表面将被称为后部表面。每个电接触部分包括导电材料制作的元件，诸如金属，特别是铜。在载体的后部表面上提供的接触部分将进一步被称为载体侧电接触部分。特别地，其可以提供为平的接触焊盘。
根据本发明的平的载体包括切口。切口是在前部和后部表面之间的通道。切口包括切口区域，该切口区域可以被例如由平的载体的部分形成的至少两个，优选地为三个或更多，进一步优选地为四个或更多切口边缘所环绕。该边缘可以优选地是直的。优选地，切口形成为平的载体中的孔，其可以被载体材料完全包围。
在安装元件上提供多个LED元件。此处术语“LED元件”指代任何种类的一个或多个固态照明元件，诸如特别地为发光二极管、有机发光二极管、激光二极管等。LED元件可以由单个固态照明元件或全都紧凑布置的多个这种固态照明元件组成。
安装元件优选地由电绝缘材料制作，进一步优选地该材料与平的载体的材料不同。例如，安装元件可以由陶瓷材料制作，诸如特别是AlN。在安装元件上提供将被称为安装侧电接触部分的多个电接触部分并且该多个电接触部分例如通过在安装元件的表面上提供的导体而被电连接至其上的LED元件。
根据本发明，安装元件或至少其部分被布置在载体的后部表面上，使得在载体侧电接触部分和安装侧电接触部分之间形成电接触。优选地，安装侧和载体侧电接触部分被直接布置在彼此的上面，或直接接触或通过导电连接（诸如焊连接）而连接。
安装元件相对于载体而放置使得LED元件被布置在切口上或之内，使得光被发射到前部方向。优选地，安装元件或至少其部分被布置而凸出到切口中或覆盖切口，使得提供在其上的LED元件被布置在由切口所限定的窗口后面，或凸出至或者甚至通过此窗口。因此，LED元件的发光部分可以面向前部方向，即与于其上连接安装侧接触元件的后部表面相对。因此，安装元件的布置可以称为反向安装。
进一步地，散热片元件以与安装元件热接触的方式放置。散热片元件置于安装元件的后部，使得其可以置于载体的后部表面的上面或上方。散热片元件优选地包括高导热性材料，诸如金属，特别是铜。
所提出的照明设备和制造方法允许将LED元件容易地安装在平的载体（诸如电路板）上。可以使用例如对于SMD 组件可用的常规放置和连接技术，诸如焊接并且特别是回流焊接。因此可以实现安放的高准确性。如下文将进一步解释的，反向安装概念对于多个可单独操作的LED元件（诸如LED元件线或阵列）是特别有利的。因为安装元件可以保持微小并且常见电路板材料可以用于载体，可以形成相对不太昂贵的配件。
优选地，LED元件和安装侧接触部分被布置在安装元件的相同侧。安装侧接触部分和LED元件的发光部分优选地都面向前部方向。
根据本发明，安装元件提供有多个LED元件，以及连接至LED元件的多个安装侧电接触部分。对应于安装侧电接触部分，在平的载体的后部表面上提供有多个载体侧电接触部分。安装侧和载体侧电接触部分然后以彼此电接触的方式提供，使得可以建立到LED元件中的每一个LED元件的电连接。因此，提供多个可单独操作的LED元件是可能的，该多个可单独操作的LED元件可以彼此独立地而被关闭或开启，然而它们可以共用一个共同终端。此概念可应用于单个LED元件，但也可以例如应用于2、3或更多个单独LED元件，优选地为5个或更多，进一步优选地为10个或更多。该概念甚至可以用于大量LED元件，例如高达1000或高达500个LED元件，并且优选地高达100个LED元件。特别地，对于多个LED元件，反向安装布置和经由安装侧和载体侧接触部分的电接触允许设置对于大量LED元件的非常紧凑的结构和容易的制造。
可以在切口的一侧，例如沿切口的一个边缘，在平的载体的后部表面上提供全部的接触部分。然而优选地，在切口的不止一侧提供电接触部分，特别在其相对侧，或围绕切口的所有侧上。在优选地实施例中，第一载体侧电接触部分连接到第一安装侧电接触部分，并且第二载体侧电接触部分连接到第二安装侧电接触部分。第一载体侧和安装侧电接触部分与第二载体侧和安装侧电接触部分通过切口而隔开。这有效利用了对于接触部分的布置的可用空间，特别是对于大量LED元件。
在优选的实施例中，可以在载体的后部表面上提供电导体部分，特别是平的导体轨道。该导体部分可以连接至载体侧接触部分。可以在载体的后部表面上提供电子电路，其电连接至载体侧接触部分。电子电路可以包括一个或多个电子组件和/或一个或多个电插头连接器。电路的组件可以通过电导体部分相互连接。特别地，电子电路可以是设置为向LED元件提供电功率的驱动器电路。
安装元件优选地包括一个或多个平的安装部分，其可以被布置在载体的后部表面上。安装元件可以进一步包括至少一个升高部分，其可以被布置为至少部分地凸出到切口中。LED元件可以被布置在该升高部分。取决于升高部分的高度，LED元件可以提供在切口内，或者至少基本上与载体前部表面齐平，或者甚至可以设置从前部表面凸出。
散热片元件可以优选地被固定在载体上，例如通过诸如通过胶接或焊接的材料连接或通过诸如通过一个或多个螺丝、夹具等机械连接而保持。将散热片元件固定到载体而非安装元件仅提供用于安全连接的大表面。
在优选的实施例中，安装元件可以包括平坦后部表面，其可以比切口大。散热片元件可以被提供为覆盖后部表面，提供用于良好热接触。
本发明的这些和其他方面根据下文描述的实施例将是清楚的，并且将参照下文描述的实施例进行阐述。
附图说明
图1示出了根据第一实施例的照明设备的透视图；
图2示出了沿A..A的图1的照明设备的横截面；
图3a、3b示出了图1、图2的照明设备的组装阶段；
图4示出了根据第二实施例的照明设备的截面图；
图5示出了根据第三实施例的照明设备的截面图。
具体实施方式
图1中示出的照明设备10包括安装在作为平的载体的印刷电路板PCB 14上的阵列（在所示示例中是5x2阵列）布置的多个单独LED 12。
PCB 14具有前部表面16和后部表面18。LED 12的平的光出射表面面向前部方向，即从前部表面16向外。
如在图2的截面图中示出的，在PCB 14的后部表面18上提供用于LED 12的电子电路，电子电路包括插头连接器22（仅示意性示出）和提供为后部表面18的铜层的导体轨道（24）。
LED 12安装在陶瓷（AlN）安装元件30上，安装元件30包括外围平的安装部分32和从平的安装部分32凸出至前部方向的中心升高部分34。LED 12安装在升高部分34上。
切口40形成在PCB 14中，连接前部表面16和后部表面18。在示出的示例中，切口40形成为由四个直边缘环绕的矩形窗口。
安装元件30同其安装部分32置于PCB 14的后部表面18之上，使得中心部分34（在所示出的示例中，中心部分34是升高的）被布置在由切口40形成的窗口内。LED 12朝向前部方向，即发光表面平行于前部表面16。因此，如果LED 12被供应电操作功率，则其发射光至前部方向。
LED 12电连接至在安装元件30的安装部分32上提供的接触焊盘36。接触焊盘36被称为安装侧接触部分。它们提供在安装元件30的与LED 12相同的一侧。。由安装元件30的表面上的平的导体（未示出）提供至LED 12的电连接。
在该优选的示例中，安装元件30由作为具有相对良好的导热性的电绝缘陶瓷材料AlN制作，以消散LED 12在操作中生成的热量。
安装元件30置于PCB 14的后部表面18上，使得安装侧接触焊盘36直接与PCB 14的后部表面18上的载体侧接触焊盘26相对布置。载体侧接触焊盘26电连接到提供于后部表面18上的导体轨道24或形成为导体轨道24的部分。
安装侧接触焊盘36和载体侧接触焊盘26被布置在彼此的上面，形成接触对。它们通过在其间提供的焊层42电连接。
插头连接器22还包括与接触焊盘46相对布置的接触焊盘44，接触焊盘46形成为PCB 14的后表面18上的导体轨道24的一部分。此处，还形成焊连接48。因此，LED 12经由安装侧和载体侧接触焊盘36、26，导体轨道24和焊连接48而电连接到插头连接器44。因此，可以通过从插头连接器44经过所描述的连接路径而供应电操作功率来操作LED。因为LED 12的每一个LED被连接至安装侧接触焊盘36之一（具有共同的接地连接），所以LED 12均可单独操作。LED 12的阵列可以例如在车辆头灯中作为矩阵灯或ADB灯（自适应远光灯）来使用。
由LED 12在操作中生成的热量通过导热的安装元件30而消散，进一步通过安装在安装元件30的后侧的并且通过例如导热膏或胶水的导热层50而连接的散热片20而消散。
散热片20通过螺丝52而固定于PCB 14。
图3a、3b示出了制造照明设备10的步骤。PCB 14提供有导体轨道24，在切口40的两侧上、在后部表面18上形成接触焊盘26、46。在接触焊盘26、46上提供焊膏42、48。安装元件30反向安装在PCB 14的后部表面18上，其中LED 12和安装侧接触焊盘36这两者都面向前部方向。
安装元件安放在PCB 14的后部表面18上，使得安装侧和载体侧接触焊盘26、36被直接安放在彼此的上面，之间有焊膏42。安装元件30如此安放使得于其上安装LED 12的中心部分34安放在切口40形成的窗口内。
插头连接器22也被安放在PCB 14的后部表面18上，其中接触焊盘44和46面向彼此，其中插入焊膏48。
然后对整个配件10进行回流焊接，使得焊膏42、48熔化并且在相对的接触焊盘26、36、44、46之间提供焊连接，因此将安装元件30以反向安装放置而固定。
在另一步骤（未示出），散热片20利用插入层50被安放在PCB 14的后部表面18上，并通过螺丝52而固定，使得安装元件30的后部表面与散热片20热接触。
图4、5示出了照明设备的可替换的第二和第三实施例。第二和第三实施例对应于根据第一实施例的照明设备10。在下文中，将仅解释区别。相同附图标记指代相同部分。
在图4中示出的第二实施例，安装元件30是完全平的，即安装有LED 12的中心部分没有凸起。LED 12被提供在切口40上以通过由切口40形成的窗口来发射光至前部方向。
根据图5中示出的第三实施例，安装元件30仅在切口40的一个侧上提供有安装部分32，而不是如第一实施例10中的两侧。
虽然在附图和前述描述中已经详细说明和描述本发明，但这样的说明和描述被认为是说明性或示例性的而非约束性的；本发明不限于公开的实施例。
例如，在图1中示出的LED 12的5x2阵列仅是安装元件30上的LED 12的布置的一个示例。在不同的实施例中，照明设备可以包括更多或更少LED，并且LED 12可以被不同布置。
虽然在示出的实施例中，PCB 14的后部表面18仅包括包含导体轨道24和插头连接器22的电子电路，但在PCB 14上提供形成不同电子电路的另外的电子组件也是可能的。
虽然在示出的示例中，切口40在PCB 14中是矩形孔，由PCB 14的四个边缘完全环绕，但切口40可以不同地成形，并且可以例如在PCB 14的外部边缘形成，使得它可以不在所有侧被PCB 14完全围绕。
在可替换的实施例中，安装元件30由一种或多种不同材料制作。特别地，安装元件可以包括由良好导热材料（例如金属，诸如铝、铜或其他金属，包括含铜合金）制作的部分，例如核心部分。如果核心部分是导电的，优选地，它可以被全部或部分由绝缘体或层覆盖，使得LED 12和/或将LED连接至安装侧接触焊盘36的导体可以与核心部分电绝缘。该绝缘体或层可以仍然被设计为实现良好导热，例如通过选择低厚度和/或良好导热的绝缘材料，例如陶瓷材料。
在权利要求中，任何附图标记不应被解释为限制权利要求。词语“包括”不排除权利要求中列出的那些元件或步骤之外的元件或步骤的存在。元件前面的不定冠词“一”（“a”或“an”）不排除多个这样的元件的存在。在相互不同的从属权利要求中记载某些措施的纯粹事实不指示这些措施的组合不能用于获益。

Claims (14)

1.照明设备，包括：
平的载体（14），具有面向相反的前部和后部方向的前部和后部表面（16，18），所述载体（14）包括切口（40），在所述后部表面（18）上提供有多个载体侧电接触部分（26），
安装元件（30），包括多个可单独操作的LED元件（12）和电连接至所述LED元件（12）的多个安装侧电接触部分（36），所述安装元件（30）被布置在所述后部表面（18）上，使得在所述载体侧电接触部分（26）和所述安装侧电接触部分（36）之间形成电接触，并且使得所述LED元件（12）被布置在所述切口（40）上或其内以发射光至所述前部方向，
以及散热片元件（20），被放置在所述安装元件（30）的后部，与其热接触。
2.根据权利要求1所述的照明设备，其中
在所述安装元件（30）的相同侧提供所述安装侧电接触部分（36）和所述LED元件（12）。
3.根据权利要求2所述的照明设备，其中
至少第一载体侧电接触部分（26）被提供为连接至第一安装侧电接触部分（36），并且第二载体侧电接触部分（26）被提供为连接至第二安装侧电接触部分（36），
其中所述第一载体侧和安装侧电接触部分（26，36）与所述第二载体侧和安装侧电接触部分（26，36）通过所述切口（40）而隔开。
4.根据上述权利要求之一所述的照明设备，其中
所述安装元件（30）由陶瓷材料制作。
5.根据上述权利要求之一所述的照明设备，其中
所述散热片（20）由金属材料制作。
6.根据上述权利要求之一所述的照明设备，其中
所述载体（14）由塑料材料制作。
7.根据上述权利要求之一所述的照明设备，其中
所述安装侧电接触部分（26）通过焊连接而被连接至所述载体侧电接触部分（36）。
8.根据上述权利要求之一所述的照明设备，其中
在所述后部表面（18）上提供电导体部分（24），所述电导体部分（24）被连接至所述载体侧接触部分（26）。
9.根据上述权利要求之一所述的照明设备，其中
在所述后部表面（18）上提供电子电路，所述电子电路电连接至所述载体侧接触部分（26），
所述电子电路包括至少一个电子组件和/或电插头连接器（22）。
10.根据上述权利要求之一所述的照明设备，其中
所述安装元件（30）包括凸出至所述切口（40）的升高部分（34）；
所述LED元件（12）被布置在所述升高部分（34）上。
11.根据上述权利要求之一所述的照明设备，其中
所述散热片元件（20）被固定于所述载体（14）。
12.根据上述权利要求之一所述的照明设备，其中
所述安装元件（30）包括比所述切口（40）大的平坦后部表面，
所述散热片元件（30）被提供为覆盖所述后部表面。
13.制造照明设备（10）的方法，包括：
提供平的载体（14），其具有面向相反的前部和后部方向的前部和后部表面（16，18），所述载体（14）包括切口（40），在所述后部表面（18）上提供多个载体侧电接触部分（26），
提供安装元件（30），其包括多个可单独操作的LED元件（12）的和电连接至所述LED元件（12）的多个安装侧电接触部分（36），
将所述安装元件（30）布置在所述后部表面（18）上，使得在所述载体侧和所述安装侧电接触部分（26，36）之间形成电接触，以及使得所述LED元件（12）被布置在所述切口（40）上或其内以发射光至所述前部方向，
以及将散热片元件（20）置于所述安装元件（30）的后部，与其热接触。
14.根据权利要求13所述的方法，进一步包括：
在所述载体侧电接触部分（26）和所述安装侧电接触部分（36）之间形成焊连接（42）。
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EP3602626B1 (en) 2023-05-03
KR20190123294A (ko) 2019-10-31
KR102503462B1 (ko) 2023-02-24
CN110431664B (zh) 2024-03-26
EP3602626A1 (en) 2020-02-05
JP7320452B2 (ja) 2023-08-03
US11056629B2 (en) 2021-07-06
JP2020515068A (ja) 2020-05-21
US20200161519A1 (en) 2020-05-21
WO2018172152A1 (en) 2018-09-27

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