200903842 九、發明說明： 【發明所屬之技術領域】 本發明係屬於一種發光二極體單元及其組成之發光二 極體模組’尤指一種可將發光二極體排列任意外型的發光 二極體模組模組，藉此’該發光二極體模組可適用於各種 燈具外罩的内部空間之中。 【先前技術】 發光二極體擁有低耗電、體積小、低溫及高亮度等優 點，目前已大量應用在各式各樣的照明燈具上，甚至在未 來大有取代白熾燈與省電燈泡的趨勢。 發光二極體的型式，是在透明的封勝體内部包覆晶 粒’以及設有向下延伸的接腳，藉接腳插置於電路板的穿 孔’再以焊錫方式將接腳固定於電路板上。 另一種發光二極體的形式乃是將發光二極體結合於一 電路板上即疋，將一發光二極體的兩接腳彎折為呈九十 度轉折的階梯狀型態，再以點焊方式分別焊接於兩金屬連 接板上’透過金属連接板另側所設的接腳插置於電路板上 以便型成一發光二極體電路板單元，接著，將複數個發光 一極體電路板單元設置在一個預先射出成型的塑料支架上 而形成一發光二極體模組，最後再將發光二極體模組安裴 到燈具外殼的内部空間，並且分別在各發光二極體電路 單元依序連接一組電線以便通電。 田上述的模組設置到車燈内時，由於車燈的形狀常因 配合汽車的流線外型而變的不規則，造成車燈内部空間並 200903842 非呈現方正的格局，而是呈現歪斜狀態，因此無法事後變 开> 的塑料支架必須預先設定為匹配車燈内部空間的形狀， 即是，發光二極體模組製造商必須根據不同的車燈内部空 間開設不同的模具來製作塑料支架，如此則大幅提高發光 二極體模組的成本。 此外，電路板之間不作電性連接，且塑料支架亦不導 電，故在製作發光二極體模組時並須另以一組或多組電線 依序連接電路板，因而發光二極體模組的組裝耗時。 【發明内容】 本發明人根據現有發光二極體模組的塑料支架必須根 據不同燈具内部空間而預先成形的問題，&良其不足與缺 失進而發明出一種發光二極體單元及其組成之發光二極 體模組。 本發明之主要目的係提供一種發光二極體單元，其上 的立體支架係可任意_折為適當外形以便匹配燈具的内部 門藉此，當多個發光二極體單元相結合形成一發光二 極體模組時’立體支架亦共同-體成型成為-可任意青折 的立體支架總成’該立體支架總成並且隨著模組所欲安裝 的内部空間而及時彎折為適當形狀。 為達上述目的，係令前述發光二極體單元包含有： 二基板’係為導體，係相互分離而分別作為正極 極； ’、只 一發光二極體，係設置在兩基板頂面，並以分作正、 負兩極的接腳分別電連接在兩基板上；及 、 200903842 二金屬支架，係相互分離’分別設置在相對應的基板 底面其中至少-金屬支架形成一異於平板狀態的立體支 架’並且具有-底座與-連接片，底座係設置在基板底面 並與發光二極體連接，連接片係與底座連接，且用以連接 另外一發光二極體單元上的相對應底座。 藉由上述技術手段，可彎折的立冑支架係、隸據燈具 的内部空間作出適當變形，當多個發光二極體單元相互連 接而彼此相對應的立體支架一體成型為複數立體支架總成 時，立體支架總成將能被彎折配置為適當的外型來匹配燈 具的内部空間，因此，發光二極體單元製造商僅須以簡單 的加工步驟來製造單一種立體支架總成，事後再根據所欲 匹配的燈具外设，以彎折方式來適當改變立體支架總成之 外型’如此避免開設不同模具來預先製作不同的支架，因 此，可大幅省下開模的成本，此外，由於立體支架總成本 身就作為導電板，故在配置電線時，只須在各立體支架總 成上分別連接單一組電源導線即可，不須依序將一對或多 對電線依序連接到各發光二極體單元上，藉此可省下組裝 時間，並且避免使用過多電線而造成材料浪費。 前述各基板頂面分別塗佈有一導熱絕緣層，該導熱絕 緣層係分佈在接腳周圍。 前述各發光二極體底面設置有一導熱層。 前述導熱層為係選自散熱膏、陶瓷板或導熱矽膠片的 其中'一種。 前述各金屬支架的底座上分別突伸形成有至少一貫穿 6 200903842 相對應基板的結合部。 前述各結合部係分別為一鉚合部。 前述各基板材質為鋼。 散熱板係設置在金屬支架底部，可以銅或鋁製造。 一第二導熱絕緣層係設置在金屬支架與散熱板之間。 本發月另 目的係提供一種發光二極體模組，其包含 有複數發光二極體單元，其中各發光二極體單元係具有： 一基板’係為導體，係相互分離而分別作為正極與負 C1 極； 一發光二極體，係設置在兩基板頂面，並以分作正、 負兩極的接腳分別電連接在兩基板上； 二金屬支架’係相互分離，分別設置在相對應的基板 底面’其中至少一金屬支架形成一立體支架，並且具有一 底座與一連接片，底座係設置在基板底面，連接片係與底 座連接，且用以連接另外一發光二極體單元的相對應底 座； ί _ 其中’所有發光二極體單元的相對應立體支架係透過 連接片相互連接而一體成型有至少一立體支架總成，各立 體支架總成係由相對應的複數底座與複數連接片所一體成 型’且與複數個發光二極體相連接。 【實施方式】 請參照第一、第三Α與第四圖，本發明係包含有複數 發光二極體單元（6 〇 )以及一由該等發光二極體單元（6 〇 )組成的發光二極體模組（7 〇 a ) ( 7 0 b )。 200903842 請參照第一到第三A圖，在發光二極體模組（7 〇 a ) 的第一實施例中包含有複數發光二極體單元（6 〇)，各 發光二極體單元（60)包含有：二基板（1〇)、一發 光二極體（20)、二金屬支架（3〇a) (3〇b)、 一散熱板（40)及一第二導熱絕緣層（5 〇)。 該等基板（1 〇 )係為導體，可為銅製，係相互分離 而分別作為正極與負極，且兩基板（丄〇 )之間形成有一 分隔間隙（1 5 )，各基板（χ 〇 ) τ貝面塗佈有_第一導 ^ I U 1 )另外各基板（10)上貫穿形成有 複數結合孔（1 〇 2 )。請參照第三B圖，本發明另一實 施例中，該基板（1 0 a )係為鋁製，在基板（i 〇 a ) 與第—導熱絕緣層（1 Ο 1 )之間設置有-銅導電層（i 0 5 )以便與發光二極體接腳相連接。200903842 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode unit and a light-emitting diode module thereof, which is a light-emitting diode which can arrange any shape of a light-emitting diode. The polar module module, by means, the LED module can be applied to the inner space of various lamp covers. [Prior Art] Light-emitting diodes have the advantages of low power consumption, small size, low temperature and high brightness. They have been widely used in various lighting fixtures, and even have a tendency to replace incandescent lamps and power-saving bulbs in the future. . The type of the light-emitting diode is to cover the inside of the transparent sealing body and to have a downwardly extending pin, and the pin is inserted into the hole of the circuit board, and then the pin is fixed by soldering. On the board. Another form of the light-emitting diode is to combine the light-emitting diodes on a circuit board, that is, to bend the two pins of one light-emitting diode into a stepped shape of a ninety-degree turn, and then The spot welding method is respectively soldered on the two metal connecting plates. The pins provided on the other side of the metal connecting plate are inserted on the circuit board to form a light emitting diode circuit board unit, and then, a plurality of light emitting diode circuits are formed. The plate unit is disposed on a pre-shot plastic support to form a light-emitting diode module, and finally the light-emitting diode module is mounted to the inner space of the lamp housing, and respectively in each light-emitting diode circuit unit Connect a set of wires in order to power up. When the above-mentioned module is set in the lamp, the shape of the lamp is often irregular due to the shape of the car, which causes the internal space of the lamp and the 200903842 is not in a square pattern, but is skewed. Therefore, the plastic bracket that cannot be opened later must be preset to match the shape of the interior space of the lamp, that is, the manufacturer of the LED module must open different molds according to different interior spaces of the lamp to make a plastic bracket. This greatly increases the cost of the LED module. In addition, the electrical connection between the circuit boards is not made, and the plastic support is not electrically conductive. Therefore, when the light-emitting diode module is fabricated, one or more sets of wires are required to be sequentially connected to the circuit board, so that the light-emitting diode module is The assembly of the group is time consuming. SUMMARY OF THE INVENTION The present inventors have invented a light-emitting diode unit and its components according to the problem that the plastic bracket of the existing light-emitting diode module must be pre-formed according to the internal space of different lamps. Light-emitting diode module. The main object of the present invention is to provide a light-emitting diode unit, wherein the three-dimensional support can be arbitrarily folded into an appropriate shape to match the inner part of the lamp, thereby combining a plurality of light-emitting diode units to form a light-emitting diode. In the case of the polar body module, the stereoscopic bracket is also integrally formed into a stereoscopic bracket assembly that can be arbitrarily folded and folded into an appropriate shape in time as the inner space of the module is installed. In order to achieve the above object, the light-emitting diode unit includes: two substrates 'as conductors, which are separated from each other and respectively serve as positive poles; ', only one light-emitting diode is disposed on the top surfaces of the two substrates, and The pins which are divided into positive and negative poles are respectively electrically connected to the two substrates; and, 200903842, the two metal brackets are separated from each other' respectively disposed on the bottom surface of the corresponding substrate, at least - the metal bracket forms a solid shape different from the flat state The bracket 'and has a base and a connecting piece. The base is disposed on the bottom surface of the substrate and connected to the LED, and the connecting piece is connected to the base and connected to the corresponding base on the other LED unit. According to the above technical means, the bendable stand-up bracket system is appropriately deformed according to the internal space of the lamp, and when the plurality of light-emitting diode units are connected to each other, the three-dimensional brackets corresponding to each other are integrally formed into a plurality of three-dimensional bracket assemblies. When the three-dimensional bracket assembly can be bent into a suitable shape to match the internal space of the luminaire, the manufacturer of the illuminating diode unit only has to make a single three-dimensional bracket assembly with a simple processing step, afterwards According to the peripherals of the lamps to be matched, the stereo bracket assembly can be appropriately changed in a bending manner. Thus, different molds can be opened to pre-form different brackets, thereby greatly reducing the cost of mold opening. Since the total cost of the three-dimensional bracket is used as a conductive plate, it is only necessary to connect a single set of power wires to each of the three-dimensional bracket assemblies when the wires are arranged, and it is not necessary to sequentially connect one or more pairs of wires in sequence. On each of the light-emitting diode units, assembly time can be saved and material waste can be avoided by using too many wires. The top surfaces of the substrates are respectively coated with a heat conductive insulating layer, and the heat conductive insulating layer is distributed around the pins. A heat conducting layer is disposed on a bottom surface of each of the foregoing light emitting diodes. The heat conducting layer is selected from the group consisting of a thermal grease, a ceramic plate or a thermal conductive film. The base of each of the metal brackets respectively protrudes and forms at least one joint portion penetrating through the substrate corresponding to the 200903842. Each of the aforementioned joint portions is a rivet portion. Each of the above substrates is made of steel. The heat sink is placed on the bottom of the metal bracket and can be made of copper or aluminum. A second thermally conductive insulating layer is disposed between the metal bracket and the heat sink. Another object of the present invention is to provide a light emitting diode module comprising a plurality of light emitting diode units, wherein each of the light emitting diode units has: a substrate 'as a conductor, separated from each other and respectively serving as a positive electrode and a negative C1 pole; a light-emitting diode is disposed on the top surface of the two substrates, and is electrically connected to the two substrates by the legs which are divided into positive and negative poles; the two metal brackets are separated from each other and are respectively disposed correspondingly At least one metal bracket forms a three-dimensional bracket, and has a base and a connecting piece. The base is disposed on the bottom surface of the substrate, and the connecting piece is connected to the base, and is connected to the phase of the other LED unit. Corresponding base; ί _ wherein the corresponding three-dimensional brackets of all the light-emitting diode units are integrally connected with each other through the connecting piece to form at least one three-dimensional bracket assembly, and each three-dimensional bracket assembly is connected by a plurality of corresponding bases and plural The sheet is integrally formed 'and connected to a plurality of light emitting diodes. [Embodiment] Referring to the first, third, and fourth figures, the present invention includes a plurality of light emitting diode units (6 〇) and a light emitting diode composed of the light emitting diode units (6 〇) Polar body module (7 〇a ) ( 7 0 b ). 200903842 Please refer to the first to third A diagrams. In the first embodiment of the LED module (7 〇a), a plurality of LED units (6 〇) are included, and each LED unit (60) ) comprising: two substrates (1 〇), one light emitting diode (20), two metal brackets (3 〇 a) (3 〇 b), a heat sink (40) and a second heat conducting insulating layer (5 〇) ). The substrates (1 〇) are conductors, which may be made of copper and separated from each other to serve as a positive electrode and a negative electrode, respectively, and a separation gap (15) is formed between the two substrates, and each substrate (χ 〇) τ The shell surface is coated with a first conductive layer IU 1 . Further, a plurality of bonding holes (1 〇 2 ) are formed in each of the substrates (10). Referring to FIG. 3B, in another embodiment of the present invention, the substrate (10 a ) is made of aluminum, and between the substrate (i 〇a ) and the first thermal conductive insulating layer (1 Ο 1 ) is provided with - A copper conductive layer (i 0 5 ) is connected to the LED pins.
該發光一極體（2〇)，係設置在兩基板（1〇)頂 面’並以分作正、負兩極的接腳（2丄）係分別穿過兩基 =(1 Q )的導熱絕緣層（i Q i )巾分別電連接在兩銅 土板（1 0 )上亦或者連接在第二實施例的銅導電層（1 〇 5)上，此外，各發光二極體（2 0 )底部設置有一位 於相對應基板（10)之上的導熱層（2 3)。 ★該等金屬支架（30a) (3〇b)可以較軟的銅、 銷等金屬製造’係相互分離’分別設置在相對應的基板（工 底面’至少一金屬支架（3 0 a )彎折成一異於平板 狀的立體支架’該立體支架具有一底座（3 5 )與一連 接片（37)，底座（35)係設置在基板（1〇)底面， 200903842 連接片（3 7 )係與底座 ' 1〇)連接，且用以連接另& 一發光二極體單元逆擇另外 (60)上的相對應底座（ 夾 外連接片與底川5)之間可具有一爽另 者，連接片（37)與底座（35以可平滑連接;無或 角，其餘不作為立體去架的Ajg + * 體支朱的金屬支架（30b)亦且右— 底座(30b)，邗曰机罢处丨 "^ ~ 並且a又置在相對應基板（丄〇 )底面， 此外，在各金屬支架（3 〇 a ) ( 3 〇 b )的底座The light-emitting diode (2〇) is disposed on the top surface of the two substrates (1〇) and is divided into positive and negative poles (2丄) through two bases = (1 Q) The insulating layer (i Q i ) is electrically connected to the two copper plates (1 0 ) or to the copper conductive layer (1 〇 5) of the second embodiment, and further, each of the light emitting diodes (20) The bottom portion is provided with a heat conducting layer (23) on the corresponding substrate (10). ★The metal brackets (30a) (3〇b) can be made of soft copper, pins, etc., which are separated from each other and placed on the corresponding substrate (the bottom of the workpiece is at least one metal bracket (30 a) bent The stereoscopic bracket has a base (3 5 ) and a connecting piece (37), and the base (35) is disposed on the bottom surface of the substrate (1〇), and the 200903842 connecting piece (3 7) is The base '1〇) is connected, and is used to connect another & one light-emitting diode unit to the opposite base (60) and the bottom base (the outer connecting piece and the bottom 5) Connecting piece (37) and base (35 for smooth connection; no or angle, the rest is not used as a three-dimensional framed Ajg + * body branch Zhu metal bracket (30b) and right - base (30b), take the opportunity to stop丨"^ ~ and a is placed on the bottom surface of the corresponding substrate (丄〇), in addition, the base of each metal bracket (3 〇a ) ( 3 〇b )
上分別突伸形成有至少一貫穿相對應基板的結合部（3 1)，該結合部可為經由沖壓而一體成形的鉚合部，亦可 為獨立分離的鉚釘；其中，所有發光二極體單元（6 〇 ) 的相對應立體支架係透過連接片（37)相互連接而一體 成型有複數立體支架總成，其中各立體支架總成係由相對 應的複數底座（35)與複數連接片（37)所一體成型； 在本實施例中，共有二立體支架總成，該等立體支架總成 分別位於該發光二極體模組的左右兩侧，呈階梯狀而有複 角’亦可呈現平滑連接狀態，並且透過位於兩者之間的金 屬支架（30b)相互連接，該等_介的金屬支架（3〇 b )則為板狀，此外，立體支架總成的位置不限於圖式中 所揭露的左右側配置狀態，亦可在整個模組中間。 該散熱板（40)係設置在金屬支架（3〇a) (3 〇 b )底部，可以銅或鋁製造。 該第二導熱絕緣層（5 0 )係設置在金屬支架（3 〇 a) (30b)與散熱板（40)之間。 請參照第四與第五圖，本發明發光二極體模組（7 〇 200903842 b )第二實施例大致類似於第一實施例，惟所有的金屬支 架（3 0 a )皆為立體支架，並且構成三相互並排的立體 支架總成’此外，各發光二極體（2 〇 )底部設置有一位 於相對應基板（1〇)之上的導熱層（23)，該導熱層 (23)可為散熱膏、陶瓷板或是導熱矽膠片。 藉由上述技術手段，可彎折的立體支架係能根據燈具 的内部空間作出適當變形，當多個發光二極體單元（6 〇 ) 相互連接而彼此相對應的立體支架一體成型為複數立體支 架總成時，立體支架總成將能被彎折配置為適當的外型來 匹配燈具的内部空間，因此，發光二極體單元（6〇)製 造商僅須以簡單的加工步驟來製造單一種立體支架總成， 事後再根據所欲匹配的燈具外殼，以彎折方式來適當改變 立體支架總成之外型，如此避免開設不同模具來預先製作 不同的支架，因此，可大幅省下開模的成本。 此外，由於立體支架總成本身就作為導電板，故在配 置電線時，只須在各立體支架總成上分別連接單一组電源 導線即可，不須依序將一對或多對電線依序連接到各發光 二極體單元上，藉此可省下組裝時間，並且避免使用過多 電線而造成材料浪費。 【圖式簡單說明】 第一圖係本發明第一實施例之立體外觀圖。 第二圖係本發明第一實施例之立體分解圖。 第三A圖係本發明第一實施例令單一發光二極體單元 之正面局部剖視圖。 200903842 第一 B圖係本發明另—實施例中單一發光二極體單元 之正面局部剖視圖。 實施例之立體外觀圖。 實施例之放大立體外觀圖。 (1 0 1 )第一導熱絕緣層 (1 5 )分隔間隙 (2 1 )接腳 (30a)金屬支架 (3 5 )底座 (4 0 )散熱板Forming at least one joint portion (31) penetrating through the corresponding substrate, the joint portion may be a riveted portion integrally formed by pressing, or may be a separately separated rivet; wherein all the light-emitting diodes The corresponding three-dimensional brackets of the unit (6 〇) are integrally connected with each other through a connecting piece (37), and a plurality of three-dimensional bracket assemblies are integrally formed, wherein each of the three-dimensional bracket assemblies is composed of a corresponding plurality of bases (35) and a plurality of connecting pieces ( 37) integrally formed; in this embodiment, there are two stereo bracket assemblies, and the three-dimensional bracket assemblies are respectively located on the left and right sides of the LED module, and are stepped and have a complex angle. Smooth connection state, and connected to each other through a metal bracket (30b) located therebetween, the metal brackets (3〇b) are plate-shaped, and the position of the stereo bracket assembly is not limited to the figure The left and right side configuration states disclosed may also be in the middle of the entire module. The heat sink (40) is placed at the bottom of the metal bracket (3〇a) (3 〇 b ) and can be made of copper or aluminum. The second thermally conductive insulating layer (50) is disposed between the metal bracket (3 〇 a) (30b) and the heat dissipation plate (40). Referring to the fourth and fifth figures, the second embodiment of the light emitting diode module (7 〇 200903842 b) of the present invention is substantially similar to the first embodiment, except that all metal brackets (30 a) are stereoscopic brackets. And forming a three-dimensional bracket assembly alongside each other. In addition, a bottom layer of each of the light-emitting diodes (2 〇) is provided with a heat-conducting layer (23) on a corresponding substrate (1), and the heat-conducting layer (23) can be Thermal grease, ceramic plate or thermal conductive film. According to the above technical means, the bendable three-dimensional support can be appropriately deformed according to the internal space of the lamp, and when the plurality of light-emitting diode units (6 〇) are connected to each other, the three-dimensional brackets corresponding to each other are integrally formed into a plurality of three-dimensional brackets. At the time of assembly, the three-dimensional bracket assembly will be bendably configured to fit the internal dimensions of the luminaire, so the manufacturer of the illuminating diode unit (6 〇) only has to manufacture a single type with a simple processing step. The three-dimensional bracket assembly, afterwards, according to the desired lamp housing, the outer shape of the three-dimensional bracket assembly is appropriately changed by bending, so that different molds can be opened to pre-form different brackets, thereby greatly saving the mold opening. the cost of. In addition, since the total cost of the three-dimensional bracket is used as a conductive plate, it is only necessary to connect a single set of power wires to each of the three-dimensional bracket assemblies when arranging the wires, without sequentially or sequentially placing one or more pairs of wires. It is connected to each of the light-emitting diode units, thereby saving assembly time and avoiding waste of materials by using too many wires. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a first embodiment of the present invention. The second drawing is an exploded perspective view of the first embodiment of the present invention. Figure 3A is a front partial cross-sectional view showing a single light emitting diode unit in the first embodiment of the present invention. 200903842 First B is a front partial cross-sectional view of a single light emitting diode unit in another embodiment of the present invention. A stereoscopic view of an embodiment. An enlarged perspective view of an embodiment. (1 0 1 ) first thermal insulation layer (1 5 ) separation gap (2 1 ) pin (30a) metal bracket (3 5 ) base (40) heat sink
第四圖係本發明第二 第五圖係本發明第_ 【主要元件符號說明 (1〇)基板 (1 〇 2)結合孔 (2 0 )發光二極體 (2 3 )導熱層 (3 〇 b )金屬支架 (3 7 )連接片 0 )第二導熱絕緣層 (6 〇 )發光二極體單元 (7 0 a )發光二極體模組 7 〇 b )發光二極體模組The fourth figure is the second and fifth drawing of the present invention. The first embodiment of the present invention is as follows: [Main component symbol description (1〇) substrate (1 〇 2) bonding hole (20) light-emitting diode (2 3 ) heat-conducting layer (3 〇 b) metal bracket (3 7 ) connecting piece 0) second thermal conductive insulating layer (6 〇) light emitting diode unit (7 0 a) light emitting diode module 7 〇b) light emitting diode module
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