201019506 六、發明說明： 【發明所屬之技術領域】 本發明關於一種發光二極體模組，特別是指一種發光二 極體串、並聯線路成型於一支架上的發光二極體模組。 【先前技術】201019506 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode module, and more particularly to a light-emitting diode module in which a light-emitting diode string and a parallel line are formed on a bracket. [Prior Art]
發光二極體具有光束集中的特性，但十年前LED的亮度不 如目前，因此，普遍地只應用於信號燈、後車燈或是裝飾燈， 而拜藍光LED的發明及其近年來價格的跌落之賜，白光led 的應用層面更廣’翻是在標榜節能減韻今天，各國玫府無 不以政策鼓勵’因此普遍地預期LED將會取代白識燈泡而成^ 照明主流。LED㈣於自麟泡的發切觀稱為冷陰 極。它不但非常省電且只要適#的散熱，它的使用壽命普遍可 乂超過數萬小不但遠遠超n數彳胃小時的自舰泡，也 比省電數仟僻來得高报多。但即便如此，神超過！ =上㈣度LED ’仍然:有極大比率的注入電流是被轉換為熱 此，幾瓦的led所產生的_是不足的，因 以 可 常至少會有—、二十顆LED，甚至更多， 以相ίίϋτίΐ環狀排列。特別是，為了節省空間下1 可L若ί在—個狹窄的空間時所產生的熱量將十分 燈具包含了燈科，將會進—步使哪所處的環境 入的電流量，m般電^產品—樣’温度升高時，將會限制注 的原因。因此，如同也是一般led瓦數受限 除了封裝载板會採用導熱=以載=用==燈 3 201019506 本身或周邊加裝散熱模組來散熱，所不同的是，LED的散 二模組普遍不使用散熱風扇，而是使用散熱膏及散埶絲 ίϊίϊ又增加一能源消耗的元件，此外，燥音問。風扇的 3成本、壽料，都是使LED的散讎岐沒有風扇的主要 Ο 照明用的發光二極體’普遍地都會將多顆發光二極體晶 ，褒於-反射罩内。或者每—反射罩容置—發光二極體，再把 =顆的發光二極體及反射罩·在—物電路板(卿)内以提 =其照明能力。例如圖1所示之—發光二極體燈具ω，例如像 疋手電筒的燈頭’找把多顆的發光二極體晶片12封裝於一反 射罩b内。反射罩15的底部是一 PCB板17，PCB板17有發 光二極體晶片12連接的線路(未圖示)及二⑽％圓形^ ^ ’引腳2G穿過金屬座25。上述的燈具雖然有—大面積的 ^屬座’但散減力並不佳。主岐該些發光二極體太集中於 ，僅管，它有—塊大金屬座，但事實上，二燈腳是 漆才連接至金屬絲，因此散舰力不佳，此外，晶 二舍ncB板17的因此，若無額外的散熱鰭片，它很 快就會有過熱的問題。 来技㈣發光二極料裝奴將包妖射座之發 —PCB板上，PCB板厚約aG1腿鋪颠刻成 i rcB板增似/_。但發 孰 ^、X、—5體之間必需是相隔相當的距離以避免過 抑導線紅=另需崎出成型法料於導雜上。然後， 此不^ 4 201019506 有寥於此，本發明之—目的便是提供另—種可 模它是以反射罩射出成型用的金上 馬贫元一極體载板。因此，可以顯著降低成本。 【發明内容】 本發明之-目的是提供—職簡單之發光二極體模組，、 該發光二極體是直漏金屬錢做域體。該 罩射出成之金屬絲。 ^㈣Light-emitting diodes have the characteristics of beam concentration, but the brightness of LEDs was not as good as it was ten years ago. Therefore, it is generally only applied to signal lights, rear lights or decorative lights, and the invention of blue LEDs and the price drop in recent years. The gift of white light led is more widely used. It is advertised as energy-saving and rhyming. Today, all countries are encouraged by policy. Therefore, it is generally expected that LED will replace white light bulbs. The LED (4) is called the cold cathode in the hair cut from the Linbu. It is not only very power-saving, but as long as it is suitable for heat dissipation, its service life can generally exceed tens of thousands of small, not only far more than n number of stomach-hour self-bubbles, but also more than the number of power saving. But even so, God is over! = Upper (four) degree LED 'still: There is a very large ratio of injected current is converted to heat this, a few watts of led generated _ is insufficient, because there can often be at least -, twenty LEDs, or even more , arranged in a ring of ίίϋτί. In particular, in order to save space, the heat generated in a narrow space will contain a lamp, and the amount of current that will be entered into the environment will be increased. ^ Product-like 'When the temperature rises, the reason for the note will be limited. Therefore, as is the case with the general led wattage limitation, in addition to the package carrier board, the heat conduction = load = use == lamp 3 201019506 itself or the peripheral installation of the heat dissipation module to dissipate heat, the difference is that the LED two modules are common Instead of using a cooling fan, use a heat-dissipating paste and a squeezing wire to add an energy-consuming component. In addition, dry noise is asked. The cost and life of the fan are both the main cause of the dimming of the LED without the fan. The illuminating diode of the illumination generally has a plurality of illuminating diodes in the reflector. Or each - the reflector is placed - the light-emitting diode, and then the light-emitting diode and the reflector are placed inside the board (clear) to improve its lighting capability. For example, as shown in Fig. 1, a light-emitting diode lamp ω, such as a lamp head of a flashlight, is used to package a plurality of light-emitting diode chips 12 in a reflector b. The bottom of the reflector 15 is a PCB board 17 having a wiring (not shown) to which the light-emitting diode wafer 12 is connected and two (10)% round pins 2G passing through the metal holder 25. Although the above-mentioned lamps have a large area of 'seat', the dissipation is not good. The main light-emitting diodes are too concentrated, only the tube has a large metal seat, but in fact, the two light feet are connected to the metal wire, so the bulk force is not good, in addition, Jing Ershe Therefore, if there is no additional heat sink fins, it will quickly have a problem of overheating. The technology (4) light-emitting diodes will be included in the package of the demon shots on the PCB board, the thickness of the PCB board is about aG1 leg shop is engraved into i rcB board increase /_. However, the distance between the 孰 ^, X, and -5 bodies must be a considerable distance to avoid the redness of the conductor red = another need to be formed by the formation method. Then, this is not the case. The purpose of the present invention is to provide another type of gold-loaded horse-poor element carrier plate for injection molding. Therefore, the cost can be significantly reduced. SUMMARY OF THE INVENTION The present invention is directed to providing a simple light-emitting diode module, which is a direct-drain metal money domain. The cover is ejected into a wire. ^(4)
本發明揭露-種發光二極麵組，包含.·_金屬支架載板 提供複數個第-群組之湖連接。第—群、_有複數顆位於反 射罩之發光二極體以金屬支架的子載板互相㈣，複數個第一 群組彼此也以金屬支針的電源板及接地板而_複數個第 ^群組呈並聯以增加照贿。第—群組内之反射罩可以有！個 或3個。 此外，一或二固定板也以射出成型法形成於金屬支架上及 /或下以穩固金屬支架各個不連接點或面。 本發明之發光二極體模組可以單獨配合燈具使用，也可以 多條的發光二極體模組並聯在一起使用。 【實施方式】 有馨於習知發光二極體之模組，是將反射罩射出成型於 金屬支架上，然後，再自支架上取下，再粘著於一载板上，以 提供發光二極體晶片置於其中，載板上若是金屬載板，則載板 要有絕緣層層或絕緣漆或膠，才能避免發光二極體短路，另一 種是以PCB板做為載板’但它的散熱能力不佳，發光二極體必 須適當間隔。或者有散熱睹片，以避免過熱。 請參考圖3所示的示意圖，金屬支架1〇〇是一金屬料 5 201019506 Ο 帶，包含預設為電源支架條110Α、接地支架條hob、第一子 載板120A、第一子載板120A、定位孔115、扣件孔116、電阻 座117a及117b及一沖床定位孔118。上述各個部位已預先以 沖床沖過，因此’在反射罩及固定板射出後，電源的支架條 110A、接地支架條110B二者相連接的部位可以很容易的被分 離以免短路，此外，也可以很容易地把子載板12〇和電源支架 條110A、接地支架條110B分離。定位孔115提供金屬料帶的 定位。扣件孔116提供本模組和其他發光二極體模組之連接。 依據本發明的一實施例，金屬支架純銅或銅合金例如青銅，黃 銅、铭、或紹合金等散熱導電性良好者其中之一種，厚度約為 0.1至0· 3麵以提供良好之導電導熱能力及強度。沖床定位孔 118提供沖床固定也提供成品之電源或接地之連接。另外也有 一電阻座117a、117b，以沖床折壓，請同時參考圖牝 如圖4a所示’在上述的金屬支架1〇〇上施以一射出成型技 術，用以在每兩個子載板腿、之間形成三個反射草 130。如圖4a所示’電源支架條舰和第一子載板腦之間， 第-子載板120A和第二子載板觀之間，及第二子載板ΐ2〇β 和接地支架條110B之間各有一反射罩成型。 依據本發明之-健實關，三贿射罩⑽内分別 個發光二極體135。三個發光二極體135正負極—— 1 (3. 7V X 3))，3· 7V僅是—例，賴大小與所使用 一極魏格細m她145淡人式電阻， =:咖__ ma' 117b上，連接於電源 11⑽與一連接板160之間以吃下多餘的電 壓降以保護發光二極體描相，以备讲费^ ^ 篮模、.且Μ免過電流，凊同時參考前視圖 6 201019506The invention discloses a light-emitting diode set comprising a metal bracket for providing a plurality of first-group lake connections. The first group, the _ has a plurality of sub-carriers in the reflector of the reflector, and the sub-carriers of the metal bracket are mutually mutually (four), and the plurality of first groups are also connected to each other by a power supply board and a grounding plate of the metal pins. Groups are connected in parallel to increase bribery. The reflector in the first group can have! One or three. In addition, one or two fixing plates are also formed on the metal bracket by injection molding and/or to stabilize the respective connecting points or faces of the metal bracket. The light-emitting diode module of the present invention can be used alone or in combination with a plurality of light-emitting diode modules. [Embodiment] A module that is faintly known as a light-emitting diode is formed by projecting a reflector onto a metal bracket, and then removing it from the bracket and then adhering it to a carrier to provide a light-emitting diode. The polar body wafer is placed therein. If the carrier board is a metal carrier board, the carrier board should have an insulating layer or insulating varnish or glue to avoid short circuit of the LED, and the other is to use the PCB board as a carrier board. The heat dissipation capability is not good, and the light-emitting diodes must be properly spaced. Or have a heat sink to avoid overheating. Referring to the schematic diagram shown in FIG. 3, the metal bracket 1 is a metal material 5 201019506 Ο belt, which includes a preset power supply bracket 110 Α, a ground bracket strip hob, a first sub-carrier 120A, and a first sub-carrier 120A. The positioning hole 115, the fastener hole 116, the resistor seats 117a and 117b, and a punch positioning hole 118. Each of the above parts has been punched in advance by a punching machine. Therefore, after the reflecting cover and the fixing plate are ejected, the portions where the power supply bracket strip 110A and the grounding bracket strip 110B are connected can be easily separated to avoid short circuit. The sub-carrier 12 is easily separated from the power supply strip 110A and the ground support strip 110B. The locating holes 115 provide the positioning of the metal strip. The fastener hole 116 provides a connection between the module and other LED modules. According to an embodiment of the present invention, the metal bracket is pure copper or a copper alloy such as bronze, brass, Ming, or Shao alloy, etc., and has a thickness of about 0.1 to 0.3 surface to provide good electrical and thermal conductivity. Ability and strength. Punch Locating Holes 118 provide punching fixtures that also provide a power or ground connection for the finished product. In addition, there is also a resistor seat 117a, 117b, which is folded by the punching machine. Please refer to the figure as shown in Fig. 4a. 'On the above-mentioned metal bracket 1〇〇, an injection molding technique is applied for each of the two sub-carriers. Three reflective grasses 130 are formed between the legs. As shown in Figure 4a, between the power supply bracket and the first subcarrier brain, between the first subcarrier 120A and the second subcarrier, and the second subcarrier ΐ2〇β and the ground bracket 110B There is a reflector cover between each. According to the present invention, the two-light-emitting diodes 135 are respectively disposed in the three-shot mask (10). Three light-emitting diodes 135 positive and negative poles - 1 (3. 7V X 3)), 3 · 7V is only - for example, the size of the Lai and the one used Wei Ge fine m her 145 light resistance, =: __ ma' 117b, connected between the power source 11 (10) and a connecting plate 160 to eat excess voltage drop to protect the light-emitting diode description, in order to pay for the ^ ^ basket mode, and to avoid over current,凊See also front view 6 201019506
4b。上曰述第-群組125有三顆發光二極體.發光二極體w :以疋正負極同侧(以覆晶方式)貼附於反射罩⑽的底部或正 關(要另外姆），並獨·定本發明雜圍。更高 =原電壓供應時，就可以串聯更多顆的發光二極體135。此 外，為增加照明亮度，請注意第一群組125和第一群組125之 ，疋以，性並聯的方式連接在一起的。亦即，電源支架條腦 接於每一第一群組125之第一顆發光二鋪135的正極。而 接地支架條11GB連接於每-第一群組125之第三顆發光二極 體135的負極可以增加照明的亮度。上述連接板丨6〇可以是包 3插座或插頭的金屬支架以連接另—發光二極^^組，或 是燈具(未圖示）。 如圖5所示，一長形固定板140也是以塑膠成型法，將反 射罩130、第一子載板12〇A、第二子載板12〇B、電源支架條 110A和接地支架條hob，各個斷開點或面連接在一起，以 牢固發光二極體模組150。 依據本發明之一實施例，在6〇 mm x 12 mm的發光二極體 内有五個第一群組125，即15顆發光二極體。12V工作電壓 0.34安培下室溫條件下連續燒機超過3〇〇小時以上時温度仍 不會超過60 °C。 依據本發明之第二實施例中，一群組中只有一個反射罩。 言月參,¾圖6所示的示意圖。圖6中每一第一群組只有一個反射 罩’如此’可以減少製造成本。除此之外’其它部分皆與圖 4a相同。 因此’本發明具有以下的優點: 7 201019506 L母發光-極體封裝體本身一條模組，增加照明亮度時 只有將多條發光二極體触，再以铜插細係連接即可。 2. 用以射出成型反射罩的金屬支架本身就是發光二極體 之載板。-體細，且不需要額外的連接線路，金屬支架本身 也是連接導線。散熱面積大增。 3. 金屬支架載體本身就可提供良好之散熱，因此，就算不 使用散熱鰭片也不會使溫度太高而縮短發光二極體壽命。 以上所述係利用一較佳實施例及不同實施例以詳細說明 本發明，其並非用以限制本發明之實施範圍，並且熟習該項技 藝者皆能明瞭’適當做些微的修改仍不脫離本發明之精神及範 圍。 【圖式簡單說明】 圖1 :示傳統發光二極體模組之一實施例載板為PCB及金屬 庙〇 圖2:示傳統發光二極體模組之另一實施例，載板為pCB板。 圖3:示本發明之一實施例中，金屬支架各部分已預沖但尚 有進行固定板及反射罩之射出成型。 圖4a示本發明之一實施例中，金屬支架已射出成型反射罩於 其上，圖4b示電阻座的侧視圖。 圖5示本發明之一實施例中，固定板形成於金屬支架上以固 定各部位。 圖6示本發明之第二實施例中，一群組中只有一個反射罩。 201019506 【主要元件符號說明】 發光二極體燈具10 發光二極體晶片12、135 PCB 板 17 金屬座25 引腳20 金屬支架100 接地支架條110B 定位孔115 扣件孔116 沖床固定孔及電源或接地孔 118 第一子載板120A 電源支架條110A 第二子載板120B 反射罩130 長形固定板140 電阻145 第一群組125 電阻座117a、117b 發光二極體模組150 連接板1604b. The above-mentioned group-group 125 has three light-emitting diodes. The light-emitting diode w: is attached to the bottom or the positive side of the reflector (10) on the same side of the positive and negative electrodes (in the form of flip chip). And the unique invention of the invention. Higher = When the original voltage is supplied, more LEDs 135 can be connected in series. In addition, in order to increase the brightness of the illumination, please note that the first group 125 and the first group 125 are connected in a parallel manner. That is, the power supply bracket is connected to the positive pole of the first light-emitting second tile 135 of each of the first groups 125. The grounding bracket strip 11GB is connected to the negative pole of the third light emitting diode 135 of each of the first group 125 to increase the brightness of the illumination. The connecting plate 丨6〇 may be a metal bracket of a 3 socket or a plug to connect another light-emitting diode or a luminaire (not shown). As shown in FIG. 5, an elongated fixing plate 140 is also formed by plastic molding, and the reflection cover 130, the first sub-carrier 12A, the second sub-carrier 12B, the power supply bracket 110A, and the ground support strip hob. The break points or faces are connected together to firmly illuminate the diode module 150. In accordance with an embodiment of the invention, there are five first groups 125, i.e., 15 light-emitting diodes, within a 6 〇 mm x 12 mm light-emitting diode. 12V working voltage 0.34 amps under continuous room temperature conditions for more than 3 hrs at room temperature will not exceed 60 °C. According to a second embodiment of the invention, there is only one reflector in a group. Talk about the month, 3⁄4 is the schematic shown in Figure 6. Only one reflector "does" in each of the first groups in Figure 6 can reduce manufacturing costs. Other than that, the other parts are the same as in Figure 4a. Therefore, the present invention has the following advantages: 7 201019506 L mother light-polar body package itself is a module, when the illumination brightness is increased, only a plurality of light-emitting diodes are touched, and then the copper plug-in system can be connected. 2. The metal bracket used to project the molded reflector is itself the carrier of the light-emitting diode. - The body is thin and does not require an extra connection line, and the metal bracket itself is also a connecting wire. The heat dissipation area is greatly increased. 3. The metal bracket carrier itself provides good heat dissipation, so even if the fins are not used, the temperature will be too high and the life of the LED will be shortened. The above description of the present invention is not intended to limit the scope of the present invention, and it will be apparent to those skilled in the art that the <RTIgt; The spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an embodiment of a conventional light-emitting diode module. The carrier board is a PCB and a metal temple. FIG. 2 shows another embodiment of a conventional light-emitting diode module. The carrier board is a pCB. board. Fig. 3 is a view showing an embodiment of the present invention in which portions of the metal bracket are pre-punched but injection molding of the fixing plate and the reflector is performed. Figure 4a shows an embodiment of the invention in which a metal stent has been ejected onto a reflective reflector, and Figure 4b shows a side view of the resistor holder. Fig. 5 shows an embodiment of the invention in which a fixing plate is formed on a metal bracket to fix each portion. Figure 6 shows a second embodiment of the invention in which there is only one reflector in a group. 201019506 [Explanation of main components] Luminous diode lamp 10 LED chip 12, 135 PCB board 17 Metal seat 25 Pin 20 Metal bracket 100 Ground bracket strip 110B Positioning hole 115 Fastener hole 116 Punch fixing hole and power supply or Grounding hole 118 first sub-carrier 120A power bracket strip 110A second sub-carrier 120B reflector 130 elongated fixing plate 140 resistor 145 first group 125 resistor holder 117a, 117b LED module 150 connecting plate 160