TW429570B - Plastic integrated circuit device package and micro-leadframe and method for making the package - Google Patents

Plastic integrated circuit device package and micro-leadframe and method for making the package

Info

Publication number
TW429570B
TW429570B TW088116602A TW88116602A TW429570B TW 429570 B TW429570 B TW 429570B TW 088116602 A TW088116602 A TW 088116602A TW 88116602 A TW88116602 A TW 88116602A TW 429570 B TW429570 B TW 429570B
Authority
TW
Taiwan
Prior art keywords
package
die pad
leads
leadframe
packages
Prior art date
Application number
TW088116602A
Other languages
English (en)
Inventor
Thomas P Glenn
Scott J Jewler
David Roman
J H Yee
D H Moon
Original Assignee
Amkor Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22645103&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW429570(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Amkor Technology Inc filed Critical Amkor Technology Inc
Application granted granted Critical
Publication of TW429570B publication Critical patent/TW429570B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
TW088116602A 1998-10-21 1999-09-28 Plastic integrated circuit device package and micro-leadframe and method for making the package TW429570B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/176,614 US6281568B1 (en) 1998-10-21 1998-10-21 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad

Publications (1)

Publication Number Publication Date
TW429570B true TW429570B (en) 2001-04-11

Family

ID=22645103

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088116602A TW429570B (en) 1998-10-21 1999-09-28 Plastic integrated circuit device package and micro-leadframe and method for making the package

Country Status (5)

Country Link
US (3) US6281568B1 (zh)
EP (1) EP0989608A3 (zh)
JP (1) JP2000150765A (zh)
KR (1) KR100381837B1 (zh)
TW (1) TW429570B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102208389A (zh) * 2010-04-28 2011-10-05 先进封装技术私人有限公司 半导体封装件、基板及其制造方法
TWI427750B (zh) * 2010-07-20 2014-02-21 Siliconix Electronic Co Ltd 包括晶粒及ｌ形引線之半導體封裝及其製造方法
TWI471994B (zh) * 2011-08-16 2015-02-01 Advanced Analogic Tech Inc 具有一或多個嵌入晶粒襯墊之多晶粒半導體封裝
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CN102208389B (zh) * 2010-04-28 2014-02-26 先进封装技术私人有限公司 半导体封装件、基板及其制造方法
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EP0989608A2 (en) 2000-03-29
US6455356B1 (en) 2002-09-24
JP2000150765A (ja) 2000-05-30
US6281568B1 (en) 2001-08-28
US6521987B1 (en) 2003-02-18
EP0989608A3 (en) 2001-01-10
KR100381837B1 (ko) 2003-04-26

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