JPS63205935A - 放熱板付樹脂封止型半導体装置 - Google Patents

放熱板付樹脂封止型半導体装置

Info

Publication number
JPS63205935A
JPS63205935A JP62037850A JP3785087A JPS63205935A JP S63205935 A JPS63205935 A JP S63205935A JP 62037850 A JP62037850 A JP 62037850A JP 3785087 A JP3785087 A JP 3785087A JP S63205935 A JPS63205935 A JP S63205935A
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor device
resin
lead frame
bed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62037850A
Other languages
English (en)
Inventor
Toshihiro Kato
加藤　俊博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62037850A priority Critical patent/JPS63205935A/ja
Publication of JPS63205935A publication Critical patent/JPS63205935A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明はトランジスタアレイもしくはダイオードアレイ
などを備える放熱板付樹脂封止型半導体装置の改良に関
する。
（従来の技術） パワートランジスタ等の電力用半導体素子を組立るに当
っては熱容量が大きくかつ放熱性に富んだヒートシンク
（放熱板を以後ヒートシンクと記載する）を利用する方
式が採用されており、このヒートシンクに直接半導体素
子を配置する際にはオン抵抗が大きな問題となる。
この解決策の１つとして第２図に示す方式即ち絶縁性が
ありしかも高い熱伝導を発揮するモールド樹脂の開発に
よって、半導体基板にパワートランジスタ等を造り込ん
だ素子２０をダイボンディングしたリードフレーム２１
のベッド部２２とヒートシンク間に、この高熱伝導特性
をもつ封止樹脂層２４を通常のトランスファーモールド
法によって充填する方法が実用化されている。
更に、特開昭６０−１６０６２４号公報に開示されたヒ
ートシンクと半導体素子の分離法を第３図イ〜ハによっ
て説明すると、先ずポリイミド、ポリアミドならびにエ
ポキシ等の樹脂製フィルム２５に接着剤２６を塗布して
から（第３図イ）、一定寸法に定型化したテープ２７を
第３図口に示す自動方式によってマウントする。このテ
ープＨは巻取リール２９ならびに供給リール２８に巻き
取られ、裏側のヒータ３０で加熱されるヒートシンク３
１に、打抜きポンチ３２を備えるプレス３３を使用して
テープｒをヒートシンク３１に加熱圧着方式によって固
定する。その後第３図ハに明らかなように、ヒートシン
ク３１にはテープＦを介して半導体チップ３４がペース
ト３５によって実装して、ヒートシンク３１と半導体チ
ップ３４は絶縁分離する。一方、パワートランジスタや
トライアック等のように半導体基板の底面からの導通が
必要な場合１こはテープη−に予め蒸着等によるメタラ
イズ処理や金属箔の貼付によって電極を設け、ここにこ
れらの素子をダイボンディングする方法が採られている
。
（発明が解決しようとする問題点） 前述の第２図に示す方式では高熱放散性と電気絶縁性を
両立させるには限界があった。と言うのはリードフレー
ムのベッド部２２とヒートシンク２３間の距離を抑えて
高熱放散性を確保しようとすると、この間隙に充填する
封止樹脂層２４に空隙が発生して電気絶縁性に難点を生
じるので、両者間の距離として約０．６ｍｍ以下に近ず
けることは事実上無理となる。
第３図に示す素子分離方式は有機絶縁物からなるテープ
を利用しているが、高熱放散性が不充分言い換えると熱
抵抗が悪く、従ってパワーが大きく発熱量が大きい半導
体素子の組立には難点がある。
本発明は、上記芝点を克服する現規な放熱板付樹脂封止
型半導体装置を提供することを目的とする。
〔発明の構成〕
（問題点を解決するための手段） この目的を達成するために１本発明ではリードフレーム
のベッドに必要な半導体素子などの電子回路部品を取着
してからこのベッドとヒートシンク間にセラミック等の
絶縁物層を介在して固着後、常法通り樹脂で封止するこ
とによって、熱放散性に優れかつオン抵抗の少ない樹脂
封止型半導体装置を得るものである。
（作　用） このようにリードフレームのベッドとヒートシンク間に
セラミック等の絶縁物層を介在して得られる樹脂封止型
半導体装置は熱抵抗が０．９℃／Ｖと極めて小さくなる
事実を基に完成したもので、従来の技術側に説明した第
２図の樹脂封止型半導体装ｖｉ（５１１ＩＩ１口の半導
体素子使用）の熱抵抗４．５℃／Ｖに比べて際立った値
を示し、その優位性は明らかである。
（実施例） 第１図により実施例を詳述するが、従来の技術゛　欄と
重複する記載も都合上あるが、新番号を付して説明する
。
先ずリードフレーム１を準備するが、そのベッド部２に
塔載する半導体素子３の機種に応じてこのリードフレー
ム１の型も選定されるのは当然で、ピン数の多い半導体
素子３では常法に従ってデュアルインラインタイプのリ
ードフレームを適用し。
ここに半田等４を利用して半導体素子３をベッド部２に
固着する。次に、この半導体素子３に設ける電極とリー
ドフレームの外部リード間を金属細線５によって接続し
て電気的導通を図る。ここで、このリードフレームの材
質としては銅もしくは銅合金を使用することを強調して
おく。この銅系リードフレームを適用しているので、そ
の搬送時には、酸化防止に充分留意して金属細線５によ
るボンディング工程に支障なきよう、又ボンディング工
程時にもリードフレームの酸化防止に努めるのも必要で
ある。
次に相対向する平坦な面を備えたヒートシンク８を用意
し、その−面にＡＫペースト層９を被着し、ここにセラ
ミック板６を載せて一体化し、更にこのセラミック板６
に矢張りＡｇペースト等の接着剤７を塗って、ここに前
述の通り半導体素子３を固着した銅もしくは調合金製の
リードフレームベッド部２を配置して合体する。
このセラミック板は０．６ｍｍ程度に形成し、半導体素
子の大きさが６Ｘ６ｍｍ程度なら約１０＋ｎ＋＋＋角と
し、材質としてはＡｇ２Ｏ３、ｋＱＮ、　５ｉＣ１なら
びにＢｅＯ等何れも適用できる。尚、セラミック板６の
一体化に当っては有機接着剤にかえてガラス接着剤も使
用可である。次に、トランスファーモールド金型にこの
組立体を入れて、ヒートシンク８の一方の平坦な面が露
出するようにモールド樹脂１０によって封止する。
この樹脂としては熱伝導率λ＝６０〜１００　Ｘ　１０
−’ｃａｌ／ｃＩＩｌｓｅｃ℃を示す高熱導率でしかも
絶縁性をもつ材料を選定した。
〔発明の効果〕
このように本発明に係る放熱板付樹脂封止型半導体装置
ではその適用材料に熱放散性が優れたリードフレームや
封止樹脂を採用するのは勿論として、ヒートシンクと、
半導体素子をマウントするリードフレームのベッド部間
にセラミックを介在させて熱抵抗の低減化を達成して高
出力のパワーモジュールを製造したものである。
【図面の簡単な説明】
第１図は本発明に係る放熱板付樹脂封止型半導体装置の
要部を示す断面図、第２図は従来装置の断面図、第３図
イ〜ハはヒートシンクと半導体素子の分離に絶縁シート
適用例の工程を示す断面図である。

Claims (1)

    【特許請求の範囲】
  1. 半導体素子を固着する放熱性の良いリードフレームのベ
    ット部を絶縁板を介して放熱板に一体に取着け、前記半
    導体素子の電極とこれに不連続状態で配置する外部リー
    ド間を接続する金属細線をもつ組立体を、前記放熱板の
    一面を露出して封止する樹脂層とを具備することを特徴
    とする放熱板付樹脂封止型半導体装置。
JP62037850A 1987-02-23 1987-02-23 放熱板付樹脂封止型半導体装置 Pending JPS63205935A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62037850A JPS63205935A (ja) 1987-02-23 1987-02-23 放熱板付樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62037850A JPS63205935A (ja) 1987-02-23 1987-02-23 放熱板付樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPS63205935A true JPS63205935A (ja) 1988-08-25

Family

ID=12509010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62037850A Pending JPS63205935A (ja) 1987-02-23 1987-02-23 放熱板付樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS63205935A (ja)

Cited By (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5291178A (en) * 1991-04-10 1994-03-01 Caddock Electronics, Inc. Film-type resistor assembly with full encapsulation except at the bottom surface
US5328870A (en) * 1992-01-17 1994-07-12 Amkor Electronics, Inc. Method for forming plastic molded package with heat sink for integrated circuit devices
JPH07169882A (ja) * 1991-05-23 1995-07-04 At & T Corp モールドされた集積回路パッケージ
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5701034A (en) * 1994-05-03 1997-12-23 Amkor Electronics, Inc. Packaged semiconductor die including heat sink with locking feature
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
US6143981A (en) * 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6611047B2 (en) 2001-10-12 2003-08-26 Amkor Technology, Inc. Semiconductor package with singulation crease
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6627977B1 (en) 2002-05-09 2003-09-30 Amkor Technology, Inc. Semiconductor package including isolated ring structure
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6700187B2 (en) 2001-03-27 2004-03-02 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6713322B2 (en) 2001-03-27 2004-03-30 Amkor Technology, Inc. Lead frame for semiconductor package
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6803645B2 (en) 2000-12-29 2004-10-12 Amkor Technology, Inc. Semiconductor package including flip chip
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6841414B1 (en) 2002-06-19 2005-01-11 Amkor Technology, Inc. Saw and etch singulation method for a chip package
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6858919B2 (en) 2000-03-25 2005-02-22 Amkor Technology, Inc. Semiconductor package
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6927478B2 (en) 2001-01-15 2005-08-09 Amkor Technology, Inc. Reduced size semiconductor package with stacked dies
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US7872343B1 (en) 2007-08-07 2011-01-18 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via

Cited By (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291178A (en) * 1991-04-10 1994-03-01 Caddock Electronics, Inc. Film-type resistor assembly with full encapsulation except at the bottom surface
JPH07169882A (ja) * 1991-05-23 1995-07-04 At & T Corp モールドされた集積回路パッケージ
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5328870A (en) * 1992-01-17 1994-07-12 Amkor Electronics, Inc. Method for forming plastic molded package with heat sink for integrated circuit devices
US5455462A (en) * 1992-01-17 1995-10-03 Amkor Electronics, Inc. Plastic molded package with heat sink for integrated circuit devices
US5530295A (en) * 1993-12-29 1996-06-25 Intel Corporation Drop-in heat sink
US5552960A (en) * 1994-04-14 1996-09-03 Intel Corporation Collapsible cooling apparatus for portable computer
US5701034A (en) * 1994-05-03 1997-12-23 Amkor Electronics, Inc. Packaged semiconductor die including heat sink with locking feature
US5722161A (en) * 1994-05-03 1998-03-03 Amkor Electronics, Inc. Method of making a packaged semiconductor die including heat sink with locking feature
US5912802A (en) * 1994-06-30 1999-06-15 Intel Corporation Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
US6684496B2 (en) 1998-06-24 2004-02-03 Amkor Technology, Inc. Method of making an integrated circuit package
US6143981A (en) * 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6433277B1 (en) 1998-06-24 2002-08-13 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US6630728B2 (en) * 1998-06-24 2003-10-07 Amkor Technology, Inc. Plastic integrated circuit package and leadframe for making the package
US8963301B1 (en) 1998-06-24 2015-02-24 Amkor Technology, Inc. Integrated circuit package and method of making the same
US9224676B1 (en) 1998-06-24 2015-12-29 Amkor Technology, Inc. Integrated circuit package and method of making the same
US6521987B1 (en) 1998-10-21 2003-02-18 Amkor Technology, Inc. Plastic integrated circuit device package and method for making the package
US6281568B1 (en) 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
US6455356B1 (en) 1998-10-21 2002-09-24 Amkor Technology Methods for moding a leadframe in plastic integrated circuit devices
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6825062B2 (en) 1998-11-20 2004-11-30 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US6469369B1 (en) 1999-06-30 2002-10-22 Amkor Technology, Inc. Leadframe having a mold inflow groove and method for making
US6853059B1 (en) 1999-10-15 2005-02-08 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US6616436B1 (en) 1999-10-15 2003-09-09 Amkor Technology, Inc. Apparatus for manufacturing semiconductor packages
US6627976B1 (en) 1999-10-15 2003-09-30 Amkor Technology, Inc. Leadframe for semiconductor package and mold for molding the same
US6475827B1 (en) 1999-10-15 2002-11-05 Amkor Technology, Inc. Method for making a semiconductor package having improved defect testing and increased production yield
US6646339B1 (en) 1999-10-15 2003-11-11 Amkor Technology, Inc. Thin and heat radiant semiconductor package and method for manufacturing
US6677662B1 (en) 1999-10-15 2004-01-13 Amkor Technology, Inc. Clamp and heat block assembly for wire bonding a semiconductor package assembly
US6501161B1 (en) 1999-10-15 2002-12-31 Amkor Technology, Inc. Semiconductor package having increased solder joint strength
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
US6696747B1 (en) 1999-10-15 2004-02-24 Amkor Technology, Inc. Semiconductor package having reduced thickness
US6525406B1 (en) 1999-10-15 2003-02-25 Amkor Technology, Inc. Semiconductor device having increased moisture path and increased solder joint strength
US6833609B1 (en) 1999-11-05 2004-12-21 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6476478B1 (en) 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6605866B1 (en) 1999-12-16 2003-08-12 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6753597B1 (en) 1999-12-16 2004-06-22 Amkor Technology, Inc. Encapsulated semiconductor package including chip paddle and leads
US8154111B2 (en) 1999-12-16 2012-04-10 Amkor Technology, Inc. Near chip size semiconductor package
US6730544B1 (en) 1999-12-20 2004-05-04 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6677663B1 (en) 1999-12-30 2004-01-13 Amkor Technology, Inc. End grid array semiconductor package
US6858919B2 (en) 2000-03-25 2005-02-22 Amkor Technology, Inc. Semiconductor package
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US6803645B2 (en) 2000-12-29 2004-10-12 Amkor Technology, Inc. Semiconductor package including flip chip
US6927478B2 (en) 2001-01-15 2005-08-09 Amkor Technology, Inc. Reduced size semiconductor package with stacked dies
US6605865B2 (en) 2001-03-19 2003-08-12 Amkor Technology, Inc. Semiconductor package with optimized leadframe bonding strength
US6700187B2 (en) 2001-03-27 2004-03-02 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6713322B2 (en) 2001-03-27 2004-03-30 Amkor Technology, Inc. Lead frame for semiconductor package
US6756658B1 (en) 2001-04-06 2004-06-29 Amkor Technology, Inc. Making two lead surface mounting high power microleadframe semiconductor packages
US6611047B2 (en) 2001-10-12 2003-08-26 Amkor Technology, Inc. Semiconductor package with singulation crease
US6798046B1 (en) 2002-01-22 2004-09-28 Amkor Technology, Inc. Semiconductor package including ring structure connected to leads with vertically downset inner ends
US6885086B1 (en) 2002-03-05 2005-04-26 Amkor Technology, Inc. Reduced copper lead frame for saw-singulated chip package
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6627977B1 (en) 2002-05-09 2003-09-30 Amkor Technology, Inc. Semiconductor package including isolated ring structure
US6841414B1 (en) 2002-06-19 2005-01-11 Amkor Technology, Inc. Saw and etch singulation method for a chip package
US6867071B1 (en) 2002-07-12 2005-03-15 Amkor Technology, Inc. Leadframe including corner leads and semiconductor package using same
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US10665567B1 (en) 2002-11-08 2020-05-26 Amkor Technology, Inc. Wafer level package and fabrication method
US9871015B1 (en) 2002-11-08 2018-01-16 Amkor Technology, Inc. Wafer level package and fabrication method
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US9054117B1 (en) 2002-11-08 2015-06-09 Amkor Technology, Inc. Wafer level package and fabrication method
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US7872343B1 (en) 2007-08-07 2011-01-18 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US11869829B2 (en) 2009-01-05 2024-01-09 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with through-mold via
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US10546833B2 (en) 2009-12-07 2020-01-28 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9978695B1 (en) 2011-01-27 2018-05-22 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9508631B1 (en) 2011-01-27 2016-11-29 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9631481B1 (en) 2011-01-27 2017-04-25 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8866278B1 (en) 2011-10-10 2014-10-21 Amkor Technology, Inc. Semiconductor device with increased I/O configuration
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US10410967B1 (en) 2011-11-29 2019-09-10 Amkor Technology, Inc. Electronic device comprising a conductive pad on a protruding-through electrode
US11043458B2 (en) 2011-11-29 2021-06-22 Amkor Technology Singapore Holding Pte. Ltd. Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode
US9947623B1 (en) 2011-11-29 2018-04-17 Amkor Technology, Inc. Semiconductor device comprising a conductive pad on a protruding-through electrode
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10090228B1 (en) 2012-03-06 2018-10-02 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10014240B1 (en) 2012-03-29 2018-07-03 Amkor Technology, Inc. Embedded component package and fabrication method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9543235B2 (en) 2013-10-24 2017-01-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method

Similar Documents

Publication Publication Date Title
JPS63205935A (ja) 放熱板付樹脂封止型半導体装置
JP4465906B2 (ja) パワー半導体モジュール
JPH10261744A (ja) 半導体装置及びその製造方法
JPH06151657A (ja) 半導体装置及びその製造方法
JP3544757B2 (ja) 半導体装置及びその製造方法
JP2001267475A (ja) 半導体装置の実装構造およびその実装方法
JPS60137041A (ja) 樹脂封止形半導体装置
JP2905609B2 (ja) 樹脂封止型半導体装置
JP2001118961A (ja) 樹脂封止型電力用半導体装置及びその製造方法
JPS6050354B2 (ja) 樹脂封止型半導体装置
JP2002314037A (ja) パワー半導体モジュール
JP2564771B2 (ja) 放熱板付き半導体装置及びその製造方法
JP2530193B2 (ja) 高熱伝導半導体実装構造体
JPS63190363A (ja) パワ−パツケ−ジ
JPH05160304A (ja) 半導体装置
JP2002076259A (ja) パワーモジュール
JPH0758746B2 (ja) 樹脂封止型半導体装置
JPH0329307B2 (ja)
JPS60110145A (ja) 樹脂封止型半導体装置
JPS5918685Y2 (ja) 混成厚膜集積回路装置
JPH04115540A (ja) 放熱板付き半導体装置の製造方法
JPS6056309B2 (ja) リ−ドフレ−ムおよびその製造方法
JP2005217248A (ja) 半導体装置
JPH09260557A (ja) 半導体装置およびその製造方法
JPS60110146A (ja) 樹脂封止型半導体装置