JPS6467949A - Lead frame and manufacture thereof - Google Patents

Lead frame and manufacture thereof

Info

Publication number
JPS6467949A
JPS6467949A JP62224497A JP22449787A JPS6467949A JP S6467949 A JPS6467949 A JP S6467949A JP 62224497 A JP62224497 A JP 62224497A JP 22449787 A JP22449787 A JP 22449787A JP S6467949 A JPS6467949 A JP S6467949A
Authority
JP
Japan
Prior art keywords
lead frame
face
lead
resin
rough
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62224497A
Other languages
Japanese (ja)
Inventor
Atsuo Nouzumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP62224497A priority Critical patent/JPS6467949A/en
Publication of JPS6467949A publication Critical patent/JPS6467949A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve bondability to a resin package and to improve the moisture resistance of a lead frame by employing a punch in which at least part of its outside face is roughened when the lead frame is punched by pressing. CONSTITUTION:A metal mold D is mounted on a stripe material which is surface treated as predetermined, and a lead frame is formed by pressing with punches in which a rough region R' is formed on the end face of its side. The punching is conducted, a region corresponding to the rough region R', i.e., part of the side face of an inner lead is simultaneously formed with a rough face R. The lead frame formed in this manner bonds a semiconductor chip on its die pad, a bonding pad at the end of the inner lead is connected by a wire bonding method to a bonding pad of a semiconductor chip, and then sealed with resin. A resin-sealed semiconductor device formed in this manner has remarkably improved bondability of a resin package to the lead, high moisture resistance and high reliability.
JP62224497A 1987-09-08 1987-09-08 Lead frame and manufacture thereof Pending JPS6467949A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62224497A JPS6467949A (en) 1987-09-08 1987-09-08 Lead frame and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62224497A JPS6467949A (en) 1987-09-08 1987-09-08 Lead frame and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6467949A true JPS6467949A (en) 1989-03-14

Family

ID=16814723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62224497A Pending JPS6467949A (en) 1987-09-08 1987-09-08 Lead frame and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6467949A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002173A (en) * 1991-12-20 1999-12-14 Sgs-Thomson Microelectronics S.R.L. Semiconductor device package with metal-polymer joint of controlled roughness
JP2013139640A (en) * 2013-02-21 2013-07-18 Kobe Steel Ltd Fitting type connector terminal
US9252090B2 (en) 2012-03-28 2016-02-02 Panasonic Intellectual Property Management Co., Ltd. Resin package
JPWO2015037233A1 (en) * 2013-09-11 2017-03-02 テルモ株式会社 Hollow needle assembly for medical use and method for manufacturing hollow needle
US10211131B1 (en) * 2017-10-06 2019-02-19 Microchip Technology Incorporated Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor device
JP2021086905A (en) * 2019-11-27 2021-06-03 京セラ株式会社 Wiring board, package, and electronic component

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827352A (en) * 1981-08-12 1983-02-18 Hitachi Ltd Semiconductor device
JPS5864056A (en) * 1981-10-13 1983-04-16 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827352A (en) * 1981-08-12 1983-02-18 Hitachi Ltd Semiconductor device
JPS5864056A (en) * 1981-10-13 1983-04-16 Nec Corp Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002173A (en) * 1991-12-20 1999-12-14 Sgs-Thomson Microelectronics S.R.L. Semiconductor device package with metal-polymer joint of controlled roughness
US9252090B2 (en) 2012-03-28 2016-02-02 Panasonic Intellectual Property Management Co., Ltd. Resin package
JP2013139640A (en) * 2013-02-21 2013-07-18 Kobe Steel Ltd Fitting type connector terminal
JPWO2015037233A1 (en) * 2013-09-11 2017-03-02 テルモ株式会社 Hollow needle assembly for medical use and method for manufacturing hollow needle
JP2019134921A (en) * 2013-09-11 2019-08-15 テルモ株式会社 Medical hollow needle assembly and method for manufacturing hollow needle
US10434265B2 (en) 2013-09-11 2019-10-08 Terumo Kabushiki Kaisha Medical hollow needle assembly and method of manufacturing hollow needle
US10211131B1 (en) * 2017-10-06 2019-02-19 Microchip Technology Incorporated Systems and methods for improved adhesion between a leadframe and molding compound in a semiconductor device
JP2021086905A (en) * 2019-11-27 2021-06-03 京セラ株式会社 Wiring board, package, and electronic component

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