JP2885708B2 - Resin sealing mold and method of manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin-sealed mold used for a resin-sealed semiconductor device and a method for manufacturing a semiconductor device using the same.

[0002]

2. Description of the Related Art A conventional resin-sealing method for a resin-sealed semiconductor device is to clamp a suspension pin or each lead of a lead frame on which the semiconductor device is mounted by sandwiching the lead between upper and lower encapsulation dies. And cured. Further, in the lead cutting method of the lead frame, after a resin sealing step, a portion of the lead frame where the lead is to be cut is clamped and fixed by upper and lower dies, and then a predetermined cut portion is cut by a cutting punch.

[0003] For example, as this kind of resin sealing mold, there is a mold shown in a cross-sectional view and a schematic plan view of FIG.
That is, as shown in FIG.
A resin-filled semiconductor device is manufactured by sandwiching the suspension pins 2 of the lead frame on which the semiconductor chip is mounted with the lower mold 5 and injecting resin into the cavity 10 therebetween. This mold has a cavity 10 as shown in FIG.
The portion becomes the molding part 11, and the lead is taken out from the hanging pin part 12 and the lead part 13 of the lead frame.

After the resin-encapsulated semiconductor device is molded, as shown in FIG. 4 (a), the hanging pins 2 are connected to the molded portion 1, so that the roots of the hanging pins 2 are cut with the hanging pins. As shown in FIG. 4 (b), the leading end is cut by the hanging pin cut punch 9 sandwiched between the pad 7 and the hanging pin cut die 8.

As shown in Japanese Patent Application Laid-Open No. Hei 5-326591 (hereinafter referred to as a known example), there is a trapezoidal fixing projection as a hanging pin fixing clamp, and the lead frame clamp fixes the hanging pin by such a mold. Therefore, there is a technique for preventing the island portion from being affected by the resin and preventing a stay shift.

[0006]

In the above-described resin-sealed mold, when the suspension pin of the molded resin-sealed semiconductor device is cut, the chipping of the mold cannot be prevented. That is, in recent years, the resin-encapsulated semiconductor device has been reduced in thickness, the thickness of the lead has been increased, and the cut portion of the lead has become closer to the base of the resin mold portion 1. When the lead is not sufficiently fixed by the lead clamp at the time of cutting, the lead of the cut part is deformed at the time of cutting, the resin part is directly stressed by the deformation stress, or the resin part is damaged. There's a problem. In addition, there is a problem that the package of the resin-encapsulated semiconductor device becomes defective in specifications, furthermore, separation between the lead and the resin interface occurs, and moisture enters, thereby lowering reliability.

In the above-mentioned known example, the suspension pin may be better fixed to prevent the stay shift, but it is not possible to prevent the loss of the mold resin portion when the suspension pin is cut.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin-sealed mold having improved reliability by eliminating defects in a mold portion during processing after resin-sealing, ensuring package standards, and manufacturing a semiconductor device using the same. It is to provide a method.

[0009]

According to the present invention, there is provided a resin sealing mold in which a lead of a lead frame on which a semiconductor chip is mounted is sandwiched between an upper mold and a lower mold and a resin is sealed therebetween. The lead frame has a suspension pin lead, and when the suspension pin lead is sandwiched between the upper mold and the lower mold, a projection that presses the suspension pin lead to a cut portion of the suspension pin lead of the upper mold and the lower mold. In front of the department
At least one of the protrusions is provided at a corresponding position of the upper mold and the lower mold, and at least one of the protrusion tips is sharp.

The method of manufacturing a semiconductor device according to the present invention is characterized in that the resin sealing mold is used to sandwich a suspension pin lead of a lead frame on which a semiconductor chip is mounted between an upper mold and a lower mold. Press both projections of the upper mold and the lower mold against the cut part of the suspension pin lead, and press both sides of this cut part.
In a recess, forming the upper after injecting a resin between the mold and the lower mold (cavity), cleaved resin sealed semiconductor device to press the cut portion of the formed suspension pin leads of said recess It is characterized by doing.

According to the structure of the present invention, a recess can be formed in the suspension pin portion of the semiconductor device when the resin is sealed therein, so that the resin portion can be prevented from being damaged when the suspension pin is cut. A highly reliable semiconductor device can be obtained.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view and a schematic plan view showing an embodiment of a resin sealing mold according to the present invention. In this embodiment, a projection 6 for cutting a hanging pin is provided on the configuration of a conventional mold. That is, as shown in FIG. 1 (a), when a semiconductor chip (element) is mounted on a lead frame having hanging pins 2 and a semi-finished product obtained by connecting the chip and the lead frame with wires is resin-sealed, The lead frame is placed on the mold 5 and is sandwiched between the upper molds 4, and the resin is poured into the cavity 10 between the molds. As shown in FIG. 1 (b), the cavity 10 becomes the mold portion 11, and the lead frame lead portion and the suspension pin 2 come to the lead frame lead portion 13 and the suspension pin portion 12. A corresponding portion has a cut portion 14 that the projection 6 hits.

When a semiconductor device is manufactured using this resin sealing mold, it is shown in the cross-sectional view of FIG. When the lead frame is sandwiched between the upper mold 4 and the lower mold 5, as shown in FIG.
However, a recess is formed by the pressure sandwiched between the protrusions 6 of both molds. That is, in the hanging pin cutting step in the subsequent step, the hanging pins 2 are fixed by the hanging pin cut pads 7 and the hanging pin cut dies 8, and as shown in FIG. Cut the recessed part.

On the other hand, if the protruding portions 6 provided on the upper and lower dies 4 and 5 for cutting the suspension pins have sharp tips, the suspension pins 2 can be easily cut.

[0015]

As described above, according to the present invention, when the suspension pin is cut, the recess is formed by the projection of the die at the suspension pin cutting point of the lead frame of the semiconductor device, so that the suspension pin is cut. Since the cutting can be performed with less stress, there is an effect that the mold of the resin portion of the semiconductor device is prevented from being chipped at the time of cutting the hanging pins, and a highly reliable semiconductor device can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view and a plan view showing an embodiment of a resin-sealing mold of the present invention.

FIG. 2 is a sectional view illustrating an embodiment of a method for manufacturing a semiconductor device of the present invention.

FIG. 3 is a cross-sectional view and a plan view showing a conventional resin-sealing mold.

FIG. 4 is a cross-sectional view illustrating a method of manufacturing a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mold part 2 Hanging pin 3 Lead frame lead 4 Mold upper mold 5 Mold lower mold 6 Projection part 7 Hanging pin cut pad 8 Hanging pin cut die 9 Hanging pin cut punch 10 Cavity 11 Molding part 12 Hanging pin part 13 Lead frame Lead part 14 Cutting part

Continued on the front page (58) Fields surveyed (Int.Cl. ⁶ , DB name) H01L 21/56 H01L 23/28-23/30 B29C 45/02 B29C 45/14 B29C 45/26

Claims (2)

(57) [Claims] 1. A resin sealing mold in which a lead of a lead frame on which a semiconductor chip is mounted is sandwiched between an upper mold and a lower mold and a resin is sealed therebetween. When the suspending pin lead is sandwiched between the upper mold and the lower mold, the projecting portions for pressing the suspending pin leads are formed on the cut portions of the suspending pin leads of the upper mold and the lower mold by the upper mold and the lower mold. Where to respond
Each provided, the protrusions of the resin sealing die, wherein at least one of the projecting tip is in sharpened. 2. A suspending pin lead of a lead frame on which a semiconductor chip is mounted is sandwiched between an upper mold and a lower mold by using the resin sealing mold according to claim 1, and the upper portion is cut at a cutting portion of the suspending pin lead. by pressing the both projections of the mold and lower mold to form a recess on both sides of the cutting portion, after injection of the resin between the upper mold and lower mold, the hanging pin leads formed of the recess A method for manufacturing a semiconductor device, comprising: pressing a cut portion to cut the resin to form a resin-sealed semiconductor device.