JP5122172B2 - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
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- JP5122172B2 JP5122172B2 JP2007092879A JP2007092879A JP5122172B2 JP 5122172 B2 JP5122172 B2 JP 5122172B2 JP 2007092879 A JP2007092879 A JP 2007092879A JP 2007092879 A JP2007092879 A JP 2007092879A JP 5122172 B2 JP5122172 B2 JP 5122172B2
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- lead frame
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- emitting device
- light emitting
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Description
1 リードフレーム
2 LEDチップ(半導体発光素子)
3 ケース
4 透光樹脂
5 ワイヤ
11 ボンディング部
12 薄肉延出部
13 厚肉延出部
Claims (10)
- ボンディング部を有する第1リードフレームと、
上記第1リードフレームとは分離された第2リードフレームと、
上記ボンディング部の表面に搭載された半導体発光素子と、
上記半導体発光素子と上記第2リードフレームの表面とを接続するワイヤと、
上記第1リードフレームの裏面および上記第2リードフレームの裏面を面一状に露出させつつ上記第1リードフレームの一部および上記第2リードフレームの一部を覆うケースと、を備える半導体発光装置であって、
上記第1リードフレームは、上記第2リードフレームに対向する位置を避けた位置に、上記ボンディング部から延びており、裏面が上記ボンディング部の裏面よりも上記ケース内方に位置する薄肉延出部をさらに備えており、かつ、
上記第2リードフレームは、上記ボンディング部に対向する位置に上記ボンディング部よりも厚さが薄い追加の薄肉延出部を有しており、
上記ケースは、上記薄肉延出部の下面に回り込む抱え込み部を有しており、当該抱え込み部は、上記第1リードフレームに密着しているとともに、当該抱え込み部の下面は上記第1リードフレームの裏面と面一状となっていることを特徴とする、半導体発光装置。 - 上記第1リードフレームは、上記ボンディング部から延びており、上記薄肉延出部と隣り合っており、かつ、厚さが上記ボンディング部と同じであり、裏面が上記ケースから露出している厚肉延出部をさらに備えている、請求項1に記載の半導体発光装置。
- 上記第1リードフレームは、複数の上記薄肉延出部を有している、請求項1または2に記載の半導体発光装置。
- 上記第1リードフレームは、金属からなり、露出した金属表面上に上記半導体発光素子が直接搭載されている、請求項1ないし3のいずれかに記載の半導体発光装置。
- 上記第1リードフレームには、1つのみの上記半導体発光素子が搭載されている、請求項1ないし4のいずれかに記載の半導体発光装置。
- 上記第1リードフレームは、複数の上記薄肉延出部と、複数の上記厚肉延出部とを有しており、
上記複数の薄肉延出部は上記複数の厚肉延出部に対して交互に配置されており、
上記ケースは、上記各薄肉延出部とそれに隣接する上記厚肉延出部との間に位置する部分を有している、請求項2に記載の半導体発光装置。 - 上記第1リードフレームの上記ボンディング部は長状であり、上記複数の薄肉延出部と上記複数の厚肉延出部とが突出形成された長手縁部を備えている、請求項2または6に記載の半導体発光装置。
- 上記第1リードフレームには、互いに隣接する上記薄肉延出部の間に位置する凹部が形成されており、この凹部は、上記ボンディング部の幅方向において、上記隣接する薄肉延出部よりも凹んだ構成とされている、請求項7に記載の半導体装置。
- 上記複数の薄肉延出部は、互いに等間隔で配置されている、請求項6ないし8のいずれかに記載の半導体装置。
- 上記第2リードフレームは、上記第1リードフレームとは反対側に上記ケースから突出する端子部を有しており、この端子部と上記追加の薄肉延出部との間には、上記追加の薄肉延出部よりも凹んだ構成の追加の凹部が形成されている、請求項1に記載の半導体装置。
Priority Applications (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092879A JP5122172B2 (ja) | 2007-03-30 | 2007-03-30 | 半導体発光装置 |
CN2010102267733A CN101916809B (zh) | 2007-03-30 | 2008-03-28 | 半导体发光装置 |
US12/079,760 US7825426B2 (en) | 2007-03-30 | 2008-03-28 | Semiconductor light-emitting device |
CN200810086912XA CN101276874B (zh) | 2007-03-30 | 2008-03-28 | 半导体发光装置 |
US12/890,964 US8154045B2 (en) | 2007-03-30 | 2010-09-27 | Semiconductor light-emitting device |
US13/414,294 US8541808B2 (en) | 2007-03-30 | 2012-03-07 | Semiconductor light-emitting device |
US14/021,501 US8680568B2 (en) | 2007-03-30 | 2013-09-09 | Semiconductor light-emitting device |
US14/184,173 US8946763B2 (en) | 2007-03-30 | 2014-02-19 | Semiconductor light-emitting device |
US14/574,640 US9059387B2 (en) | 2007-03-30 | 2014-12-18 | Semiconductor light-emitting device |
US14/703,273 US10008650B2 (en) | 2007-03-30 | 2015-05-04 | Semiconductor light-emitting device |
US15/997,184 US10312425B2 (en) | 2007-03-30 | 2018-06-04 | Semiconductor light-emitting device |
US16/394,376 US11088307B2 (en) | 2007-03-30 | 2019-04-25 | Semiconductor light-emitting device |
US17/369,710 US11784295B2 (en) | 2007-03-30 | 2021-07-07 | Semiconductor light-emitting device |
US18/459,793 US20230420629A1 (en) | 2007-03-30 | 2023-09-01 | Semiconductor light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092879A JP5122172B2 (ja) | 2007-03-30 | 2007-03-30 | 半導体発光装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012139361A Division JP5431536B2 (ja) | 2012-06-21 | 2012-06-21 | 半導体発光装置 |
Publications (2)
Publication Number | Publication Date |
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JP2008251937A JP2008251937A (ja) | 2008-10-16 |
JP5122172B2 true JP5122172B2 (ja) | 2013-01-16 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007092879A Active JP5122172B2 (ja) | 2007-03-30 | 2007-03-30 | 半導体発光装置 |
Country Status (3)
Country | Link |
---|---|
US (11) | US7825426B2 (ja) |
JP (1) | JP5122172B2 (ja) |
CN (2) | CN101916809B (ja) |
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JP5122172B2 (ja) | 2007-03-30 | 2013-01-16 | ローム株式会社 | 半導体発光装置 |
KR100998233B1 (ko) | 2007-12-03 | 2010-12-07 | 서울반도체 주식회사 | 슬림형 led 패키지 |
JP5340763B2 (ja) | 2009-02-25 | 2013-11-13 | ローム株式会社 | Ledランプ |
DE102009032253B4 (de) * | 2009-07-08 | 2022-11-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektronisches Bauteil |
JP5471244B2 (ja) * | 2009-09-29 | 2014-04-16 | 豊田合成株式会社 | 照明装置 |
KR101064090B1 (ko) * | 2009-11-17 | 2011-09-08 | 엘지이노텍 주식회사 | 발광소자 패키지 |
TW201128812A (en) | 2009-12-01 | 2011-08-16 | Lg Innotek Co Ltd | Light emitting device |
JP5710128B2 (ja) * | 2010-01-19 | 2015-04-30 | 大日本印刷株式会社 | 樹脂付リードフレームの製造方法 |
JP4951090B2 (ja) * | 2010-01-29 | 2012-06-13 | 株式会社東芝 | Ledパッケージ |
WO2011122665A1 (ja) | 2010-03-30 | 2011-10-06 | 大日本印刷株式会社 | Led用リードフレームまたは基板、半導体装置、およびled用リードフレームまたは基板の製造方法 |
KR101103674B1 (ko) | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | 발광 소자 |
JPWO2012014382A1 (ja) | 2010-07-27 | 2013-09-09 | パナソニック株式会社 | 半導体装置 |
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KR101778832B1 (ko) | 2010-11-02 | 2017-09-14 | 다이니폰 인사츠 가부시키가이샤 | Led 소자 탑재용 리드 프레임, 수지 부착 리드 프레임, 반도체 장치의 제조 방법 및 반도체 소자 탑재용 리드 프레임 |
JP2013062393A (ja) | 2011-09-14 | 2013-04-04 | Sharp Corp | 発光装置 |
JP6079223B2 (ja) * | 2011-12-28 | 2017-02-15 | 日亜化学工業株式会社 | 発光装置用パッケージ成形体 |
US9093621B2 (en) | 2011-12-28 | 2015-07-28 | Nichia Corporation | Molded package for light emitting device |
JP6078948B2 (ja) | 2012-01-20 | 2017-02-15 | 日亜化学工業株式会社 | 発光装置用パッケージ成形体及びそれを用いた発光装置 |
JP6167619B2 (ja) * | 2012-04-06 | 2017-07-26 | 日亜化学工業株式会社 | 発光装置用パッケージ成形体及びそれを用いた発光装置 |
JP2013008979A (ja) * | 2012-08-02 | 2013-01-10 | Toshiba Corp | 半導体パッケージ |
CN103682063B (zh) * | 2012-08-30 | 2017-03-01 | 展晶科技(深圳)有限公司 | 侧面发光型发光二极管封装结构及其制造方法 |
CN103682028A (zh) * | 2012-08-30 | 2014-03-26 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
JP6123200B2 (ja) * | 2012-09-19 | 2017-05-10 | 大日本印刷株式会社 | 光半導体装置用リードフレーム、樹脂付き光半導体装置用リードフレーム、リードフレームの多面付け体、樹脂付きリードフレームの多面付け体、光半導体装置、光半導体装置の多面付け体 |
JP6138574B2 (ja) * | 2013-05-15 | 2017-05-31 | ローム株式会社 | Ledモジュール |
JP5758459B2 (ja) * | 2013-08-27 | 2015-08-05 | 大日本印刷株式会社 | 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法 |
JP5908874B2 (ja) * | 2013-08-27 | 2016-04-26 | 大日本印刷株式会社 | 樹脂付リードフレーム、リードフレーム、半導体装置および樹脂付リードフレームの製造方法 |
JP6413412B2 (ja) * | 2014-07-11 | 2018-10-31 | 日亜化学工業株式会社 | 半導体発光装置及びその製造方法 |
JP6477328B2 (ja) * | 2014-09-29 | 2019-03-06 | 日亜化学工業株式会社 | パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置 |
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CN108305926B (zh) * | 2018-02-08 | 2020-02-07 | 开发晶照明(厦门)有限公司 | Led支架、led模组、以及led支架的制造方法 |
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JP7157304B2 (ja) * | 2018-02-22 | 2022-10-20 | 日亜化学工業株式会社 | 半導体装置 |
CN109817785A (zh) * | 2018-12-25 | 2019-05-28 | 广东晶科电子股份有限公司 | 一种发光二极管及其制作方法 |
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US8154045B2 (en) | 2012-04-10 |
CN101916809B (zh) | 2013-12-11 |
US20190252589A1 (en) | 2019-08-15 |
US9059387B2 (en) | 2015-06-16 |
US11088307B2 (en) | 2021-08-10 |
US7825426B2 (en) | 2010-11-02 |
US20140008695A1 (en) | 2014-01-09 |
CN101276874B (zh) | 2010-09-08 |
US20150091040A1 (en) | 2015-04-02 |
US20140167233A1 (en) | 2014-06-19 |
US20080237627A1 (en) | 2008-10-02 |
US20230420629A1 (en) | 2023-12-28 |
US20150236231A1 (en) | 2015-08-20 |
US20110042710A1 (en) | 2011-02-24 |
US11784295B2 (en) | 2023-10-10 |
US10312425B2 (en) | 2019-06-04 |
US10008650B2 (en) | 2018-06-26 |
CN101916809A (zh) | 2010-12-15 |
CN101276874A (zh) | 2008-10-01 |
US20210336113A1 (en) | 2021-10-28 |
US8946763B2 (en) | 2015-02-03 |
US8680568B2 (en) | 2014-03-25 |
US20180287029A1 (en) | 2018-10-04 |
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US8541808B2 (en) | 2013-09-24 |
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