KR102445217B1 - 재료를 레이저 가공하는 방법 및 장치 - Google Patents

재료를 레이저 가공하는 방법 및 장치 Download PDF

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Publication number
KR102445217B1
KR102445217B1 KR1020177003404A KR20177003404A KR102445217B1 KR 102445217 B1 KR102445217 B1 KR 102445217B1 KR 1020177003404 A KR1020177003404 A KR 1020177003404A KR 20177003404 A KR20177003404 A KR 20177003404A KR 102445217 B1 KR102445217 B1 KR 102445217B1
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South Korea
Prior art keywords
laser
transparent material
laser beam
disrupting element
support base
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Korean (ko)
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KR20170031164A (ko
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리차드 그룬드무엘러
프란크 파비안 헤른버거
미가엘 크레인
프로리안 스파에스
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코닝 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020177003404A 2014-07-08 2015-07-08 재료를 레이저 가공하는 방법 및 장치 Active KR102445217B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462021917P 2014-07-08 2014-07-08
US62/021,917 2014-07-08
PCT/US2015/039468 WO2016007572A1 (en) 2014-07-08 2015-07-08 Methods and apparatuses for laser processing materials

Publications (2)

Publication Number Publication Date
KR20170031164A KR20170031164A (ko) 2017-03-20
KR102445217B1 true KR102445217B1 (ko) 2022-09-20

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Country Status (7)

Country Link
US (2) US9815144B2 (enExample)
EP (1) EP3166895B1 (enExample)
JP (2) JP2017521259A (enExample)
KR (1) KR102445217B1 (enExample)
CN (1) CN106687419A (enExample)
TW (1) TWI730945B (enExample)
WO (1) WO2016007572A1 (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
JP6788571B2 (ja) 2014-07-14 2020-11-25 コーニング インコーポレイテッド 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
EP3169477B1 (en) * 2014-07-14 2020-01-29 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
US10429553B2 (en) 2015-02-27 2019-10-01 Corning Incorporated Optical assembly having microlouvers
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
DE102015210286A1 (de) * 2015-06-03 2016-12-08 3D-Micromac Ag Verfahren und Vorrichtung zur Herstellung eines strukturierten Elements sowie strukturiertes Element
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
DE102015111490A1 (de) * 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
CN109311725B (zh) 2016-05-06 2022-04-26 康宁股份有限公司 从透明基材激光切割及移除轮廓形状
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
FR3053155B1 (fr) * 2016-06-27 2019-09-06 Universite d'Aix-Marseille (AMU) Procedes et systemes de fonctionnalisation optique d'un echantillon en materiau semi-conducteur
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
EP3507057A1 (en) * 2016-08-30 2019-07-10 Corning Incorporated Laser processing of transparent materials
CN113399816B (zh) 2016-09-30 2023-05-16 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
CN110167891A (zh) * 2016-10-24 2019-08-23 康宁股份有限公司 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10414685B2 (en) * 2016-11-15 2019-09-17 Via Mechanics, Ltd. Substrate processing method
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10743338B2 (en) 2017-03-20 2020-08-11 Qualcomm Incorporated Downlink and uplink transmissions for high reliability low latency communications systems
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
JP2020531392A (ja) * 2017-08-25 2020-11-05 コーニング インコーポレイテッド アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11344973B2 (en) * 2018-04-19 2022-05-31 Corning Incorporated Methods for forming holes in substrates
US11059131B2 (en) 2018-06-22 2021-07-13 Corning Incorporated Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
CN110498612A (zh) * 2019-07-24 2019-11-26 大族激光科技产业集团股份有限公司 一种采用红外激光加工渐变磨砂玻璃的加工方法
CN114425665B (zh) * 2022-02-14 2023-11-10 上海赛卡精密机械有限公司 水导激光系统和双层材料切割方法
CN115647606B (zh) * 2022-11-15 2024-12-13 上海赛卡精密机械有限公司 一种水导激光阻断防护方法
KR102589865B1 (ko) * 2023-02-02 2023-10-17 주식회사 중우나라 유리패널 가공방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000225485A (ja) * 1999-02-04 2000-08-15 Fine Machining Kk レーザ加工装置のステージ
US20070111480A1 (en) 2005-11-16 2007-05-17 Denso Corporation Wafer product and processing method therefor
US20130189806A1 (en) 2012-01-24 2013-07-25 Disco Corporation Processing method for wafer
JP2014104484A (ja) 2012-11-27 2014-06-09 Disco Abrasive Syst Ltd レーザー加工装置
JP2014117707A (ja) * 2012-12-13 2014-06-30 Disco Abrasive Syst Ltd レーザ加工方法

Family Cites Families (771)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1790397A (en) 1931-01-27 Glass workins machine
US1529243A (en) 1924-01-30 1925-03-10 Libbey Owens Sheet Glass Co Flattening table for continuous sheet glass
US1626396A (en) 1926-08-02 1927-04-26 Libbey Owens Sheet Glass Co Sheet-glass-drawing apparatus
US2754956A (en) 1951-05-02 1956-07-17 Sommer & Maca Glass Machinery Conveyor structure for flat glass edging beveling and polishing apparatus
US2682134A (en) 1951-08-17 1954-06-29 Corning Glass Works Glass sheet containing translucent linear strips
US2749794A (en) 1953-04-24 1956-06-12 Corning Glass Works Illuminating glassware and method of making it
US2932087A (en) 1954-05-10 1960-04-12 Libbey Owens Ford Glass Co Template cutting apparatus for bent sheets of glass or the like
GB1242172A (en) 1968-02-23 1971-08-11 Ford Motor Co A process for chemically cutting glass
US3647410A (en) 1969-09-09 1972-03-07 Owens Illinois Inc Glass ribbon machine blow head mechanism
US3775084A (en) 1970-01-02 1973-11-27 Owens Illinois Inc Pressurizer apparatus for glass ribbon machine
US3729302A (en) 1970-01-02 1973-04-24 Owens Illinois Inc Removal of glass article from ribbon forming machine by vibrating force
US3673900A (en) 1970-08-10 1972-07-04 Shatterproof Glass Corp Glass cutting apparatus
US3695497A (en) 1970-08-26 1972-10-03 Ppg Industries Inc Method of severing glass
US3695498A (en) 1970-08-26 1972-10-03 Ppg Industries Inc Non-contact thermal cutting
DE2231330A1 (de) 1972-06-27 1974-01-10 Agfa Gevaert Ag Verfahren und vorrichtung zur erzeugung eines scharfen fokus
US3947093A (en) 1973-06-28 1976-03-30 Canon Kabushiki Kaisha Optical device for producing a minute light beam
GB1500207A (en) 1975-10-29 1978-02-08 Pilkington Brothers Ltd Breaking flat glass into cullet
JPS5318756A (en) 1976-07-31 1978-02-21 Izawa Seimen Koujiyou Yuugen Production of boiled noodle with long preservetivity
DE2757890C2 (de) 1977-12-24 1981-10-15 Fa. Karl Lutz, 6980 Wertheim Verfahren und Vorrichtung zum Herstellen von Behältnissen aus Röhrenglas, insbesondere Ampullen
US4441008A (en) 1981-09-14 1984-04-03 Ford Motor Company Method of drilling ultrafine channels through glass
US4546231A (en) 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
US4618056A (en) 1984-03-23 1986-10-21 Omega Castings, Inc. Link conveyor belt for heat treating apparatus
JPS6127212A (ja) 1984-07-19 1986-02-06 Sumitomo Bakelite Co Ltd 合成樹脂成形用型
JPS6174794A (ja) 1984-09-17 1986-04-17 Mitsubishi Electric Corp レ−ザ加工装置の加工ヘツド
US4623776A (en) 1985-01-03 1986-11-18 Dow Corning Corporation Ring of light laser optics system
US4642439A (en) 1985-01-03 1987-02-10 Dow Corning Corporation Method and apparatus for edge contouring lenses
JPS6246930A (ja) 1985-08-21 1987-02-28 Bandou Kiko Kk ガラス板の割断装置
US4646308A (en) 1985-09-30 1987-02-24 Spectra-Physics, Inc. Synchronously pumped dye laser using ultrashort pump pulses
JPS6318756A (ja) 1986-07-09 1988-01-26 Fujiwara Jiyouki Sangyo Kk 生物育成、微生物培養工程における制御温度の監視方法及びその装置
US4749400A (en) 1986-12-12 1988-06-07 Ppg Industries, Inc. Discrete glass sheet cutting
EP0272582B1 (en) 1986-12-18 1994-05-18 Sumitomo Chemical Company, Limited Light control sheets
JP2691543B2 (ja) 1986-12-18 1997-12-17 住友化学工業株式会社 光制御板およびその製造方法
JPS63192561A (ja) 1987-02-04 1988-08-09 Nkk Corp マルチ切断装置
US5104523A (en) 1987-05-29 1992-04-14 Nippon Sheet Glass Co., Ltd. Glass-plate sorting system
US4918751A (en) 1987-10-05 1990-04-17 The University Of Rochester Method for optical pulse transmission through optical fibers which increases the pulse power handling capacity of the fibers
IL84255A (en) 1987-10-23 1993-02-21 Galram Technology Ind Ltd Process for removal of post- baked photoresist layer
JPH01179770A (ja) 1988-01-12 1989-07-17 Hiroshima Denki Gakuen 金属とセラミックスとの接合方法
US4764930A (en) 1988-01-27 1988-08-16 Intelligent Surgical Lasers Multiwavelength laser source
US4907586A (en) 1988-03-31 1990-03-13 Intelligent Surgical Lasers Method for reshaping the eye
JPH0610670B2 (ja) 1988-06-09 1994-02-09 日立建機株式会社 超音波測定装置のピーク値検出回路
US4929065A (en) 1988-11-03 1990-05-29 Isotec Partners, Ltd. Glass plate fusion for macro-gradient refractive index materials
US4891054A (en) 1988-12-30 1990-01-02 Ppg Industries, Inc. Method for cutting hot glass
US5112722A (en) 1989-04-12 1992-05-12 Nippon Sheet Glass Co., Ltd. Method of producing light control plate which induces scattering of light at different angles
US5104210A (en) 1989-04-24 1992-04-14 Monsanto Company Light control films and method of making
US5035918A (en) 1989-04-26 1991-07-30 Amp Incorporated Non-flammable and strippable plating resist and method of using same
US4951457A (en) 1989-11-08 1990-08-28 Deal Douglas O Narrow pitch articulated chain and links therefor
US4997250A (en) 1989-11-17 1991-03-05 General Electric Company Fiber output coupler with beam shaping optics for laser materials processing system
ES2090308T3 (es) 1990-01-31 1996-10-16 Bando Kiko Co Maquina para trabajar placa de cristal.
US5040182A (en) 1990-04-24 1991-08-13 Coherent, Inc. Mode-locked laser
IE912667A1 (en) 1991-07-29 1993-02-10 Trinity College Dublin Laser Profiling of Lens Edge
US5256853A (en) 1991-07-31 1993-10-26 Bausch & Lomb Incorporated Method for shaping contact lens surfaces
EP0614388B1 (en) 1991-11-06 2002-06-12 LAI, Shui, T. Corneal surgery device
US5265107A (en) 1992-02-05 1993-11-23 Bell Communications Research, Inc. Broadband absorber having multiple quantum wells of different thicknesses
US5410567A (en) 1992-03-05 1995-04-25 Corning Incorporated Optical fiber draw furnace
JPH05274085A (ja) 1992-03-26 1993-10-22 Sanyo Electric Co Ltd 入力および表示装置
JPH05300544A (ja) 1992-04-23 1993-11-12 Sony Corp 映像表示装置
JPH05323110A (ja) 1992-05-22 1993-12-07 Hitachi Koki Co Ltd 多ビーム発生素子
US5475197A (en) 1992-06-17 1995-12-12 Carl-Zeiss-Stiftung Process and apparatus for the ablation of a surface
US6016223A (en) 1992-08-31 2000-01-18 Canon Kabushiki Kaisha Double bessel beam producing method and apparatus
JP3553986B2 (ja) 1992-08-31 2004-08-11 キヤノン株式会社 ２重ベッセルビーム発生方法及び装置
CA2112843A1 (en) 1993-02-04 1994-08-05 Richard C. Ujazdowski Variable repetition rate picosecond laser
JPH06318756A (ja) 1993-05-06 1994-11-15 Toshiba Corp レ−ザ装置
DE69418248T2 (de) 1993-06-03 1999-10-14 Hamamatsu Photonics Kk Optisches Laser-Abtastsystem mit Axikon
EP0656241B1 (en) 1993-06-04 1998-12-23 Seiko Epson Corporation Apparatus and method for laser machining
US5521352A (en) 1993-09-23 1996-05-28 Laser Machining, Inc. Laser cutting apparatus
US5418803A (en) 1994-01-11 1995-05-23 American Biogenetic Sciences, Inc. White light laser technology
US6489589B1 (en) 1994-02-07 2002-12-03 Board Of Regents, University Of Nebraska-Lincoln Femtosecond laser utilization methods and apparatus and method for producing nanoparticles
JP3531199B2 (ja) 1994-02-22 2004-05-24 三菱電機株式会社 光伝送装置
US5436925A (en) 1994-03-01 1995-07-25 Hewlett-Packard Company Colliding pulse mode-locked fiber ring laser using a semiconductor saturable absorber
US5400350A (en) 1994-03-31 1995-03-21 Imra America, Inc. Method and apparatus for generating high energy ultrashort pulses
US5778016A (en) 1994-04-01 1998-07-07 Imra America, Inc. Scanning temporal ultrafast delay methods and apparatuses therefor
US5656186A (en) 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
DE19513354A1 (de) 1994-04-14 1995-12-14 Zeiss Carl Materialbearbeitungseinrichtung
JP2526806B2 (ja) 1994-04-26 1996-08-21 日本電気株式会社 半導体レ―ザおよびその動作方法
WO1995031023A1 (en) 1994-05-09 1995-11-16 Massachusetts Institute Of Technology Dispersion-compensated laser using prismatic end elements
US6016324A (en) 1994-08-24 2000-01-18 Jmar Research, Inc. Short pulse laser system
US5434875A (en) 1994-08-24 1995-07-18 Tamar Technology Co. Low cost, high average power, high brightness solid state laser
US5604592A (en) 1994-09-19 1997-02-18 Textron Defense Systems, Division Of Avco Corporation Laser ultrasonics-based material analysis system and method using matched filter processing
US5776220A (en) 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5578229A (en) 1994-10-18 1996-11-26 Michigan State University Method and apparatus for cutting boards using opposing convergent laser beams
US5541774A (en) 1995-02-27 1996-07-30 Blankenbecler; Richard Segmented axial gradient lens
US5696782A (en) 1995-05-19 1997-12-09 Imra America, Inc. High power fiber chirped pulse amplification systems based on cladding pumped rare-earth doped fibers
AT402195B (de) 1995-05-29 1997-02-25 Lisec Peter Vorrichtung zum fördern von glastafeln
JP3319912B2 (ja) 1995-06-29 2002-09-03 株式会社デンソー 半導体センサ用台座およびその加工方法
DE19535392A1 (de) 1995-09-23 1997-03-27 Zeiss Carl Fa Radial polarisationsdrehende optische Anordnung und Mikrolithographie-Projektionsbelichtungsanlage damit
US5854490A (en) 1995-10-03 1998-12-29 Fujitsu Limited Charged-particle-beam exposure device and charged-particle-beam exposure method
JPH09106243A (ja) 1995-10-12 1997-04-22 Dainippon Printing Co Ltd ホログラムの複製方法
JP3125180B2 (ja) 1995-10-20 2001-01-15 新東工業株式会社 シート状樹脂成型設備
US5715346A (en) 1995-12-15 1998-02-03 Corning Incorporated Large effective area single mode optical waveguide
US5692703A (en) 1996-05-10 1997-12-02 Mcdonnell Douglas Corporation Multiple application wheel well design
US5736709A (en) 1996-08-12 1998-04-07 Armco Inc. Descaling metal with a laser having a very short pulse width and high average power
US5854751A (en) 1996-10-15 1998-12-29 The Trustees Of Columbia University In The City Of New York Simulator and optimizer of laser cutting process
US7353829B1 (en) 1996-10-30 2008-04-08 Provectus Devicetech, Inc. Methods and apparatus for multi-photon photo-activation of therapeutic agents
JP4237827B2 (ja) 1996-11-13 2009-03-11 コーニング インコーポレイテッド 内部にチャンネルが形成されたガラス製品の製造方法
US5781684A (en) 1996-12-20 1998-07-14 Corning Incorporated Single mode optical waveguide having large effective area
CA2231096A1 (en) 1997-03-25 1998-09-25 Duane E. Hoke Optical fiber dual spindle winder with automatic threading and winding
US6033583A (en) 1997-05-05 2000-03-07 The Regents Of The University Of California Vapor etching of nuclear tracks in dielectric materials
US6156030A (en) 1997-06-04 2000-12-05 Y-Beam Technologies, Inc. Method and apparatus for high precision variable rate material removal and modification
BE1011208A4 (fr) 1997-06-11 1999-06-01 Cuvelier Georges Procede de decalottage de pieces en verre.
DE19728766C1 (de) 1997-07-07 1998-12-17 Schott Rohrglas Gmbh Verwendung eines Verfahrens zur Herstellung einer Sollbruchstelle bei einem Glaskörper
JPH1179770A (ja) 1997-07-10 1999-03-23 Yamaha Corp スクライブ装置及び劈開方法
US6078599A (en) 1997-07-22 2000-06-20 Cymer, Inc. Wavelength shift correction technique for a laser
US6003418A (en) 1997-07-31 1999-12-21 International Business Machines Corporation Punched slug removal system
JP3264224B2 (ja) 1997-08-04 2002-03-11 キヤノン株式会社 照明装置及びそれを用いた投影露光装置
US6520057B1 (en) 1997-09-30 2003-02-18 Eastman Machine Company Continuous system and method for cutting sheet material
JP3185869B2 (ja) 1997-10-21 2001-07-11 日本電気株式会社 レーザ加工方法
DE19750320C1 (de) 1997-11-13 1999-04-01 Max Planck Gesellschaft Verfahren und Vorrichtung zur Lichtpulsverstärkung
AU3908099A (en) 1997-12-05 1999-06-28 Thermolase Corporation Skin enhancement using laser light
US6501578B1 (en) 1997-12-19 2002-12-31 Electric Power Research Institute, Inc. Apparatus and method for line of sight laser communications
JPH11197498A (ja) 1998-01-13 1999-07-27 Japan Science & Technology Corp 無機材料内部の選択的改質方法及び内部が選択的に改質された無機材料
US6272156B1 (en) 1998-01-28 2001-08-07 Coherent, Inc. Apparatus for ultrashort pulse transportation and delivery
JPH11240730A (ja) 1998-02-27 1999-09-07 Nec Kansai Ltd 脆性材料の割断方法
JPH11269683A (ja) 1998-03-18 1999-10-05 Armco Inc 金属表面から酸化物を除去する方法及び装置
US6160835A (en) 1998-03-20 2000-12-12 Rocky Mountain Instrument Co. Hand-held marker with dual output laser
DE69931690T2 (de) 1998-04-08 2007-06-14 Asml Netherlands B.V. Lithographischer Apparat
EP0949541B1 (en) 1998-04-08 2006-06-07 ASML Netherlands B.V. Lithography apparatus
US6256328B1 (en) 1998-05-15 2001-07-03 University Of Central Florida Multiwavelength modelocked semiconductor diode laser
US6308055B1 (en) 1998-05-29 2001-10-23 Silicon Laboratories, Inc. Method and apparatus for operating a PLL for synthesizing high-frequency signals for wireless communications
JPH11347861A (ja) 1998-06-03 1999-12-21 Amada Co Ltd レーザ加工機における複合加工方法およびレーザ加工機における複合加工システム
JPH11347758A (ja) 1998-06-10 1999-12-21 Mitsubishi Heavy Ind Ltd 超精密加工装置
TW419867B (en) 1998-08-26 2001-01-21 Samsung Electronics Co Ltd Laser cutting apparatus and method
DE19851353C1 (de) 1998-11-06 1999-10-07 Schott Glas Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff
JP3178524B2 (ja) 1998-11-26 2001-06-18 住友重機械工業株式会社 レーザマーキング方法と装置及びマーキングされた部材
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US7649153B2 (en) 1998-12-11 2010-01-19 International Business Machines Corporation Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed laser beam
US6445491B2 (en) 1999-01-29 2002-09-03 Irma America, Inc. Method and apparatus for optical sectioning and imaging using time-gated parametric image amplification
US6381391B1 (en) 1999-02-19 2002-04-30 The Regents Of The University Of Michigan Method and system for generating a broadband spectral continuum and continuous wave-generating system utilizing same
JP2000247668A (ja) 1999-02-25 2000-09-12 Bando Kiko Kk ガラス板の加工機械
DE19908630A1 (de) 1999-02-27 2000-08-31 Bosch Gmbh Robert Abschirmung gegen Laserstrahlen
WO2000053365A1 (en) 1999-03-05 2000-09-14 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
US6501576B1 (en) 1999-03-24 2002-12-31 Intel Corporation Wireless data transfer using a remote media interface
US6484052B1 (en) 1999-03-30 2002-11-19 The Regents Of The University Of California Optically generated ultrasound for enhanced drug delivery
TWI223581B (en) 1999-04-02 2004-11-01 Murata Manufacturing Co Method for machining ceramic green sheet and apparatus for machining the same
US6137632A (en) 1999-04-19 2000-10-24 Iomega Corporation Method and apparatus for lossless beam shaping to obtain high-contrast imaging in photon tunneling methods
JP2000327349A (ja) 1999-05-24 2000-11-28 China Glaze Co Ltd 結晶化ガラス板の曲げ加工方法
US6373565B1 (en) 1999-05-27 2002-04-16 Spectra Physics Lasers, Inc. Method and apparatus to detect a flaw in a surface of an article
CN2388062Y (zh) 1999-06-21 2000-07-19 郭广宗 一层有孔一层无孔双层玻璃车船窗
US6449301B1 (en) 1999-06-22 2002-09-10 The Regents Of The University Of California Method and apparatus for mode locking of external cavity semiconductor lasers with saturable Bragg reflectors
US6185051B1 (en) 1999-06-23 2001-02-06 Read-Rite Corporation High numerical aperture optical focusing device for use in data storage systems
US6259151B1 (en) 1999-07-21 2001-07-10 Intersil Corporation Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors
US6573026B1 (en) 1999-07-29 2003-06-03 Corning Incorporated Femtosecond laser writing of glass, including borosilicate, sulfide, and lead glasses
US6452117B2 (en) 1999-08-26 2002-09-17 International Business Machines Corporation Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
EP1409935B1 (en) 1999-09-24 2013-01-02 Peter Forrest Thompson Heat pump fluid heating system
DE19952331C1 (de) 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
JP2001130921A (ja) 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
JP2001138083A (ja) 1999-11-18 2001-05-22 Seiko Epson Corp レーザー加工装置及びレーザー照射方法
JP4592855B2 (ja) 1999-12-24 2010-12-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
EP1242802B1 (en) 1999-12-28 2012-05-30 Corning Incorporated Method and apparatus for tensile testing and rethreading optical fiber during fiber draw
US6339208B1 (en) 2000-01-19 2002-01-15 General Electric Company Method of forming cooling holes
US6552301B2 (en) 2000-01-25 2003-04-22 Peter R. Herman Burst-ultrafast laser machining method
JP2001236673A (ja) 2000-02-17 2001-08-31 Minolta Co Ltd 光ヘッド及び光記録・再生装置
DE10010131A1 (de) 2000-03-03 2001-09-06 Zeiss Carl Mikrolithographie - Projektionsbelichtung mit tangentialer Polarisartion
WO2001084230A1 (en) 2000-05-04 2001-11-08 Schott Donnelly Llc Chromogenic glazing
AU2001261402A1 (en) 2000-05-11 2001-11-20 Ptg Precision Technology Center Limited Llc System for cutting brittle materials
DE10030388A1 (de) 2000-06-21 2002-01-03 Schott Glas Verfahren zur Herstellung von Glassubstraten für elektronische Speichermedien
JP3530114B2 (ja) 2000-07-11 2004-05-24 忠弘 大見 単結晶の切断方法
JP2002040330A (ja) 2000-07-25 2002-02-06 Olympus Optical Co Ltd 光学素子切換え制御装置
JP2002045985A (ja) 2000-08-07 2002-02-12 Matsushita Electric Ind Co Ltd レーザ楕円穴加工方法およびレーザ楕円穴加工装置
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP4964376B2 (ja) 2000-09-13 2012-06-27 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
KR100673073B1 (ko) 2000-10-21 2007-01-22 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치
SE0004096D0 (sv) 2000-11-08 2000-11-08 Nira Automotive Ab Positioning system
US20020110639A1 (en) 2000-11-27 2002-08-15 Donald Bruns Epoxy coating for optical surfaces
US6611647B2 (en) 2000-12-12 2003-08-26 Corning Incorporated Large effective area optical fiber
US20020082466A1 (en) 2000-12-22 2002-06-27 Jeongho Han Laser surgical system with light source and video scope
JP4880820B2 (ja) 2001-01-19 2012-02-22 株式会社レーザーシステム レーザ支援加工方法
DE10103256A1 (de) 2001-01-25 2002-08-08 Leica Microsystems Sicherheitsvorrichtung für Mikroskope mit einem Laserstrahl als Beleuchtungsquelle
JP2002228818A (ja) 2001-02-05 2002-08-14 Taiyo Yuden Co Ltd レーザー加工用回折光学素子、レーザー加工装置及びレーザー加工方法
JP3445250B2 (ja) 2001-02-20 2003-09-08 ゼット株式会社 靴 底
EA004167B1 (ru) 2001-03-01 2004-02-26 Общество С Ограниченной Ответственностью "Лазтекс" Способ резки стекла
JP2002321081A (ja) 2001-04-27 2002-11-05 Ishikawajima Harima Heavy Ind Co Ltd レーザ照射装置及びレーザ照射方法
DE10124803A1 (de) 2001-05-22 2002-11-28 Zeiss Carl Polarisator und Mikrolithographie-Projektionsanlage mit Polarisator
US7015491B2 (en) 2001-06-01 2006-03-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby, control system
KR100576746B1 (ko) 2001-06-01 2006-05-03 에이에스엠엘 네델란즈 비.브이. 리소그래피장치, 디바이스제조방법, 그 디바이스,제어시스템, 컴퓨터프로그램, 및 컴퓨터프로그램물
JP3725805B2 (ja) 2001-07-04 2005-12-14 三菱電線工業株式会社 ファイバ配線シートおよびその製造方法
SG108262A1 (en) 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
US6754429B2 (en) 2001-07-06 2004-06-22 Corning Incorporated Method of making optical fiber devices and devices thereof
SE0202159D0 (sv) 2001-07-10 2002-07-09 Coding Technologies Sweden Ab Efficientand scalable parametric stereo coding for low bitrate applications
JPWO2003007370A1 (ja) 2001-07-12 2004-11-04 株式会社日立製作所 配線ガラス基板およびその製造方法ならびに配線ガラス基板に用いられる導電性ペーストおよび半導体モジュールならびに配線基板および導体形成方法
JP3775250B2 (ja) 2001-07-12 2006-05-17 セイコーエプソン株式会社 レーザー加工方法及びレーザー加工装置
CN1283409C (zh) 2001-08-10 2006-11-08 三星钻石工业股份有限公司 脆性材料基片的倒角方法以及倒角装置
JP3795778B2 (ja) 2001-08-24 2006-07-12 株式会社ノリタケカンパニーリミテド 水添ビスフェノールａ型エポキシ樹脂を用いたレジノイド研削砥石
JP4294239B2 (ja) 2001-09-17 2009-07-08 日立ビアメカニクス株式会社 レーザ加工装置および透過型の１／２波長板
JP2003114400A (ja) 2001-10-04 2003-04-18 Sumitomo Electric Ind Ltd レーザ光学システムおよびレーザ加工方法
JP2003124491A (ja) * 2001-10-15 2003-04-25 Sharp Corp 薄膜太陽電池モジュール
EP1306196A1 (de) 2001-10-24 2003-05-02 Telsonic AG Haltevorrichtung, Vorrichtung zum Verschweissen von Werkstücken und Verfahren zum Bereitstellen einer Haltevorrichtung
JP2003154517A (ja) 2001-11-21 2003-05-27 Seiko Epson Corp 脆性材料の割断加工方法およびその装置、並びに電子部品の製造方法
US6720519B2 (en) 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
US6973384B2 (en) 2001-12-06 2005-12-06 Bellsouth Intellectual Property Corporation Automated location-intelligent traffic notification service systems and methods
JP2003238178A (ja) 2002-02-21 2003-08-27 Toshiba Ceramics Co Ltd ガス導入用シャワープレート及びその製造方法
DE60335538D1 (de) 2002-03-12 2011-02-10 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
US6744009B1 (en) 2002-04-02 2004-06-01 Seagate Technology Llc Combined laser-scribing and laser-breaking for shaping of brittle substrates
US6787732B1 (en) 2002-04-02 2004-09-07 Seagate Technology Llc Method for laser-scribing brittle substrates and apparatus therefor
US7565820B2 (en) 2002-04-30 2009-07-28 Corning Incorporated Methods and apparatus for forming heat treated optical fiber
DE10219514A1 (de) 2002-04-30 2003-11-13 Zeiss Carl Smt Ag Beleuchtungssystem, insbesondere für die EUV-Lithographie
FR2839508B1 (fr) 2002-05-07 2005-03-04 Saint Gobain Vitrage decoupe sans rompage
JP3559827B2 (ja) 2002-05-24 2004-09-02 独立行政法人理化学研究所 透明材料内部の処理方法およびその装置
US7116283B2 (en) 2002-07-30 2006-10-03 Ncr Corporation Methods and apparatus for improved display of visual data for point of sale terminals
CA2396831A1 (en) 2002-08-02 2004-02-02 Femtonics Corporation Microstructuring optical wave guide devices with femtosecond optical pulses
DE10240033B4 (de) 2002-08-28 2005-03-10 Jenoptik Automatisierungstech Anordnung zum Einbringen von Strahlungsenergie in ein Werkstück aus einem schwach absorbierenden Material
US6737345B1 (en) 2002-09-10 2004-05-18 Taiwan Semiconductor Manufacturing Company Scheme to define laser fuse in dual damascene CU process
US20040051982A1 (en) 2002-09-13 2004-03-18 Perchak Robert M. Wide angle surface generator & target
JP3929393B2 (ja) 2002-12-03 2007-06-13 株式会社日本エミック 切断装置
JP2004209675A (ja) 2002-12-26 2004-07-29 Kashifuji:Kk 押圧切断装置及び押圧切断方法
KR100497820B1 (ko) 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
TWI319412B (en) 2003-01-15 2010-01-11 Sumitomo Rubber Ind Polymeric-type antistatic agent and antistatic polymer composition and fabricating method thereof
JP2004217492A (ja) 2003-01-17 2004-08-05 Murakami Corp ガラス板材の切抜方法
CN100398249C (zh) 2003-01-21 2008-07-02 丰田钢铁中心株式会社 激光切割装置、激光切割方法和激光切割系统
JP3775410B2 (ja) 2003-02-03 2006-05-17 セイコーエプソン株式会社 レーザー加工方法、レーザー溶接方法並びにレーザー加工装置
CN1758985A (zh) 2003-03-12 2006-04-12 浜松光子学株式会社 激光加工方法
US7617167B2 (en) 2003-04-09 2009-11-10 Avisere, Inc. Machine vision system for enterprise management
RU2365547C2 (ru) 2003-04-22 2009-08-27 Дзе Кока-Кола Компани Способ и устройство для упрочнения стекла
US6952519B2 (en) 2003-05-02 2005-10-04 Corning Incorporated Large effective area high SBS threshold optical fiber
US6904218B2 (en) 2003-05-12 2005-06-07 Fitel U.S.A. Corporation Super-large-effective-area (SLA) optical fiber and communication system incorporating the same
DE10322376A1 (de) 2003-05-13 2004-12-02 Carl Zeiss Smt Ag Axiconsystem und Beleuchtungssystem damit
US7511886B2 (en) 2003-05-13 2009-03-31 Carl Zeiss Smt Ag Optical beam transformation system and illumination system comprising an optical beam transformation system
FR2855084A1 (fr) 2003-05-22 2004-11-26 Air Liquide Optique de focalisation pour le coupage laser
JP2005000952A (ja) 2003-06-12 2005-01-06 Nippon Sheet Glass Co Ltd レーザー加工方法及びレーザー加工装置
JP4820750B2 (ja) 2003-06-26 2011-11-24 ダンマークス テクニスク ユニバーシテット 複数の位相コントラストフィルタによる所望波面の生成
EP2269765B1 (en) 2003-07-18 2014-10-15 Hamamatsu Photonics K.K. Cut semiconductor chip
WO2005024516A2 (de) 2003-08-14 2005-03-17 Carl Zeiss Smt Ag Beleuchtungseinrichtung für eine mikrolithographische projektionsbelichtungsanlage
JP2005104819A (ja) 2003-09-10 2005-04-21 Nippon Sheet Glass Co Ltd 合せガラスの切断方法及び合せガラス切断装置
US7408616B2 (en) 2003-09-26 2008-08-05 Carl Zeiss Smt Ag Microlithographic exposure method as well as a projection exposure system for carrying out the method
US20050205778A1 (en) 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
JP2005135964A (ja) 2003-10-28 2005-05-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005138143A (ja) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US7172067B2 (en) 2003-11-10 2007-02-06 Johnson Level & Tool Mfg. Co., Inc. Level case with positioning indentations
JP2005144487A (ja) 2003-11-13 2005-06-09 Seiko Epson Corp レーザ加工装置及びレーザ加工方法
JP3962718B2 (ja) 2003-12-01 2007-08-22 キヤノン株式会社 情報処理装置及びその制御方法、プログラム
US20080190981A1 (en) 2003-12-04 2008-08-14 Yasutomo Okajima Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate
US7057709B2 (en) 2003-12-04 2006-06-06 International Business Machines Corporation Printing a mask with maximum possible process window through adjustment of the source distribution
JP2005179154A (ja) 2003-12-22 2005-07-07 Shibuya Kogyo Co Ltd 脆性材料の割断方法およびその装置
US7633033B2 (en) 2004-01-09 2009-12-15 General Lasertronics Corporation Color sensing for laser decoating
CN1910522B (zh) 2004-01-16 2010-05-26 卡尔蔡司Smt股份公司 偏振调制光学元件
US20070019179A1 (en) 2004-01-16 2007-01-25 Damian Fiolka Polarization-modulating optical element
JP4951241B2 (ja) 2004-01-16 2012-06-13 独立行政法人科学技術振興機構 微細加工方法
US8270077B2 (en) 2004-01-16 2012-09-18 Carl Zeiss Smt Gmbh Polarization-modulating optical element
JP4074589B2 (ja) 2004-01-22 2008-04-09 Ｔｄｋ株式会社 レーザ加工装置及びレーザ加工方法
TWI395068B (zh) 2004-01-27 2013-05-01 尼康股份有限公司 光學系統、曝光裝置以及曝光方法
JP2005219960A (ja) 2004-02-05 2005-08-18 Nishiyama Stainless Chem Kk ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ
WO2005084874A1 (ja) 2004-03-05 2005-09-15 Olympus Corporation レーザ加工装置
DE102004012402B3 (de) 2004-03-13 2005-08-25 Schott Ag Verfahren zum Freiformschneiden von gewölbten Substraten aus sprödbrüchigem Material
JP5074658B2 (ja) 2004-03-15 2012-11-14 キヤノン株式会社 最適化方法、最適化装置、及びプログラム
US7486705B2 (en) 2004-03-31 2009-02-03 Imra America, Inc. Femtosecond laser processing system with process parameters, controls and feedback
JP4418282B2 (ja) 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
US20050231651A1 (en) 2004-04-14 2005-10-20 Myers Timothy F Scanning display system
US7187833B2 (en) 2004-04-29 2007-03-06 Corning Incorporated Low attenuation large effective area optical fiber
KR100626554B1 (ko) 2004-05-11 2006-09-21 주식회사 탑 엔지니어링 비금속재 절단장치 및 비금속재 절단시의 절단깊이 제어방법
US7123348B2 (en) 2004-06-08 2006-10-17 Asml Netherlands B.V Lithographic apparatus and method utilizing dose control
GB0412974D0 (en) 2004-06-10 2004-07-14 Syngenta Participations Ag Method of applying active ingredients
JP4890746B2 (ja) 2004-06-14 2012-03-07 株式会社ディスコ ウエーハの加工方法
US7804043B2 (en) 2004-06-15 2010-09-28 Laserfacturing Inc. Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
DE102005030543A1 (de) 2004-07-08 2006-02-02 Carl Zeiss Smt Ag Polarisatoreinrichtung zur Erzeugung einer definierten Ortsverteilung von Polarisationszuständen
US7283209B2 (en) 2004-07-09 2007-10-16 Carl Zeiss Smt Ag Illumination system for microlithography
US7231786B2 (en) 2004-07-29 2007-06-19 Corning Incorporated Process and device for manufacturing glass sheet
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US7136227B2 (en) 2004-08-06 2006-11-14 Matsushita Electric Industrial Co., Ltd. Fresnel zone plate based on elastic materials
JP4518078B2 (ja) 2004-09-22 2010-08-04 株式会社ニコン 照明装置、露光装置及びマイクロデバイスの製造方法
JP4527488B2 (ja) 2004-10-07 2010-08-18 株式会社ディスコ レーザ加工装置
JP3887394B2 (ja) 2004-10-08 2007-02-28 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
JP3723201B1 (ja) 2004-10-18 2005-12-07 独立行政法人食品総合研究所 貫通孔を有する金属製基板を用いたマイクロスフィアの製造方法
WO2006046525A1 (ja) 2004-10-25 2006-05-04 Mitsuboshi Diamond Industrial Co., Ltd. クラック形成方法およびクラック形成装置
JP4692717B2 (ja) 2004-11-02 2011-06-01 澁谷工業株式会社 脆性材料の割断装置
JP4222296B2 (ja) 2004-11-22 2009-02-12 住友電気工業株式会社 レーザ加工方法とレーザ加工装置
JP4564343B2 (ja) 2004-11-24 2010-10-20 大日本印刷株式会社 導電材充填スルーホール基板の製造方法
JP2006150385A (ja) 2004-11-26 2006-06-15 Canon Inc レーザ割断方法
US7201965B2 (en) 2004-12-13 2007-04-10 Corning Incorporated Glass laminate substrate having enhanced impact and static loading resistance
KR101096733B1 (ko) 2004-12-27 2011-12-21 엘지디스플레이 주식회사 기판의 절단장치 및 이를 이용한 기판의 절단방법
KR101170587B1 (ko) 2005-01-05 2012-08-01 티에이치케이 인텍스 가부시키가이샤 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치
US7542013B2 (en) 2005-01-31 2009-06-02 Asml Holding N.V. System and method for imaging enhancement via calculation of a customized optimal pupil field and illumination mode
EP1811547A4 (en) 2005-02-03 2010-06-02 Nikon Corp OPTICAL INTEGRATOR, OPTICAL LIGHTING DEVICE, EXPOSURE DEVICE AND EXPOSURE METHOD
JP2006248885A (ja) 2005-02-08 2006-09-21 Takeji Arai 超短パルスレーザによる石英の切断方法
JP2006240948A (ja) 2005-03-07 2006-09-14 Nippon Sheet Glass Co Ltd ガラス板製品を切り抜きにより製造する方法
DE102005013783B4 (de) 2005-03-22 2007-08-16 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung
US20070228616A1 (en) * 2005-05-11 2007-10-04 Kyu-Yong Bang Device and method for cutting nonmetalic substrate
US20060261118A1 (en) 2005-05-17 2006-11-23 Cox Judy K Method and apparatus for separating a pane of brittle material from a moving ribbon of the material
JP4173151B2 (ja) 2005-05-23 2008-10-29 株式会社椿本チエイン コンベヤチェーン
US7402773B2 (en) 2005-05-24 2008-07-22 Disco Corporation Laser beam processing machine
KR100915273B1 (ko) 2005-06-01 2009-09-03 페톤 가부시끼가이샤 레이저 가공장치 및 레이저 가공방법
DE102005042072A1 (de) 2005-06-01 2006-12-14 Forschungsverbund Berlin E.V. Verfahren zur Erzeugung von vertikalen elektrischen Kontaktverbindungen in Halbleiterwafern
JP2008544531A (ja) 2005-06-21 2008-12-04 カール ツァイス エスエムテー アーゲー 瞳ファセットミラー上に減衰素子を備えた二重ファセット照明光学系
JP4841873B2 (ja) 2005-06-23 2011-12-21 大日本スクリーン製造株式会社 熱処理用サセプタおよび熱処理装置
US7566914B2 (en) 2005-07-07 2009-07-28 Intersil Americas Inc. Devices with adjustable dual-polarity trigger- and holding-voltage/current for high level of electrostatic discharge protection in sub-micron mixed signal CMOS/BiCMOS integrated circuits
JP4490883B2 (ja) 2005-07-19 2010-06-30 株式会社レーザーシステム レーザ加工装置およびレーザ加工方法
US7934172B2 (en) 2005-08-08 2011-04-26 Micronic Laser Systems Ab SLM lithography: printing to below K1=.30 without previous OPC processing
DE102005039833A1 (de) 2005-08-22 2007-03-01 Rowiak Gmbh Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen
KR20070023958A (ko) 2005-08-25 2007-03-02 삼성전자주식회사 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
US7373041B2 (en) 2005-08-31 2008-05-13 Schleifring Und Apparatebau Gmbh Optical rotary coupling
US7626138B2 (en) 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8118971B2 (en) 2005-09-12 2012-02-21 Nippon Sheet Glass Company, Limited Interlayer film separation method
US20070068648A1 (en) 2005-09-28 2007-03-29 Honeywell International, Inc. Method for repairing die cast dies
KR100792593B1 (ko) 2005-10-12 2008-01-09 한국정보통신대학교 산학협력단 극초단 펄스 레이저를 이용한 단일 펄스 패턴 형성방법 및시스템
US20070111119A1 (en) 2005-11-15 2007-05-17 Honeywell International, Inc. Method for repairing gas turbine engine compressor components
JP4424302B2 (ja) * 2005-11-16 2010-03-03 株式会社デンソー 半導体チップの製造方法
JP2007142000A (ja) 2005-11-16 2007-06-07 Denso Corp レーザ加工装置およびレーザ加工方法
KR100858983B1 (ko) 2005-11-16 2008-09-17 가부시키가이샤 덴소 반도체 장치 및 반도체 기판 다이싱 방법
US7838331B2 (en) 2005-11-16 2010-11-23 Denso Corporation Method for dicing semiconductor substrate
US7977601B2 (en) 2005-11-28 2011-07-12 Electro Scientific Industries, Inc. X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method
WO2007069516A1 (en) 2005-12-16 2007-06-21 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
GB0600022D0 (en) 2006-01-03 2006-02-08 Pilkington Plc Glazings
JP4483793B2 (ja) 2006-01-27 2010-06-16 セイコーエプソン株式会社 微細構造体の製造方法及び製造装置
US7418181B2 (en) 2006-02-13 2008-08-26 Adc Telecommunications, Inc. Fiber optic splitter module
KR100985428B1 (ko) 2006-02-15 2010-10-05 아사히 가라스 가부시키가이샤 유리 기판의 모따기 방법 및 장치
US7535634B1 (en) 2006-02-16 2009-05-19 The United States Of America As Represented By The National Aeronautics And Space Administration Optical device, system, and method of generating high angular momentum beams
WO2007096958A1 (ja) 2006-02-22 2007-08-30 Nippon Sheet Glass Company, Limited レーザを用いたガラスの加工方法および加工装置
JP4672689B2 (ja) 2006-02-22 2011-04-20 日本板硝子株式会社 レーザを用いたガラスの加工方法および加工装置
WO2007096460A2 (en) 2006-02-23 2007-08-30 Picodeon Ltd Oy Surface treatment technique and surface treatment apparatus associated with ablation technology
DE102006012034A1 (de) 2006-03-14 2007-09-20 Carl Zeiss Smt Ag Optisches System, insbesondere in einer Beleuchtungseinrichtung einer Projektionsbelichtungsanlage
JP2007253203A (ja) 2006-03-24 2007-10-04 Sumitomo Electric Ind Ltd レーザ加工用光学装置
US20090050661A1 (en) 2006-03-24 2009-02-26 Youn-Ho Na Glass Cutting Apparatus With Bending Member and Method Using Thereof
WO2007119740A1 (ja) 2006-04-13 2007-10-25 Toray Engineering Co., Ltd. スクライブ方法、スクライブ装置、及びこの方法または装置を用いて割断した割断基板
US7794904B2 (en) 2006-04-24 2010-09-14 Stc.Unm Method and apparatus for producing interferometric lithography patterns with circular symmetry
US20070298529A1 (en) 2006-05-31 2007-12-27 Toyoda Gosei, Co., Ltd. Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
GB2439962B (en) 2006-06-14 2008-09-24 Exitech Ltd Process and apparatus for laser scribing
US7897487B2 (en) 2006-07-03 2011-03-01 Hamamatsu Photonics K.K. Laser processing method and chip
JP2008018547A (ja) 2006-07-11 2008-01-31 Seiko Epson Corp 基体の製造方法、ｔｆｔ基板の製造方法、多層構造基板の製造方法、表示装置の製造方法
DE102006035555A1 (de) 2006-07-27 2008-01-31 Eliog-Kelvitherm Industrieofenbau Gmbh Anordnung und Verfahren zur Verformung von Glasscheiben
FR2904437B1 (fr) 2006-07-28 2008-10-24 Saint Gobain Dispositif actif a proprietes energetiques/optiques variables
JP2008037943A (ja) 2006-08-03 2008-02-21 Nitto Denko Corp 衝撃吸収粘着剤シートおよびその製造方法
TWI362370B (en) 2006-08-18 2012-04-21 Foxsemicon Integrated Tech Inc Method for cutting a brittle substrate
US8168514B2 (en) 2006-08-24 2012-05-01 Corning Incorporated Laser separation of thin laminated glass substrates for flexible display applications
DE102007042047A1 (de) 2006-09-06 2008-03-27 Carl Zeiss Smt Ag Teilsystem einer Beleuchtungseinrichtung einer mikrolithographischen Projektionsbelichtungsanlage
CN102489883B (zh) 2006-09-19 2015-12-02 浜松光子学株式会社 激光加工方法和激光加工装置
US7867907B2 (en) 2006-10-17 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
DE102006051105B3 (de) 2006-10-25 2008-06-12 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlung
GB0622232D0 (en) 2006-11-08 2006-12-20 Rumsby Philip T Method and apparatus for laser beam alignment for solar panel scribing
GB0623511D0 (en) 2006-11-24 2007-01-03 Council Cent Lab Res Councils Raman detection of container contents
JP2008132616A (ja) 2006-11-27 2008-06-12 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
US8338744B2 (en) 2006-11-30 2012-12-25 Sumitomo Electric Industries, Ltd. Condensing optical system, laser processing method and apparatus, and manufacturing method of brittle material blank
US8041127B2 (en) 2006-11-30 2011-10-18 Intuit Inc. Method and system for obscuring and securing financial data in an online banking application
US20080158529A1 (en) 2006-12-28 2008-07-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8952832B2 (en) 2008-01-18 2015-02-10 Invensense, Inc. Interfacing application programs and motion sensors of a device
KR20090104001A (ko) * 2007-01-05 2009-10-05 지에스아이 그룹 코포레이션 멀티 펄스 레이저 처리 시스템 및 방법
AT504726A1 (de) 2007-01-05 2008-07-15 Lisec Maschb Gmbh Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe
JP2008168327A (ja) 2007-01-15 2008-07-24 Shinko Seisakusho:Kk レーザ切断装置
US7566657B2 (en) 2007-01-17 2009-07-28 Hewlett-Packard Development Company, L.P. Methods of forming through-substrate interconnects
CN103345128B (zh) 2007-02-06 2017-04-12 卡尔蔡司Smt有限责任公司 微光刻投射曝光设备的照明系统
JP5318748B2 (ja) 2007-02-22 2013-10-16 日本板硝子株式会社 陽極接合用ガラス
CN101622722B (zh) 2007-02-27 2012-11-21 卡尔蔡司激光器材有限责任公司 连续涂覆设备、生产晶态薄膜和太阳电池的方法
TWI394731B (zh) 2007-03-02 2013-05-01 Nippon Electric Glass Co 強化板玻璃及其製造方法
ITMI20070528A1 (it) 2007-03-16 2008-09-17 Piaggio & C Spa Sistema di propulsione e di trasmissione ibrida per motoveicoli
US8937706B2 (en) 2007-03-30 2015-01-20 Asml Netherlands B.V. Lithographic apparatus and method
US9250536B2 (en) 2007-03-30 2016-02-02 Asml Netherlands B.V. Lithographic apparatus and method
WO2008119794A1 (en) 2007-04-03 2008-10-09 Carl Zeiss Smt Ag Optical system, in particular illumination device or projection objective of a microlithographic projection exposure apparatus
JP5784273B2 (ja) 2007-04-05 2015-09-24 チャーム エンジニアリング株式会社 レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法
JP4863168B2 (ja) 2007-04-17 2012-01-25 日本電気硝子株式会社 フラットパネルディスプレイ用ガラス基板およびその製造方法
EP1983154B1 (en) 2007-04-17 2013-12-25 Services Pétroliers Schlumberger In-situ correction of triaxial accelerometer and magnetometer measurements made in a well
DE102007018674A1 (de) 2007-04-18 2008-10-23 Lzh Laserzentrum Hannover E.V. Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas
JP2008288577A (ja) 2007-04-18 2008-11-27 Fujikura Ltd 基板の処理方法、貫通配線基板及びその製造方法、並びに電子部品
WO2008136918A2 (en) 2007-05-07 2008-11-13 Corning Incorporated Large effective area fiber
US8236116B2 (en) 2007-06-06 2012-08-07 Centre Luxembourgeois De Recherches Pour Le Verre Et Al Ceramique S.A. (C.R.V.C.) Method of making coated glass article, and intermediate product used in same
US20080310465A1 (en) 2007-06-14 2008-12-18 Martin Achtenhagen Method and Laser Device for Stabilized Frequency Doubling
US8374472B2 (en) 2007-06-15 2013-02-12 Ofs Fitel, Llc Bend insensitivity in single mode optical fibers
US8076605B2 (en) 2007-06-25 2011-12-13 Electro Scientific Industries, Inc. Systems and methods for adapting parameters to increase throughput during laser-based wafer processing
DE112008001873A5 (de) 2007-07-21 2010-06-10 Du, Keming, Dr. Optische Anordnung zur Erzeugung von Multistrahlen
US8169587B2 (en) 2007-08-16 2012-05-01 Apple Inc. Methods and systems for strengthening LCD modules
JP2009056482A (ja) 2007-08-31 2009-03-19 Seiko Epson Corp 基板分割方法、及び表示装置の製造方法
JP5113462B2 (ja) 2007-09-12 2013-01-09 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法
US20100276505A1 (en) 2007-09-26 2010-11-04 Roger Earl Smith Drilling in stretched substrates
JP2009084089A (ja) 2007-09-28 2009-04-23 Omron Laserfront Inc ガラス切断装置及び方法
JP2009082958A (ja) 2007-09-28 2009-04-23 Sunx Ltd レーザ加工装置及びアキシコンレンズ
DE102008041593A1 (de) 2007-10-09 2009-04-16 Carl Zeiss Smt Ag Beleuchtungsoptik für die Mikrolithographie
CN101610870B (zh) 2007-10-16 2013-09-11 三星钻石工业股份有限公司 脆性材料基板的u形槽加工方法以及使用该方法的去除加工方法、打孔加工方法和倒角方法
KR20090041316A (ko) 2007-10-23 2009-04-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 성막 방법 및 발광 장치의 제작 방법
JP5326259B2 (ja) 2007-11-08 2013-10-30 株式会社ニコン 照明光学装置、露光装置、およびデバイス製造方法
DE102007055567A1 (de) 2007-11-20 2009-05-28 Carl Zeiss Smt Ag Optisches System
KR100949152B1 (ko) 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
JP4710897B2 (ja) 2007-11-28 2011-06-29 セイコーエプソン株式会社 接合体の剥離方法
KR20090057161A (ko) 2007-12-01 2009-06-04 주식회사 이엔팩 초발수성 좌변기 시트
JP2009142886A (ja) 2007-12-18 2009-07-02 Agt:Kk レーザー穴開け加工方法
CN101462822B (zh) 2007-12-21 2012-08-29 鸿富锦精密工业（深圳）有限公司 具有通孔的脆性非金属工件及其加工方法
EP2237218A4 (en) 2007-12-25 2016-03-23 Nec Corp Image Processing Device, Image Processing Method, Image Decomposition Device, Image Compilation Device, Image Transmission System, and Storage Media
US7842583B2 (en) 2007-12-27 2010-11-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
US20090183764A1 (en) 2008-01-18 2009-07-23 Tenksolar, Inc Detachable Louver System
JP5098665B2 (ja) 2008-01-23 2012-12-12 株式会社東京精密 レーザー加工装置およびレーザー加工方法
JP2009178725A (ja) 2008-01-29 2009-08-13 Sunx Ltd レーザ加工装置及びレーザ加工方法
KR101303542B1 (ko) 2008-02-11 2013-09-03 엘지디스플레이 주식회사 평판표시패널 절단장치
GB0802944D0 (en) 2008-02-19 2008-03-26 Rumsby Philip T Apparatus for laser processing the opposite sides of thin panels
PL2285521T3 (pl) 2008-02-20 2019-12-31 Lasercoil Technologies, Llc Postępowe laserowe urządzenie wykrawające do cięcia z wysoką prędkością
WO2009114372A2 (en) 2008-03-13 2009-09-17 Honeywell International Inc. Thermal interconnect and integrated interface systems, methods of production and uses thereof
JP5826027B2 (ja) 2008-03-21 2015-12-02 イムラ アメリカ インコーポレイテッド レーザベースの材料加工方法及びシステム
JP5333816B2 (ja) 2008-03-26 2013-11-06 旭硝子株式会社 ガラス板の切線加工装置及び切線加工方法
US8237080B2 (en) 2008-03-27 2012-08-07 Electro Scientific Industries, Inc Method and apparatus for laser drilling holes with Gaussian pulses
JP5345334B2 (ja) 2008-04-08 2013-11-20 株式会社レミ 脆性材料の熱応力割断方法
JP5274085B2 (ja) 2008-04-09 2013-08-28 株式会社アルバック レーザー加工装置、レーザービームのピッチ可変方法、及びレーザー加工方法
US8358888B2 (en) 2008-04-10 2013-01-22 Ofs Fitel, Llc Systems and techniques for generating Bessel beams
JP2009255114A (ja) 2008-04-15 2009-11-05 Linkstar Japan Co Ltd 脆性材料基板の加工装置および切断方法
US8035901B2 (en) 2008-04-30 2011-10-11 Corning Incorporated Laser scoring with curved trajectory
JP5539625B2 (ja) 2008-05-08 2014-07-02 ミヤチテクノス株式会社 レーザ加工方法
EP2119512B1 (en) 2008-05-14 2017-08-09 Gerresheimer Glas GmbH Method and device for removing contaminating particles from containers on automatic production system
US8061128B2 (en) 2008-05-15 2011-11-22 Ford Global Technologies, Llc Diesel particulate filter overstress mitigation
US8053704B2 (en) 2008-05-27 2011-11-08 Corning Incorporated Scoring of non-flat materials
GB2460648A (en) 2008-06-03 2009-12-09 M Solv Ltd Method and apparatus for laser focal spot size control
JP2009297734A (ja) 2008-06-11 2009-12-24 Nitto Denko Corp レーザー加工用粘着シート及びレーザー加工方法
US8514476B2 (en) 2008-06-25 2013-08-20 View, Inc. Multi-pane dynamic window and method for making same
US7810355B2 (en) 2008-06-30 2010-10-12 Apple Inc. Full perimeter chemical strengthening of substrates
US8268913B2 (en) 2008-06-30 2012-09-18 Fina Technology, Inc. Polymeric blends and methods of using same
KR101602373B1 (ko) 2008-07-11 2016-03-21 에이에스엠엘 네델란즈 비.브이. 스펙트럼 퓨리티 필터, 방사선 소스, 리소그래피 장치, 및 디바이스 제조 방법
JP2010017990A (ja) 2008-07-14 2010-01-28 Seiko Epson Corp 基板分割方法
US7773848B2 (en) 2008-07-30 2010-08-10 Corning Incorporated Low bend loss single mode optical fiber
TWI484563B (zh) 2008-08-01 2015-05-11 Moohan Co Ltd 薄膜電晶體之製造方法與設備
KR101499651B1 (ko) 2008-08-01 2015-03-06 주식회사 무한 박막 트랜지스터 어레이 기판의 제조방법 및 제조장치
JP5071868B2 (ja) 2008-08-11 2012-11-14 オムロン株式会社 レーザ加工方法、レーザ加工装置、光学素子の製造方法、および光学素子
TW201009525A (en) 2008-08-18 2010-03-01 Ind Tech Res Inst Laser marking method and laser marking system
JP5155774B2 (ja) 2008-08-21 2013-03-06 株式会社ノリタケカンパニーリミテド プラトー面加工用レジノイド超砥粒砥石ホイール
JP2010075991A (ja) 2008-09-29 2010-04-08 Fujifilm Corp レーザ加工装置
JP5435267B2 (ja) 2008-10-01 2014-03-05 日本電気硝子株式会社 ガラスロール、ガラスロールの製造装置、及びガラスロールの製造方法
US8123515B2 (en) 2008-10-02 2012-02-28 Robert Frank Schleelein System and method for producing composite materials with variable shapes
US7869210B2 (en) 2008-10-08 2011-01-11 Dell Products L.P. Temperature control for an information handling system rack
JP5297139B2 (ja) 2008-10-09 2013-09-25 新光電気工業株式会社 配線基板及びその製造方法
US8895892B2 (en) 2008-10-23 2014-11-25 Corning Incorporated Non-contact glass shearing device and method for scribing or cutting a moving glass sheet
US8092739B2 (en) 2008-11-25 2012-01-10 Wisconsin Alumni Research Foundation Retro-percussive technique for creating nanoscale holes
US8131494B2 (en) 2008-12-04 2012-03-06 Baker Hughes Incorporated Rotatable orientation independent gravity sensor and methods for correcting systematic errors
AU2009326846A1 (en) 2008-12-08 2011-06-30 University Of South Australia Formation of nanoporous materials
JP2010134328A (ja) 2008-12-08 2010-06-17 Disco Abrasive Syst Ltd 偏光素子およびレーザーユニット
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US20110240476A1 (en) 2008-12-17 2011-10-06 Ding Wang Fabrication of conductive nanostructures on a flexible substrate
EP2202545A1 (en) 2008-12-23 2010-06-30 Karlsruher Institut für Technologie Beam transformation module with an axicon in a double-pass mode
KR101020621B1 (ko) 2009-01-15 2011-03-09 연세대학교 산학협력단 광섬유를 이용하는 광소자 제조 방법, 광섬유를 이용하는 광소자 및 이를 이용한 광 트위저
KR20110121605A (ko) 2009-02-02 2011-11-07 아사히 가라스 가부시키가이샤 반도체 디바이스 부재용 유리 기판 및 반도체 디바이스 부재용 유리 기판의 제조 방법
CN102307699B (zh) 2009-02-09 2015-07-15 浜松光子学株式会社 加工对象物的切断方法
US8327666B2 (en) 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8347651B2 (en) 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
US8245540B2 (en) 2009-02-24 2012-08-21 Corning Incorporated Method for scoring a sheet of brittle material
CN102326232B (zh) 2009-02-25 2016-01-20 日亚化学工业株式会社 半导体元件的制造方法
US8218929B2 (en) 2009-02-26 2012-07-10 Corning Incorporated Large effective area low attenuation optical fiber
CN201357287Y (zh) 2009-03-06 2009-12-09 苏州德龙激光有限公司 新型皮秒激光加工装置
CN101502914A (zh) 2009-03-06 2009-08-12 苏州德龙激光有限公司 用于喷油嘴微孔加工的皮秒激光加工装置
JP5300544B2 (ja) 2009-03-17 2013-09-25 株式会社ディスコ 光学系及びレーザ加工装置
KR101041140B1 (ko) 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 방법
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
US9723723B2 (en) 2009-03-31 2017-08-01 View, Inc. Temperable electrochromic devices
CN102378664B (zh) 2009-04-07 2015-07-01 通快公司 具有利用射束的切割头和联接到移动切割头的移动单元的抽吸管的切割机
KR200448519Y1 (ko) 2009-04-28 2010-04-21 남동진 돌출형 ⅰｃ 패키지용 방열판
US20100279067A1 (en) 2009-04-30 2010-11-04 Robert Sabia Glass sheet having enhanced edge strength
WO2010129459A2 (en) 2009-05-06 2010-11-11 Corning Incorporated Carrier for glass substrates
EP2251310B1 (en) 2009-05-13 2012-03-28 Corning Incorporated Methods and systems for forming continuous glass sheets
US8539795B2 (en) 2009-05-13 2013-09-24 Corning Incorporated Methods for cutting a fragile material
US8132427B2 (en) 2009-05-15 2012-03-13 Corning Incorporated Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet
US8269138B2 (en) 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
US8194170B2 (en) 2009-06-02 2012-06-05 Algonquin College Axicon lens array
DE102009023602B4 (de) * 2009-06-02 2012-08-16 Grenzebach Maschinenbau Gmbh Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl
JP5525601B2 (ja) 2009-06-04 2014-06-18 コアレイズ オーワイ レーザを用いた基板加工方法
US20100332087A1 (en) 2009-06-24 2010-12-30 Mark Robert Claffee Remote Vehicle Controller
TWI395630B (zh) 2009-06-30 2013-05-11 Mitsuboshi Diamond Ind Co Ltd 使用雷射光之玻璃基板加工裝置
JP5416492B2 (ja) 2009-06-30 2014-02-12 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板加工装置
US8592716B2 (en) 2009-07-22 2013-11-26 Corning Incorporated Methods and apparatus for initiating scoring
CN201471092U (zh) 2009-08-07 2010-05-19 苏州德龙激光有限公司 皮秒激光加工设备的高精度z轴载物平台
CN101637849B (zh) 2009-08-07 2011-12-07 苏州德龙激光有限公司 皮秒激光加工设备的高精度z轴载物平台
JP5500914B2 (ja) 2009-08-27 2014-05-21 株式会社半導体エネルギー研究所 レーザ照射装置
JP2013503105A (ja) 2009-08-28 2013-01-31 コーニング インコーポレイテッド 化学強化ガラス基板からガラス品をレーザ割断するための方法
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
KR101094284B1 (ko) 2009-09-02 2011-12-19 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
EP2470325A4 (en) 2009-09-24 2017-07-05 Electro Scientific Industries, Inc. Method and apparatus to scribe a line in a thin film material using a burst of laser pulses with beneficial pulse shape
JP2011079690A (ja) 2009-10-06 2011-04-21 Leo:Kk 回折格子を用いた厚板ガラスのレーザ熱応力割断
US20110088324A1 (en) 2009-10-20 2011-04-21 Wessel Robert B Apparatus and method for solar heat gain reduction in a window assembly
US20110094267A1 (en) 2009-10-28 2011-04-28 Kenneth William Aniolek Methods of producing glass sheets
JP5715639B2 (ja) 2009-11-03 2015-05-13 コーニング インコーポレイテッド 変動速度を有する移動ガラスリボンのレーザスコーリング
US8623496B2 (en) 2009-11-06 2014-01-07 Wisconsin Alumni Research Foundation Laser drilling technique for creating nanoscale holes
NL2005331A (en) 2009-11-18 2011-05-19 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US20120234807A1 (en) 2009-12-07 2012-09-20 J.P. Sercel Associates Inc. Laser scribing with extended depth affectation into a workplace
US8338745B2 (en) 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
EP2336823A1 (de) 2009-12-18 2011-06-22 Boegli-Gravures S.A. Verfahren und Vorrichtung zur Herstellung von Masken für eine Laseranlage zur Erzeugung von Mikrostrukturen.
WO2011076500A1 (en) 2009-12-23 2011-06-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9042422B2 (en) * 2009-12-30 2015-05-26 National University Corporation Chiba University Tunable external resonator laser
WO2011082065A2 (en) 2009-12-30 2011-07-07 Gsi Group Corporation Link processing with high speed beam deflection
JP5405324B2 (ja) 2010-01-04 2014-02-05 富士フイルム株式会社 撮像レンズおよび撮像装置
JP5461205B2 (ja) 2010-01-19 2014-04-02 日立造船株式会社 レーザ加工方法とその装置
TWI438162B (zh) 2010-01-27 2014-05-21 Wintek Corp 強化玻璃切割方法及強化玻璃切割預置結構
US9234760B2 (en) 2010-01-29 2016-01-12 Blackberry Limited Portable mobile transceiver for GPS navigation and vehicle data input for dead reckoning mode
ITMO20100020A1 (it) 2010-02-02 2011-08-03 Keraglass Engineering S R L Dispositivo per la pulizia di rulli.
EP2532470A1 (en) 2010-02-05 2012-12-12 Fujikura Ltd. Formation method for microstructure, and substrate having microstructure
US9086509B2 (en) 2010-02-25 2015-07-21 The United States Of America As Represented By The Secretary, Department Of Health And Human Services Azicon beam polarization devices
EP2641734B1 (en) 2010-03-05 2017-02-22 Sage Electrochromics, Inc. Lamination of electrochromic device to glass substrates
US8743165B2 (en) 2010-03-05 2014-06-03 Micronic Laser Systems Ab Methods and device for laser processing
JP5249979B2 (ja) 2010-03-18 2013-07-31 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
KR101842421B1 (ko) 2010-03-24 2018-05-14 리모 게엠베하 레이저 광선 제공 장치 및 선형 배광 재생 장치
US20110238308A1 (en) 2010-03-26 2011-09-29 Isaac Thomas Miller Pedal navigation using leo signals and body-mounted sensors
CN102905839B (zh) 2010-03-30 2016-03-09 Imra美国公司 基于激光的材料加工装置和方法
US8654538B2 (en) 2010-03-30 2014-02-18 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
TWI433745B (zh) 2010-04-16 2014-04-11 Qmc Co Ltd 雷射加工方法及雷射加工設備
CN102844857A (zh) 2010-04-20 2012-12-26 旭硝子株式会社 半导体器件贯通电极用的玻璃基板
JP2013144613A (ja) 2010-04-20 2013-07-25 Asahi Glass Co Ltd 半導体デバイス貫通電極形成用のガラス基板の製造方法
US8821211B2 (en) 2010-04-21 2014-09-02 Lg Chem, Ltd. Device for cutting of glass sheet
DE202010006047U1 (de) 2010-04-22 2010-07-22 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Strahlformungseinheit zur Fokussierung eines Laserstrahls
KR100984727B1 (ko) 2010-04-30 2010-10-01 유병소 대상물 가공 방법 및 대상물 가공 장치
US8245539B2 (en) 2010-05-13 2012-08-21 Corning Incorporated Methods of producing glass sheets
KR20130079395A (ko) 2010-05-19 2013-07-10 미쓰비시 가가꾸 가부시키가이샤 카드용 시트 및 카드
JP5488907B2 (ja) 2010-05-20 2014-05-14 日本電気硝子株式会社 ガラスフィルムの回収装置及び回収方法
CA2800150C (en) 2010-05-21 2018-09-04 Novartis Ag Influenza virus reassortment method
GB2481190B (en) 2010-06-04 2015-01-14 Plastic Logic Ltd Laser ablation
SG186384A1 (en) 2010-06-29 2013-01-30 Corning Inc Multi-layer glass sheet made by co-drawing using the overflow downdraw fusion process
DE102010025966B4 (de) 2010-07-02 2012-03-08 Schott Ag Interposer und Verfahren zum Herstellen von Löchern in einem Interposer
DE102010025967B4 (de) 2010-07-02 2015-12-10 Schott Ag Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
DE102010025965A1 (de) 2010-07-02 2012-01-05 Schott Ag Verfahren zur spannungsarmen Herstellung von gelochten Werkstücken
DE202010013161U1 (de) 2010-07-08 2011-03-31 Oerlikon Solar Ag, Trübbach Laserbearbeitung mit mehreren Strahlen und dafür geeigneter Laseroptikkopf
WO2012006736A2 (en) * 2010-07-12 2012-01-19 Filaser Inc. Method of material processing by laser filamentation
JP5772827B2 (ja) 2010-07-12 2015-09-02 旭硝子株式会社 インプリントモールド用ＴｉＯ２含有石英ガラス基材およびその製造方法
FR2962818B1 (fr) 2010-07-13 2013-03-08 Saint Gobain Dispositif electrochimique a proprietes de transmission optique et/ou energetique electrocommandables.
KR20120015366A (ko) 2010-07-19 2012-02-21 엘지디스플레이 주식회사 강화유리 절단방법 및 절단장치
JP5580129B2 (ja) 2010-07-20 2014-08-27 株式会社アマダ 固体レーザ加工装置
JP2012024983A (ja) 2010-07-21 2012-02-09 Shibuya Kogyo Co Ltd 脆性材料の面取り方法とその装置
JP5669001B2 (ja) 2010-07-22 2015-02-12 日本電気硝子株式会社 ガラスフィルムの割断方法、ガラスロールの製造方法、及びガラスフィルムの割断装置
US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8828260B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Substrate processing method
JP2012031018A (ja) 2010-07-30 2012-02-16 Asahi Glass Co Ltd 強化ガラス基板及び強化ガラス基板の溝加工方法と強化ガラス基板の切断方法
US8604380B2 (en) 2010-08-19 2013-12-10 Electro Scientific Industries, Inc. Method and apparatus for optimally laser marking articles
US8584354B2 (en) 2010-08-26 2013-11-19 Corning Incorporated Method for making glass interposer panels
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
TWI402228B (zh) 2010-09-15 2013-07-21 Wintek Corp 強化玻璃切割方法、強化玻璃薄膜製程、強化玻璃切割預置結構及強化玻璃切割件
TWI576320B (zh) 2010-10-29 2017-04-01 康寧公司 用於裁切玻璃帶之方法與設備
WO2012061304A1 (en) 2010-11-02 2012-05-10 Georgia Tech Research Corporation Ultra-thin interposer assemblies with through vias
US9958750B2 (en) 2010-11-08 2018-05-01 View, Inc. Electrochromic window fabrication methods
US8164818B2 (en) 2010-11-08 2012-04-24 Soladigm, Inc. Electrochromic window fabrication methods
JP5617556B2 (ja) 2010-11-22 2014-11-05 日本電気硝子株式会社 帯状ガラスフィルム割断装置及び帯状ガラスフィルム割断方法
JP2012119098A (ja) 2010-11-29 2012-06-21 Gigaphoton Inc 光学装置、レーザ装置および極端紫外光生成装置
EP2646384B1 (en) 2010-11-30 2019-03-27 Corning Incorporated Methods of forming high-density arrays of holes in glass
US8616024B2 (en) 2010-11-30 2013-12-31 Corning Incorporated Methods for forming grooves and separating strengthened glass substrate sheets
US8607590B2 (en) 2010-11-30 2013-12-17 Corning Incorporated Methods for separating glass articles from strengthened glass substrate sheets
EP2457881B1 (en) 2010-11-30 2019-05-08 Corning Incorporated Method and apparatus for bending a sheet of material into a shaped article
EP2649490B1 (en) 2010-12-08 2018-07-11 View, Inc. Improved spacers for insulated glass units
TW201226345A (en) 2010-12-27 2012-07-01 Liefco Optical Inc Method of cutting tempered glass
JP5780941B2 (ja) 2010-12-28 2015-09-16 日東電工株式会社 多孔性電極シートおよびその製造方法、ならびに表示装置
KR101298019B1 (ko) 2010-12-28 2013-08-26 (주)큐엠씨 레이저 가공 장치
WO2012093471A1 (ja) * 2011-01-05 2012-07-12 Kondo Kiyoyuki ビーム加工装置
WO2012096053A1 (ja) 2011-01-11 2012-07-19 旭硝子株式会社 強化ガラス板の切断方法
CN102248302A (zh) 2011-01-13 2011-11-23 苏州德龙激光有限公司 超短脉冲激光异形切割钢化玻璃的装置及其方法
JP2012159749A (ja) 2011-02-01 2012-08-23 Nichia Chem Ind Ltd ベッセルビーム発生装置
US8475507B2 (en) 2011-02-01 2013-07-02 Solta Medical, Inc. Handheld apparatus for use by a non-physician consumer to fractionally resurface the skin of the consumer
US8539794B2 (en) 2011-02-01 2013-09-24 Corning Incorporated Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets
US8933367B2 (en) 2011-02-09 2015-01-13 Sumitomo Electric Industries, Ltd. Laser processing method
WO2012108052A1 (ja) 2011-02-10 2012-08-16 信越ポリマー株式会社 単結晶基板製造方法および内部改質層形成単結晶部材
JP5875121B2 (ja) 2011-02-10 2016-03-02 信越ポリマー株式会社 単結晶基板の製造方法および内部改質層形成単結晶部材の製造方法
DE102011000768B4 (de) 2011-02-16 2016-08-18 Ewag Ag Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung
JP5649592B2 (ja) 2011-02-17 2015-01-07 Hoya株式会社 携帯電子機器用カバーガラスのガラス基板の製造方法、携帯電子機器用カバーガラスのガラス基板および携帯電子機器
US8584490B2 (en) 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
JP5193326B2 (ja) 2011-02-25 2013-05-08 三星ダイヤモンド工業株式会社 基板加工装置および基板加工方法
US8776547B2 (en) 2011-02-28 2014-07-15 Corning Incorporated Local strengthening of glass by ion exchange
JP2012187618A (ja) 2011-03-11 2012-10-04 V Technology Co Ltd ガラス基板のレーザ加工装置
NL2006418C2 (nl) 2011-03-18 2012-09-19 Rexnord Flattop Europe Bv Transportsysteem, alsmede gebruik van een ten opzichte van een kunststof module binnenwaarts reikende kamer in een transportsysteem.
KR101927543B1 (ko) 2011-03-31 2018-12-10 아반스트레이트 가부시키가이샤 유리판의 제조 방법
WO2012138009A1 (ko) 2011-04-07 2012-10-11 (주)네톰 무선인식 태그 및 이를 구비한 전자제품 피씨비 및 전자제품 관리 시스템
US8857215B2 (en) 2011-05-18 2014-10-14 Corning Incorporated Apparatus and method for heat treating glass sheets
US8986072B2 (en) 2011-05-26 2015-03-24 Corning Incorporated Methods of finishing an edge of a glass sheet
WO2012164649A1 (ja) 2011-05-27 2012-12-06 浜松ホトニクス株式会社 レーザ加工方法
TWI547454B (zh) 2011-05-31 2016-09-01 康寧公司 於玻璃中高速製造微孔洞的方法
KR20140024919A (ko) 2011-06-15 2014-03-03 아사히 가라스 가부시키가이샤 유리판의 절단 방법
JP2013007842A (ja) 2011-06-23 2013-01-10 Toyo Seikan Kaisha Ltd 構造体形成装置、構造体形成方法及び構造体
JP5765421B2 (ja) 2011-06-28 2015-08-19 株式会社Ihi 脆性的な部材を切断する装置、方法、および切断された脆性的な部材
TWI572480B (zh) 2011-07-25 2017-03-01 康寧公司 經層壓及離子交換之強化玻璃疊層
DE112012003162T5 (de) 2011-07-29 2014-04-17 Ats Automation Tooling Systems Inc. Systeme und Verfahren zum Herstellen dünner Siliziumstäbe
KR101120471B1 (ko) 2011-08-05 2012-03-05 (주)지엘코어 다중 초점 방식의 펄스 레이저를 이용한 취성 재료 절단 장치
JP5729873B2 (ja) 2011-08-05 2015-06-03 株式会社マキタ 集塵装置
US8635887B2 (en) 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
JP2013043808A (ja) 2011-08-25 2013-03-04 Asahi Glass Co Ltd 強化ガラス板切断用保持具及び強化ガラス板の切断方法
US20130047671A1 (en) 2011-08-29 2013-02-28 Jeffrey T. Kohli Apparatus and method for forming glass sheets
DE112012003605T5 (de) 2011-08-29 2014-06-12 Asahi Glass Co., Ltd. Verfahren zum Schneiden einer Glasplatte mit erhöhter Festigkeit und Vorrichtung zum Schneiden einer Glasplatte mit erhöhter Festigkeit
CN103764579A (zh) 2011-08-31 2014-04-30 旭硝子株式会社 强化玻璃板的切断方法及强化玻璃板切断装置
PH12012000258A1 (en) 2011-09-09 2015-06-01 Hoya Corp Method of manufacturing an ion-exchanged glass article
US9422184B2 (en) 2011-09-15 2016-08-23 Nippon Electric Glass Co., Ltd. Cutting method for glass sheet and glass sheet cutting apparatus
JP5861864B2 (ja) 2011-09-15 2016-02-16 日本電気硝子株式会社 ガラス板切断方法およびガラス板切断装置
WO2013039230A1 (ja) 2011-09-15 2013-03-21 日本電気硝子株式会社 ガラス板切断方法
JP6063670B2 (ja) 2011-09-16 2017-01-18 株式会社アマダホールディングス レーザ切断加工方法及び装置
WO2013043173A1 (en) 2011-09-21 2013-03-28 Raydiance, Inc. Systems and processes that singulate materials
US8718431B2 (en) 2011-09-21 2014-05-06 Ofs Fitel, Llc Optimized ultra large area optical fibers
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
US8687932B2 (en) 2011-09-21 2014-04-01 Ofs Fitel, Llc Optimized ultra large area optical fibers
US8768129B2 (en) 2011-09-21 2014-07-01 Ofs Fitel, Llc Optimized ultra large area optical fibers
JP5931389B2 (ja) 2011-09-29 2016-06-08 川崎重工業株式会社 搬送システム
JP5864988B2 (ja) 2011-09-30 2016-02-17 浜松ホトニクス株式会社 強化ガラス板切断方法
FR2980859B1 (fr) 2011-09-30 2013-10-11 Commissariat Energie Atomique Procede et dispositif de lithographie
DE102011084128A1 (de) 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
JP2013091578A (ja) 2011-10-25 2013-05-16 Mitsuboshi Diamond Industrial Co Ltd ガラス基板のスクライブ方法
KR20130049080A (ko) 2011-11-03 2013-05-13 삼성디스플레이 주식회사 회전식 박막 증착 장치 및 그것을 이용한 박막 증착 방법
KR101269474B1 (ko) 2011-11-09 2013-05-30 주식회사 모린스 강화글라스 절단 방법
US20130129947A1 (en) 2011-11-18 2013-05-23 Daniel Ralph Harvey Glass article having high damage resistance
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US8666214B2 (en) 2011-11-30 2014-03-04 Corning Incorporated Low bend loss optical fiber
JP5963038B2 (ja) 2011-12-05 2016-08-03 株式会社リコー 穿孔装置、用紙処理装置及び画像形成装置
WO2013084879A1 (ja) 2011-12-07 2013-06-13 旭硝子株式会社 強化ガラス板の切断方法、及び強化ガラス板切断装置
WO2013084877A1 (ja) 2011-12-07 2013-06-13 旭硝子株式会社 強化ガラス板の切断方法、および強化ガラス板切断装置
KR20130065051A (ko) 2011-12-09 2013-06-19 삼성코닝정밀소재 주식회사 강화 글라스의 절단 방법 및 이를 이용한 터치스크린패널의 제조방법
JP5979600B2 (ja) 2011-12-12 2016-08-24 日本電気硝子株式会社 板ガラスの割断離反方法
US9021837B2 (en) 2011-12-12 2015-05-05 Nippon Electric Glass Co., Ltd. Method of cleaving and separating a glass sheet and apparatus for cleaving and separating a glass sheet
US8724937B2 (en) 2011-12-20 2014-05-13 International Business Machines Corporation Fiber to wafer interface
JP5910075B2 (ja) * 2011-12-27 2016-04-27 三星ダイヤモンド工業株式会社 被加工物の加工方法
JP5887929B2 (ja) 2011-12-28 2016-03-16 三星ダイヤモンド工業株式会社 被加工物の分断方法および光学素子パターン付き基板の分断方法
CN103182894A (zh) 2011-12-29 2013-07-03 深圳富泰宏精密工业有限公司 玻璃件及其制作方法
JP5685208B2 (ja) 2012-01-24 2015-03-18 株式会社日立製作所 薄板用熱間圧延機の制御装置および薄板用熱間圧延機の制御方法
JP5964607B2 (ja) 2012-02-14 2016-08-03 株式会社カネカ 剥離層付き支持体、基板構造、および電子デバイスの製造方法
JP2015511571A (ja) 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US20130222877A1 (en) 2012-02-28 2013-08-29 Sage Electrochromics, Inc. Multi-zone electrochromic devices
US9895771B2 (en) 2012-02-28 2018-02-20 General Lasertronics Corporation Laser ablation for the environmentally beneficial removal of surface coatings
CN104125934A (zh) 2012-02-28 2014-10-29 伊雷克托科学工业股份有限公司 用于分离强化玻璃的方法及装置及由该强化玻璃生产的物品
WO2013130608A1 (en) 2012-02-29 2013-09-06 Electro Scientific Industries, Inc. Methods and apparatus for machining strengthened glass and articles produced thereby
US9082764B2 (en) 2012-03-05 2015-07-14 Corning Incorporated Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same
JP2013187247A (ja) 2012-03-06 2013-09-19 Nippon Hoso Kyokai <Nhk> インターポーザおよびその製造方法
US9341912B2 (en) 2012-03-13 2016-05-17 View, Inc. Multi-zone EC windows
TW201343296A (zh) 2012-03-16 2013-11-01 Ipg Microsystems Llc 使一工件中具有延伸深度虛飾之雷射切割系統及方法
JP5964626B2 (ja) 2012-03-22 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
TW201339111A (zh) 2012-03-29 2013-10-01 Global Display Co Ltd 強化玻璃的切割方法
JP2013203630A (ja) 2012-03-29 2013-10-07 Asahi Glass Co Ltd 強化ガラス板の切断方法
JP2013203631A (ja) 2012-03-29 2013-10-07 Asahi Glass Co Ltd 強化ガラス板の切断方法、及び強化ガラス板切断装置
US9272941B2 (en) 2012-04-05 2016-03-01 Sage Electrochromics, Inc. Method of cutting a panel using a starter crack and a glass panel including a starter crack
JP2013216513A (ja) 2012-04-05 2013-10-24 Nippon Electric Glass Co Ltd ガラスフィルムの切断方法及びガラスフィルム積層体
JP2015120604A (ja) 2012-04-06 2015-07-02 旭硝子株式会社 強化ガラス板の切断方法、及び強化ガラス板切断システム
CN102642092B (zh) 2012-04-13 2015-06-10 北京信息科技大学 基于激光光束的微孔加工装置及方法
FR2989294B1 (fr) 2012-04-13 2022-10-14 Centre Nat Rech Scient Dispositif et methode de nano-usinage par laser
US20130288010A1 (en) 2012-04-27 2013-10-31 Ravindra Kumar Akarapu Strengthened glass article having shaped edge and method of making
KR20130124646A (ko) 2012-05-07 2013-11-15 주식회사 엠엠테크 강화 유리 절단 방법
US9365446B2 (en) 2012-05-14 2016-06-14 Richard Green Systems and methods for altering stress profiles of glass
DE102012010635B4 (de) 2012-05-18 2022-04-07 Leibniz-Institut für Oberflächenmodifizierung e.V. Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien
CN102672355B (zh) 2012-05-18 2015-05-13 杭州士兰明芯科技有限公司 Led衬底的划片方法
TWI468354B (zh) 2012-05-23 2015-01-11 Taiwan Mitsuboshi Diamond Ind Co Ltd 用於一玻璃基板之切割方法及切割設備
JP6009225B2 (ja) 2012-05-29 2016-10-19 浜松ホトニクス株式会社 強化ガラス板の切断方法
FR2991214B1 (fr) 2012-06-01 2014-06-13 Snecma Procede de percage d'une piece par impulsions laser
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
JP6022223B2 (ja) 2012-06-14 2016-11-09 株式会社ディスコ レーザー加工装置
JP5991860B2 (ja) 2012-06-19 2016-09-14 三星ダイヤモンド工業株式会社 ガラス基板の加工方法
US20130344684A1 (en) 2012-06-20 2013-12-26 Stuart Bowden Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material
JP6065910B2 (ja) 2012-07-09 2017-01-25 旭硝子株式会社 化学強化ガラス板の切断方法
US9462632B2 (en) 2012-07-17 2016-10-04 Qualcomm Incorporated Concurrent data streaming using various parameters from the same sensor
AT13206U1 (de) 2012-07-17 2013-08-15 Lisec Maschb Gmbh Verfahren und Anordnung zum Teilen von Flachglas
TW201417928A (zh) 2012-07-30 2014-05-16 Raydiance Inc 具訂製邊形及粗糙度之脆性材料切割
US8842358B2 (en) 2012-08-01 2014-09-23 Gentex Corporation Apparatus, method, and process with laser induced channel edge
KR101395054B1 (ko) 2012-08-08 2014-05-14 삼성코닝정밀소재 주식회사 강화유리 커팅 방법 및 강화유리 커팅용 스테이지
KR20140022980A (ko) 2012-08-14 2014-02-26 (주)하드램 강화유리 레이저 절단 장치 및 방법
KR20140022981A (ko) 2012-08-14 2014-02-26 (주)하드램 기판 에지 보호유닛을 포함한 강화유리 레이저 절단 장치 및 방법
WO2014028022A1 (en) 2012-08-16 2014-02-20 Hewlett-Packard Development Company, L.P. Diagonal openings in photodefinable glass
US20140047957A1 (en) 2012-08-17 2014-02-20 Jih Chun Wu Robust Torque-Indicating Wrench
JP5727433B2 (ja) 2012-09-04 2015-06-03 イムラ アメリカ インコーポレイテッド 超短パルスレーザでの透明材料処理
KR20140036593A (ko) 2012-09-17 2014-03-26 삼성디스플레이 주식회사 레이저 가공 장치
CN102923939B (zh) 2012-09-17 2015-03-25 江西沃格光电股份有限公司 强化玻璃的切割方法
US20140084040A1 (en) 2012-09-24 2014-03-27 Electro Scientific Industries, Inc. Method and apparatus for separating workpieces
CN102898014A (zh) 2012-09-29 2013-01-30 江苏太平洋石英股份有限公司 无接触激光切割石英玻璃制品的方法及其装置
US9227886B2 (en) 2012-10-12 2016-01-05 Exxonmobil Chemical Patents Inc. Polymerization process
CN102916081B (zh) 2012-10-19 2015-07-08 张立国 一种薄膜太阳能电池的清边方法
LT6046B (lt) 2012-10-22 2014-06-25 Uab "Lidaris" Justiruojamų optinių laikiklių pakeitimo įrenginys ir sistema, turinti tokių įrenginių
US20140110040A1 (en) 2012-10-23 2014-04-24 Ronald Steven Cok Imprinted micro-louver structure method
DE102012110971B4 (de) 2012-11-14 2025-03-20 Schott Ag Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks
US9991090B2 (en) 2012-11-15 2018-06-05 Fei Company Dual laser beam system used with an electron microscope and FIB
KR20140064220A (ko) 2012-11-20 2014-05-28 에스케이씨 주식회사 보안필름의 제조방법
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9341015B2 (en) 2012-11-21 2016-05-17 Nexeon Energy Solutions LLC Energy-efficient film
CN102962583A (zh) 2012-11-28 2013-03-13 江苏大学 一种基于激光加热的塑料件微结构成形方法和装置
JP6333282B2 (ja) 2012-11-29 2018-05-30 コーニング インコーポレイテッド レーザー損傷及びエッチングによってガラス物品を製造する方法
WO2014085660A1 (en) 2012-11-29 2014-06-05 Corning Incorporated Sacrificial cover layers for laser drilling substrates and methods thereof
RU2539970C2 (ru) 2012-12-17 2015-01-27 Общество с ограниченной ответственностью "РнД-ИСАН" Источник света с лазерной накачкой и способ генерации излучения
CN203021443U (zh) 2012-12-24 2013-06-26 深圳大宇精雕科技有限公司 玻璃板水射流切割机
EP2750447A1 (en) 2012-12-28 2014-07-02 Alcatel Lucent Neighboring cell selection for an user equipment using a content delivery service in a mobile network
CN103013374B (zh) 2012-12-28 2014-03-26 吉林大学 仿生防粘疏水疏油贴膜
SG11201505070VA (en) 2012-12-29 2015-08-28 Hoya Corp Glass substrate for magnetic disk and magnetic disk
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
JP2016513016A (ja) 2013-02-04 2016-05-12 ニューポート コーポレーション 透明及び半透明な基板をレーザ切断する方法及び装置
US10670510B2 (en) 2013-02-05 2020-06-02 Massachusetts Institute Of Technology 3-D holographic imaging continuous flow cytometry
US9498920B2 (en) 2013-02-12 2016-11-22 Carbon3D, Inc. Method and apparatus for three-dimensional fabrication
JP2014156289A (ja) 2013-02-14 2014-08-28 Mitsubishi Electric Building Techno Service Co Ltd エレベータの主ロープ点検方法
US9919380B2 (en) 2013-02-23 2018-03-20 Coherent, Inc. Shaping of brittle materials with controlled surface and bulk properties
DE102013003118B4 (de) 2013-02-25 2015-03-26 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Entsorgen von einem bei einem Lochungsvorgang eines Hohlprofils enstehenden Butzens
CN105339316B (zh) 2013-02-25 2018-11-09 康宁股份有限公司 制造薄玻璃块的方法
CN103143841B (zh) 2013-03-08 2014-11-26 西北工业大学 一种利用皮秒激光加工孔的方法
CN105164581B (zh) 2013-03-08 2020-05-01 Sage电致变色显示有限公司 具有多个独立可控区域和内部母线的电致变色器件
US10179952B2 (en) 2013-03-08 2019-01-15 Rutgers, The State University Of New Jersey Patterned thin films by thermally induced mass displacement
KR102209964B1 (ko) 2013-03-13 2021-02-02 삼성디스플레이 주식회사 피코초 레이저 가공 장치
EP2969375B1 (en) 2013-03-15 2018-09-12 Kinestral Technologies, Inc. Laser cutting strengthened glass
JP6061193B2 (ja) 2013-03-18 2017-01-18 大日本印刷株式会社 ブランクのストリッパ機構
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
WO2014156289A1 (ja) 2013-03-27 2014-10-02 住友精化株式会社 吸水性樹脂組成物の製造方法
JP6059059B2 (ja) 2013-03-28 2017-01-11 浜松ホトニクス株式会社 レーザ加工方法
WO2014161534A2 (de) 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Verfahren und vorrichtung zum einbringen von durchbrechungen in ein substrat sowie ein derart hergestelltes substrat
DE102013103370A1 (de) 2013-04-04 2014-10-09 Lpkf Laser & Electronics Ag Verfahren zum Einbringen von Durchbrechungen in ein Glassubstrat sowie ein derart hergestelltes Glassubstrat
ES2959429T3 (es) 2013-04-04 2024-02-26 Lpkf Laser & Electronics Se Procedimiento para la separación de un sustrato
ES2685656T3 (es) 2013-04-10 2018-10-10 Saint-Gobain Glass France Película de múltiples capas con propiedades ópticas conmutables mediante la electricidad
CN104108870A (zh) 2013-04-16 2014-10-22 安徽华强玻璃科技有限公司 一种玻璃切割刀清洗装置
CN103224117B (zh) 2013-05-10 2016-02-03 深圳市华星光电技术有限公司 一种自动反馈调节碎玻璃传送张力的系统
CN103316990B (zh) 2013-05-28 2015-06-10 江苏大学 脉冲激光驱动飞片加载薄板的微冲裁自动化装置及其方法
CN103273195B (zh) 2013-05-28 2015-03-04 江苏大学 激光间接冲击下金属薄板的微冲裁自动化装置及其方法
US9365413B2 (en) 2013-05-29 2016-06-14 Freescale Semiconductor, Inc. Transducer-including devices, and methods and apparatus for their calibration
HK1220774A1 (zh) 2013-06-18 2017-05-12 View, Inc. 非矩形形状上的电致变色设备
US9776891B2 (en) 2013-06-26 2017-10-03 Corning Incorporated Filter and methods for heavy metal remediation of water
KR101344368B1 (ko) 2013-07-08 2013-12-24 정우라이팅 주식회사 수직형 유리관 레이저 절단장치
CN103359948A (zh) 2013-07-12 2013-10-23 深圳南玻伟光导电膜有限公司 钢化玻璃的切割方法
KR20150009153A (ko) 2013-07-16 2015-01-26 동우 화인켐 주식회사 강화처리된 유리의 홀 형성 방법
US9102011B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
US9102007B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
US9790128B2 (en) 2013-08-07 2017-10-17 Corning Incorporated Laser controlled ion exchange process and glass articles formed therefrom
US9296646B2 (en) 2013-08-29 2016-03-29 Corning Incorporated Methods for forming vias in glass substrates
TWI618131B (zh) 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
BR112016001216B1 (pt) 2013-09-04 2021-11-16 Saint-Gobain Glass France Método para produzir uma vidraça com um revestimento eletricamente condutor com defeitos eletricamente isolados, vidraça com um revestimento eletricamente condutor e uso de uma vidraça
CN203509350U (zh) 2013-09-27 2014-04-02 东莞市盛雄激光设备有限公司 皮秒激光加工装置
CN103531414B (zh) 2013-10-14 2016-03-02 南京三乐电子信息产业集团有限公司 一种栅控行波管栅网的皮秒脉冲激光切割制备方法
US10017410B2 (en) 2013-10-25 2018-07-10 Rofin-Sinar Technologies Llc Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses
US20150121960A1 (en) 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
US20150122656A1 (en) 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Mass based filtration devices and method of fabrication using bursts of ultrafast laser pulses
US11053156B2 (en) 2013-11-19 2021-07-06 Rofin-Sinar Technologies Llc Method of closed form release for brittle materials using burst ultrafast laser pulses
US9517929B2 (en) 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10005152B2 (en) 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
DE102013223637B4 (de) 2013-11-20 2018-02-01 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats
JP2017501951A (ja) 2013-11-25 2017-01-19 コーニング インコーポレイテッド 実質的に柱面を成す鏡面反射面の形状を決定するための方法
CN103612010A (zh) * 2013-11-26 2014-03-05 中电电气（扬州）光伏有限公司 太阳能电池激光开孔波形
CN105722925B (zh) * 2013-11-29 2018-02-16 松下知识产权经营株式会社 涂料组合物及使用了该涂料组合物的光扩散部件
US10144088B2 (en) * 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
CN103746027B (zh) 2013-12-11 2015-12-09 西安交通大学 一种在ito导电薄膜表面刻蚀极细电隔离槽的方法
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
EP3083514B1 (en) 2013-12-17 2019-03-06 Corning Incorporated 3-d forming of glass and associated product
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
CA2931984A1 (en) 2013-12-17 2015-06-25 Bayer Cropscience Lp Mixing systems, methods, and devices with extendible impellers
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150166393A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser cutting of ion-exchangeable glass substrates
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165563A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
CN103831539B (zh) 2014-01-10 2016-01-20 合肥鑫晟光电科技有限公司 激光打孔方法及激光打孔系统
JP6390961B2 (ja) 2014-01-28 2018-09-19 株式会社リコー 書込ヘッドユニットの組立装置および書込ヘッドユニットの組立方法
DE102014201739B4 (de) 2014-01-31 2021-08-12 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitungsvorrichtung sowie Verfahren zum Erzeugen zweier Teilstrahlen
WO2015127583A1 (en) 2014-02-25 2015-09-03 Schott Ag Chemically toughened glass article with low coefficient of thermal expansion
EP2913137A1 (de) 2014-02-26 2015-09-02 Bystronic Laser AG Laserbearbeitungsvorrichtung und Verfahren
MX388829B (es) 2014-03-04 2025-03-20 Saint Gobain Metodo para cortar una capa de vidrio laminada, ultradelgada.
US11780029B2 (en) 2014-03-05 2023-10-10 Panasonic Connect North America, division of Panasonic Corporation of North America Material processing utilizing a laser having a variable beam shape
US11204506B2 (en) 2014-03-05 2021-12-21 TeraDiode, Inc. Polarization-adjusted and shape-adjusted beam operation for materials processing
US20150352671A1 (en) 2014-06-09 2015-12-10 GM Global Technology Operations LLC Laser cutting same side slug removal
CN106662788A (zh) 2014-06-17 2017-05-10 Sage电致变色显示有限公司 防潮电致变色装置
WO2015195716A1 (en) 2014-06-17 2015-12-23 Sage Electrochromics, Inc. Controlled switching for electrochromic devices
JP6651467B2 (ja) 2014-06-17 2020-02-19 セイジ・エレクトロクロミクス，インコーポレイテッド エレクトロクロミックデバイスの被制御スイッチング
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
EP2965853B2 (en) 2014-07-09 2020-03-25 High Q Laser GmbH Processing of material using elongated laser beams
EP3169477B1 (en) 2014-07-14 2020-01-29 Corning Incorporated System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
US20160009066A1 (en) 2014-07-14 2016-01-14 Corning Incorporated System and method for cutting laminated structures
DE102014213775B4 (de) 2014-07-15 2018-02-15 Innolas Solutions Gmbh Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten
US9757815B2 (en) 2014-07-21 2017-09-12 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser curved filamentation within transparent materials
DE102014110920C5 (de) 2014-07-31 2023-08-03 Schott Ag Geformter Glasartikel mit vorbestimmter Geometrie
CN104344202A (zh) 2014-09-26 2015-02-11 张玉芬 一种有孔玻璃
CN204211638U (zh) 2014-09-29 2015-03-18 江西省平波电子有限公司 一种带有喷水管的玻璃基板切割机
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
EP3221727B1 (de) 2014-11-19 2021-03-17 Trumpf Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
US9740063B2 (en) 2014-11-28 2017-08-22 Japan Display Inc. Reflective type liquid crystal display device
US9873628B1 (en) 2014-12-02 2018-01-23 Coherent Kaiserslautern GmbH Filamentary cutting of brittle materials using a picosecond pulsed laser
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
WO2016100954A1 (en) 2014-12-19 2016-06-23 Captl Llc Flow cytometry using hydrodynamically planar flow
JP6005125B2 (ja) 2014-12-22 2016-10-12 イムラ アメリカ インコーポレイテッド 超短パルスレーザでの透明材料処理
FR3031102B1 (fr) 2014-12-31 2017-01-27 Saint Gobain Procede de rompage d'une forme interieure dans une feuille de verre
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
US9477037B1 (en) 2015-04-22 2016-10-25 Corning Incorporated Optical fiber for silicon photonics
KR20170006900A (ko) 2015-07-10 2017-01-18 삼성전자주식회사 성형장치 및 이를 이용한 성형방법
DE102015111490A1 (de) 2015-07-15 2017-01-19 Schott Ag Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
CN106604898B (zh) 2015-08-10 2021-06-04 法国圣戈班玻璃厂 用于切割薄玻璃层的方法
CN105081564B (zh) 2015-08-31 2017-03-29 大族激光科技产业集团股份有限公司 一种强化玻璃内形孔的加工方法
CN107922259B (zh) 2015-09-04 2021-05-07 Ａｇｃ株式会社 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置
JP6066384B2 (ja) 2015-10-23 2017-01-25 大日本印刷株式会社 投射装置および投射型映像表示装置
KR20180075707A (ko) 2015-11-25 2018-07-04 코닝 인코포레이티드 유리 웹의 분리 방법들
DE102015120950B4 (de) 2015-12-02 2022-03-03 Schott Ag Verfahren zum lasergestützten Ablösen eines Teilstücks von einem flächigen Glas- oder Glaskeramikelement, flächiges zumindest teilweise keramisiertes Glaselement oder Glaskeramikelement und Kochfläche umfassend ein flächiges Glas- oder Glaskeramikelement
CN205328860U (zh) 2015-12-07 2016-06-22 临泉县强钢钢化玻璃有限公司 一种新型玻璃切割渣清理机构
US20170197868A1 (en) 2016-01-08 2017-07-13 Apple Inc. Laser Processing of Electronic Device Structures
DE102016102768A1 (de) 2016-02-17 2017-08-17 Schott Ag Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement
CN106007349A (zh) 2016-06-27 2016-10-12 浙江飞越洁具制造有限公司 一种自动化玻璃加工装置
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
EP3507057A1 (en) 2016-08-30 2019-07-10 Corning Incorporated Laser processing of transparent materials
CN113399816B (zh) 2016-09-30 2023-05-16 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
LT3311947T (lt) 2016-09-30 2019-12-27 Corning Incorporated Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas
NL2017998B1 (en) 2016-12-14 2018-06-26 Corning Inc Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
US20180118602A1 (en) 2016-11-01 2018-05-03 Corning Incorporated Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates
US10668561B2 (en) 2016-11-15 2020-06-02 Coherent, Inc. Laser apparatus for cutting brittle material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000225485A (ja) * 1999-02-04 2000-08-15 Fine Machining Kk レーザ加工装置のステージ
US20070111480A1 (en) 2005-11-16 2007-05-17 Denso Corporation Wafer product and processing method therefor
US20130189806A1 (en) 2012-01-24 2013-07-25 Disco Corporation Processing method for wafer
JP2014104484A (ja) 2012-11-27 2014-06-09 Disco Abrasive Syst Ltd レーザー加工装置
JP2014117707A (ja) * 2012-12-13 2014-06-30 Disco Abrasive Syst Ltd レーザ加工方法

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