DE112008001873A5 - Optische Anordnung zur Erzeugung von Multistrahlen - Google Patents

Optische Anordnung zur Erzeugung von Multistrahlen Download PDF

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Publication number
DE112008001873A5
DE112008001873A5 DE112008001873T DE112008001873T DE112008001873A5 DE 112008001873 A5 DE112008001873 A5 DE 112008001873A5 DE 112008001873 T DE112008001873 T DE 112008001873T DE 112008001873 T DE112008001873 T DE 112008001873T DE 112008001873 A5 DE112008001873 A5 DE 112008001873A5
Authority
DE
Germany
Prior art keywords
beams
optical arrangement
generating multi
generating
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112008001873T
Other languages
English (en)
Inventor
Keming Du
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE112008001873A5 publication Critical patent/DE112008001873A5/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0972—Prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0977—Reflective elements
DE112008001873T 2007-07-21 2008-07-15 Optische Anordnung zur Erzeugung von Multistrahlen Withdrawn DE112008001873A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007034554.4 2007-07-21
DE102007034554 2007-07-21
PCT/EP2008/005769 WO2009012913A1 (de) 2007-07-21 2008-07-15 Optische anordnung zur erzeugung von multistrahlen

Publications (1)

Publication Number Publication Date
DE112008001873A5 true DE112008001873A5 (de) 2010-06-10

Family

ID=39967936

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112008001873T Withdrawn DE112008001873A5 (de) 2007-07-21 2008-07-15 Optische Anordnung zur Erzeugung von Multistrahlen

Country Status (3)

Country Link
CN (1) CN101772721A (de)
DE (1) DE112008001873A5 (de)
WO (1) WO2009012913A1 (de)

Cited By (1)

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CN104625423A (zh) * 2015-01-21 2015-05-20 深圳市创鑫激光股份有限公司 一种激光打标控制方法、激光打标头以及激光打标机

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CN101923219B (zh) * 2010-03-05 2012-02-01 东莞宏威数码机械有限公司 四分等比例分光装置及具有该装置的激光刻线机
CN102248805B (zh) * 2010-05-21 2015-05-27 深圳泰德激光科技有限公司 激光打标装置及打标分光方法
CN102375171B (zh) * 2011-11-09 2013-10-02 中国科学院物理研究所 一种衍射光学元件及其设计方法和在太阳能电池中的应用
CN102500922A (zh) * 2011-11-15 2012-06-20 华南师范大学 一种用于轻质合金熔接的方法与多光路系统
DE102012007601A1 (de) 2012-04-16 2013-10-17 Innovavent Gmbh Optisches System für eine Anlage zur Bearbeitung von Dünnfilmschichten
DE102012219387B4 (de) * 2012-10-24 2022-03-24 Coretronic Corporation Beleuchtungsvorrichtung mit Pumplichtquelle und Leuchtstoffanordnung und Verfahren zum Betreiben einer solchen Beleuchtungsvorrichtung
CN203069871U (zh) * 2012-11-13 2013-07-17 深圳市华星光电技术有限公司 聚光装置及修补机
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10451553B2 (en) * 2014-04-03 2019-10-22 Hitachi High-Technologies Corporation Fluorescence spectrometer
CN103944059B (zh) * 2014-05-09 2017-02-15 西安炬光科技有限公司 一种高功率半导体激光器扩束系统
CN103941406B (zh) * 2014-05-09 2017-01-25 西安炬光科技有限公司 一种基于扩束的高功率半导体激光器光学整形方法及其装置
WO2016007572A1 (en) 2014-07-08 2016-01-14 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016010954A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
CN104158067B (zh) * 2014-08-22 2016-06-22 苏州大学 一种导线外皮的激光剥离方法
CN104475971B (zh) * 2014-11-04 2016-06-22 龚传波 一种分束激光多工位分时切割机及加工方法
EP3848334A1 (de) 2015-03-24 2021-07-14 Corning Incorporated Erdalkali-boroaluminosilikatglasartikel mit lasergeschnittener kante
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
CN105005149A (zh) * 2015-08-10 2015-10-28 武汉华工激光工程有限责任公司 一种对线偏振激光分光且分别进行控制打标的装置
JP6817716B2 (ja) * 2015-09-03 2021-01-20 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
EP3597353A1 (de) 2016-09-30 2020-01-22 Corning Incorporated Vorrichtungen zur laserbearbeitung von transparenten werkstücken mittels nichtachsensymmetrischen strahlflecken
EP3848333A1 (de) 2016-10-24 2021-07-14 Corning Incorporated Substratverarbeitungsstation zur laserbasierten verarbeitung von flächigen glassubstraten
CN107571153B (zh) * 2017-08-28 2019-04-02 四川荷斐斯科技发展有限公司 一种便携式激光打磨机
CN107855642A (zh) * 2017-12-07 2018-03-30 英诺激光科技股份有限公司 一种分光装置
DE102018103131B4 (de) * 2018-02-13 2020-07-09 Innovavent Gmbh Vorrichtung zum Erzeugen einer Beleuchtungslinie, optisches System und Verfahren zum Verarbeiten mindestens eines eintreffenden Laserstrahls
DE102019004853A1 (de) * 2019-07-14 2021-01-28 Keming Du Anordnung von Multi-Polygonen zur effektiven Nutzung von Laserleistung
DE102020007923B3 (de) 2020-12-31 2022-05-05 Keming Du Optische Anordnungen zur Erzeugung von Multistrahlen
CN114700628A (zh) * 2022-06-06 2022-07-05 一道新能源科技(衢州)有限公司 一种聚焦激光双折射perc电池片开槽装置
CN115609162B (zh) * 2022-12-19 2023-03-07 扬州艾镭激光设备有限公司 一种自动调高式激光打标机

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EP0201306A3 (de) * 1985-05-08 1989-06-28 Lambda Photometrics Limited Gerät zur Herstellung einer gleichmässigen Beleuchtung auf einer Beleuchtungsstation
WO1995018984A1 (en) * 1994-01-07 1995-07-13 Coherent, Inc. Apparatus for creating a square or rectangular laser beam with a uniform intensity profile
FR2794675B1 (fr) * 1999-06-11 2001-08-31 Brodart Microperforation laser de films thermoplastiques ou cellulosiques par fibres optiques
US6400508B1 (en) * 1999-11-01 2002-06-04 Zhimin Liu Compact wavelength interleaver
GB0019454D0 (en) * 2000-08-09 2000-09-27 Stevens Brian T Laser system
KR100403599B1 (ko) * 2001-11-06 2003-10-30 삼성전자주식회사 조명계 및 이를 채용한 프로젝션 시스템
US20060256335A1 (en) * 2005-05-13 2006-11-16 Becton, Dickinson And Company Optical beam-shaper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104625423A (zh) * 2015-01-21 2015-05-20 深圳市创鑫激光股份有限公司 一种激光打标控制方法、激光打标头以及激光打标机

Also Published As

Publication number Publication date
CN101772721A (zh) 2010-07-07
WO2009012913A4 (de) 2009-04-02
WO2009012913A1 (de) 2009-01-29

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Legal Events

Date Code Title Description
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: G02B0027090000

Ipc: G02B0027100000

8110 Request for examination paragraph 44
R120 Application withdrawn or ip right abandoned
R120 Application withdrawn or ip right abandoned

Effective date: 20130104