ATE520495T1 - Verfahren und vorrichtung zur bildung von rissen - Google Patents
Verfahren und vorrichtung zur bildung von rissenInfo
- Publication number
- ATE520495T1 ATE520495T1 AT05805249T AT05805249T ATE520495T1 AT E520495 T1 ATE520495 T1 AT E520495T1 AT 05805249 T AT05805249 T AT 05805249T AT 05805249 T AT05805249 T AT 05805249T AT E520495 T1 ATE520495 T1 AT E520495T1
- Authority
- AT
- Austria
- Prior art keywords
- crack
- line
- beam spot
- presumed
- spot
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/16—Transversely of continuously fed work
- Y10T225/18—Progressively to or from one side edge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/304—Including means to apply thermal shock to work
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004309958 | 2004-10-25 | ||
PCT/JP2005/019533 WO2006046525A1 (ja) | 2004-10-25 | 2005-10-25 | クラック形成方法およびクラック形成装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE520495T1 true ATE520495T1 (de) | 2011-09-15 |
Family
ID=36227765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05805249T ATE520495T1 (de) | 2004-10-25 | 2005-10-25 | Verfahren und vorrichtung zur bildung von rissen |
Country Status (9)
Country | Link |
---|---|
US (1) | US7726532B2 (de) |
EP (1) | EP1806202B1 (de) |
JP (1) | JP4722054B2 (de) |
KR (1) | KR100821937B1 (de) |
CN (1) | CN100475419C (de) |
AT (1) | ATE520495T1 (de) |
MX (1) | MX2007005018A (de) |
TW (1) | TW200621661A (de) |
WO (1) | WO2006046525A1 (de) |
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KR100631304B1 (ko) | 1999-12-24 | 2006-10-04 | 삼성전자주식회사 | 레이저 빔을 이용한 유리기판 절단 장치 및 그 방법 |
DE19963939B4 (de) * | 1999-12-31 | 2004-11-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
JP3802442B2 (ja) * | 2000-12-01 | 2006-07-26 | エルジー電子株式会社 | ガラス切断方法および装置 |
TW583046B (en) * | 2001-08-10 | 2004-04-11 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing brittle material substrate |
JP2005231035A (ja) * | 2001-08-23 | 2005-09-02 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料の加工方法及び加工装置 |
KR100794284B1 (ko) * | 2001-09-29 | 2008-01-11 | 삼성전자주식회사 | 비금속 기판 절단 방법 |
TWI277612B (en) * | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
-
2005
- 2005-10-25 AT AT05805249T patent/ATE520495T1/de not_active IP Right Cessation
- 2005-10-25 JP JP2006543142A patent/JP4722054B2/ja not_active Expired - Fee Related
- 2005-10-25 WO PCT/JP2005/019533 patent/WO2006046525A1/ja active Application Filing
- 2005-10-25 CN CNB2005800365599A patent/CN100475419C/zh not_active Expired - Fee Related
- 2005-10-25 TW TW094137226A patent/TW200621661A/zh not_active IP Right Cessation
- 2005-10-25 KR KR1020077008844A patent/KR100821937B1/ko not_active IP Right Cessation
- 2005-10-25 EP EP20050805249 patent/EP1806202B1/de not_active Not-in-force
- 2005-10-25 US US11/575,589 patent/US7726532B2/en not_active Expired - Fee Related
- 2005-10-25 MX MX2007005018A patent/MX2007005018A/es active IP Right Grant
Also Published As
Publication number | Publication date |
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TW200621661A (en) | 2006-07-01 |
JP4722054B2 (ja) | 2011-07-13 |
KR20070051945A (ko) | 2007-05-18 |
EP1806202B1 (de) | 2011-08-17 |
US7726532B2 (en) | 2010-06-01 |
WO2006046525A1 (ja) | 2006-05-04 |
KR100821937B1 (ko) | 2008-04-15 |
TWI358395B (de) | 2012-02-21 |
US20070228100A1 (en) | 2007-10-04 |
CN101048255A (zh) | 2007-10-03 |
EP1806202A1 (de) | 2007-07-11 |
JPWO2006046525A1 (ja) | 2008-05-22 |
CN100475419C (zh) | 2009-04-08 |
EP1806202A4 (de) | 2009-05-06 |
MX2007005018A (es) | 2008-02-19 |
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