KR100328899B1 - 반도체 장치 및 그 제조 방법과, 다이본딩재 - Google Patents

반도체 장치 및 그 제조 방법과, 다이본딩재 Download PDF

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Publication number
KR100328899B1
KR100328899B1 KR1020007010502A KR20007010502A KR100328899B1 KR 100328899 B1 KR100328899 B1 KR 100328899B1 KR 1020007010502 A KR1020007010502 A KR 1020007010502A KR 20007010502 A KR20007010502 A KR 20007010502A KR 100328899 B1 KR100328899 B1 KR 100328899B1
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KR
South Korea
Prior art keywords
bonding material
support member
die
die bonding
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020007010502A
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English (en)
Korean (ko)
Inventor
다께다신지
마스꼬다까시
유사마사미
기꾸찌도오루
미야데라야스오
마에까와이와오
야마사끼미쯔오
가게야마아끼라
가네다아이조우
Original Assignee
이사오 우치가사키
히다치 가세고교 가부시끼가이샤
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15917998&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100328899(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 이사오 우치가사키, 히다치 가세고교 가부시끼가이샤 filed Critical 이사오 우치가사키
Application granted granted Critical
Publication of KR100328899B1 publication Critical patent/KR100328899B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W72/013—
    • H10W72/071—
    • H10W70/417—
    • H10W72/0113—
    • H10W95/00—
    • H10W72/0198—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/075—
    • H10W72/354—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer

Landscapes

  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020007010502A 1995-07-06 1996-07-08 반도체 장치 및 그 제조 방법과, 다이본딩재 Expired - Fee Related KR100328899B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1995-171154 1995-07-06
JP17115495 1995-07-06
PCT/JP1996/001886 WO1997002595A1 (en) 1995-07-06 1996-07-08 Semiconductor device and its manufacture

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1019970709581A Division KR100328898B1 (ko) 1995-07-06 1996-07-08 반도체장치및그제조방법과,다이본딩재

Publications (1)

Publication Number Publication Date
KR100328899B1 true KR100328899B1 (ko) 2002-03-15

Family

ID=15917998

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020007010502A Expired - Fee Related KR100328899B1 (ko) 1995-07-06 1996-07-08 반도체 장치 및 그 제조 방법과, 다이본딩재
KR1020017008990A Expired - Fee Related KR100366009B1 (ko) 1995-07-06 1996-07-08 반도체 장치 및 그 제조 방법과, 다이본딩재
KR1019970709581A Expired - Lifetime KR100328898B1 (ko) 1995-07-06 1996-07-08 반도체장치및그제조방법과,다이본딩재

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020017008990A Expired - Fee Related KR100366009B1 (ko) 1995-07-06 1996-07-08 반도체 장치 및 그 제조 방법과, 다이본딩재
KR1019970709581A Expired - Lifetime KR100328898B1 (ko) 1995-07-06 1996-07-08 반도체장치및그제조방법과,다이본딩재

Country Status (8)

Country Link
US (5) US6855579B2 (enExample)
EP (4) EP1032036A3 (enExample)
JP (2) JP3117972B2 (enExample)
KR (3) KR100328899B1 (enExample)
AU (1) AU6319596A (enExample)
MY (5) MY135104A (enExample)
TW (1) TW310481B (enExample)
WO (1) WO1997002595A1 (enExample)

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JP5123633B2 (ja) * 2007-10-10 2013-01-23 ルネサスエレクトロニクス株式会社 半導体装置および接続材料
JP5458538B2 (ja) * 2007-12-12 2014-04-02 日立化成株式会社 半導体装置及びその製造方法
JP4644718B2 (ja) * 2008-01-31 2011-03-02 株式会社日立製作所 金属／樹脂接着構造体及び樹脂封止型半導体装置とその製造方法
JP2008113047A (ja) * 2008-02-04 2008-05-15 Hitachi Chem Co Ltd ダイボンディング材及び半導体装置
JP5302595B2 (ja) * 2008-08-06 2013-10-02 株式会社日立ハイテクノロジーズ 傾斜観察方法および観察装置
KR20110055683A (ko) * 2008-09-22 2011-05-25 히다치 가세고교 가부시끼가이샤 반도체장치 및 그 제조방법
JP5534682B2 (ja) * 2009-02-06 2014-07-02 積水化学工業株式会社 電子部品用熱硬化性接着剤及びこの接着剤を用いた電子部品内蔵基板の製造方法
MY171200A (en) 2012-04-26 2019-10-01 Furukawa Electric Co Ltd Film adhesive composition, method for producing the same, film adhesive, semiconductor package using the film adhesive, and method for manufacturing the semiconductor package
JP6468698B2 (ja) * 2013-09-26 2019-02-13 デクセリアルズ株式会社 太陽電池モジュール及びその製造方法
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
WO2021019697A1 (ja) 2019-07-30 2021-02-04 昭和電工マテリアルズ株式会社 電子部品装置を製造する方法、及び電子部品装置
TWI822970B (zh) 2019-03-06 2023-11-21 日商力森諾科股份有限公司 電子零件裝置的製造方法

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US20040253770A1 (en) 2004-12-16
US20030160337A1 (en) 2003-08-28
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EP0837498A1 (en) 1998-04-22
JP2000200793A (ja) 2000-07-18
US20080290529A1 (en) 2008-11-27
AU6319596A (en) 1997-02-05
US7078094B2 (en) 2006-07-18
TW310481B (enExample) 1997-07-11
WO1997002595A1 (en) 1997-01-23
US7057265B2 (en) 2006-06-06
US6855579B2 (en) 2005-02-15
MY135220A (en) 2008-02-29
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MY135107A (en) 2008-02-29
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EP1032036A3 (en) 2000-11-22
KR19990028267A (ko) 1999-04-15
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US20010016384A1 (en) 2001-08-23
EP1032036A2 (en) 2000-08-30
US20060180903A1 (en) 2006-08-17
EP1308996A2 (en) 2003-05-07
US7781896B2 (en) 2010-08-24
JP3117972B2 (ja) 2000-12-18
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MY135104A (en) 2008-02-29
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US7387914B2 (en) 2008-06-17
KR100366009B1 (ko) 2002-12-31

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