JPS5412266A - Compression bonding device of metal foils and pieces - Google Patents

Compression bonding device of metal foils and pieces

Info

Publication number
JPS5412266A
JPS5412266A JP7740877A JP7740877A JPS5412266A JP S5412266 A JPS5412266 A JP S5412266A JP 7740877 A JP7740877 A JP 7740877A JP 7740877 A JP7740877 A JP 7740877A JP S5412266 A JPS5412266 A JP S5412266A
Authority
JP
Japan
Prior art keywords
rod
pieces
metal foils
bonding device
compression bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7740877A
Other languages
Japanese (ja)
Inventor
Masahiro Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7740877A priority Critical patent/JPS5412266A/en
Publication of JPS5412266A publication Critical patent/JPS5412266A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To perfect thermocompression bonding by beforehand providing a vertically movable rod within a suction pipe, sucking a metal foil or piece with the rod being held raised, positioning the foil or piece on a lead frame, pushing down the rod and pressing the same together with a pipe to thermocompression-bond the foil or pice thereafter pulling up the pipe and rod in this order.
COPYRIGHT: (C)1979,JPO&Japio
JP7740877A 1977-06-28 1977-06-28 Compression bonding device of metal foils and pieces Pending JPS5412266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7740877A JPS5412266A (en) 1977-06-28 1977-06-28 Compression bonding device of metal foils and pieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7740877A JPS5412266A (en) 1977-06-28 1977-06-28 Compression bonding device of metal foils and pieces

Publications (1)

Publication Number Publication Date
JPS5412266A true JPS5412266A (en) 1979-01-29

Family

ID=13633079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7740877A Pending JPS5412266A (en) 1977-06-28 1977-06-28 Compression bonding device of metal foils and pieces

Country Status (1)

Country Link
JP (1) JPS5412266A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927505A (en) * 1982-08-09 1984-02-14 Hitachi Maxell Ltd Ferromagnetic metal powder
JPS62193690A (en) * 1986-02-14 1987-08-25 フ−ベルト・アイリツヒ Method and apparatus for treating residue of power plant
WO1996029730A1 (en) * 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
EP1076360A3 (en) * 1999-08-09 2005-02-02 Sony Chemicals Corporation Process for mounting semiconductor device and mounting apparatus
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929622U (en) * 1972-06-15 1974-03-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929622U (en) * 1972-06-15 1974-03-14

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927505A (en) * 1982-08-09 1984-02-14 Hitachi Maxell Ltd Ferromagnetic metal powder
JPS62193690A (en) * 1986-02-14 1987-08-25 フ−ベルト・アイリツヒ Method and apparatus for treating residue of power plant
KR100426298B1 (en) * 1994-12-26 2004-04-08 히다치 가세고교 가부시끼가이샤 Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
WO1996029730A1 (en) * 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US6825249B1 (en) 1994-12-26 2004-11-30 Hitachi Chemical Co., Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7057265B2 (en) 1995-07-06 2006-06-06 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7078094B2 (en) 1995-07-06 2006-07-18 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
EP1076360A3 (en) * 1999-08-09 2005-02-02 Sony Chemicals Corporation Process for mounting semiconductor device and mounting apparatus

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