JP6496248B2 - フラット基板のレーザベースの機械加工方法および装置 - Google Patents
フラット基板のレーザベースの機械加工方法および装置 Download PDFInfo
- Publication number
- JP6496248B2 JP6496248B2 JP2015553060A JP2015553060A JP6496248B2 JP 6496248 B2 JP6496248 B2 JP 6496248B2 JP 2015553060 A JP2015553060 A JP 2015553060A JP 2015553060 A JP2015553060 A JP 2015553060A JP 6496248 B2 JP6496248 B2 JP 6496248B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- laser
- laser beam
- focal line
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- HDFWVJAQABCYDP-UHFFFAOYSA-N CC(C)C1=CCCC1 Chemical compound CC(C)C1=CCCC1 HDFWVJAQABCYDP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24471—Crackled, crazed or slit
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361752489P | 2013-01-15 | 2013-01-15 | |
| EP13151296.4 | 2013-01-15 | ||
| US61/752,489 | 2013-01-15 | ||
| EP13151296.4A EP2754524B1 (de) | 2013-01-15 | 2013-01-15 | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| PCT/EP2014/050610 WO2014111385A1 (de) | 2013-01-15 | 2014-01-14 | Verfahren und vorrichtung zum laserbasierten bearbeiten von flächigen substraten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016513024A JP2016513024A (ja) | 2016-05-12 |
| JP6496248B2 true JP6496248B2 (ja) | 2019-04-03 |
Family
ID=47683528
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015553060A Active JP6496248B2 (ja) | 2013-01-15 | 2014-01-14 | フラット基板のレーザベースの機械加工方法および装置 |
| JP2015553188A Active JP6422033B2 (ja) | 2013-01-15 | 2014-01-14 | レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置 |
| JP2018188881A Pending JP2019034343A (ja) | 2013-01-15 | 2018-10-04 | レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015553188A Active JP6422033B2 (ja) | 2013-01-15 | 2014-01-14 | レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置 |
| JP2018188881A Pending JP2019034343A (ja) | 2013-01-15 | 2018-10-04 | レーザビーム焦線を用いたシート状基板のレーザベースの機械加工方法及び装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US11028003B2 (enExample) |
| EP (3) | EP2754524B1 (enExample) |
| JP (3) | JP6496248B2 (enExample) |
| KR (2) | KR102230762B1 (enExample) |
| CN (2) | CN105209218B (enExample) |
| CA (2) | CA2898371A1 (enExample) |
| LT (2) | LT2945769T (enExample) |
| TW (2) | TWI639479B (enExample) |
| WO (2) | WO2014111385A1 (enExample) |
Families Citing this family (195)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012006736A2 (en) | 2010-07-12 | 2012-01-19 | Filaser Inc. | Method of material processing by laser filamentation |
| EP2646384B1 (en) | 2010-11-30 | 2019-03-27 | Corning Incorporated | Methods of forming high-density arrays of holes in glass |
| TWI547454B (zh) * | 2011-05-31 | 2016-09-01 | 康寧公司 | 於玻璃中高速製造微孔洞的方法 |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| US9701564B2 (en) | 2013-01-15 | 2017-07-11 | Corning Incorporated | Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles |
| JP6121733B2 (ja) * | 2013-01-31 | 2017-04-26 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9102007B2 (en) * | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| US9102011B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |
| US10017410B2 (en) | 2013-10-25 | 2018-07-10 | Rofin-Sinar Technologies Llc | Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses |
| US11053156B2 (en) | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| US10252507B2 (en) | 2013-11-19 | 2019-04-09 | Rofin-Sinar Technologies Llc | Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy |
| US10005152B2 (en) | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
| US9517929B2 (en) | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
| US10144088B2 (en) | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US9687936B2 (en) | 2013-12-17 | 2017-06-27 | Corning Incorporated | Transparent material cutting with ultrafast laser and beam optics |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| DE102015000449A1 (de) | 2015-01-15 | 2016-07-21 | Siltectra Gmbh | Festkörperteilung mittels Stoffumwandlung |
| US11407066B2 (en) * | 2014-01-15 | 2022-08-09 | Siltectra Gmbh | Splitting of a solid using conversion of material |
| US9938187B2 (en) | 2014-02-28 | 2018-04-10 | Rofin-Sinar Technologies Llc | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses |
| JP6262039B2 (ja) | 2014-03-17 | 2018-01-17 | 株式会社ディスコ | 板状物の加工方法 |
| JP6301203B2 (ja) * | 2014-06-02 | 2018-03-28 | 株式会社ディスコ | チップの製造方法 |
| EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| JP2017529311A (ja) * | 2014-07-11 | 2017-10-05 | コーニング インコーポレイテッド | ガラス物品内にパルスレーザで穿孔を生じさせることによるガラス切断システムおよび方法 |
| EP3169477B1 (en) | 2014-07-14 | 2020-01-29 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
| WO2016010949A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for forming perforations |
| WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
| US9617180B2 (en) | 2014-07-14 | 2017-04-11 | Corning Incorporated | Methods and apparatuses for fabricating glass articles |
| JP6788571B2 (ja) | 2014-07-14 | 2020-11-25 | コーニング インコーポレイテッド | 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法 |
| DE102014213775B4 (de) * | 2014-07-15 | 2018-02-15 | Innolas Solutions Gmbh | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten |
| US9757815B2 (en) | 2014-07-21 | 2017-09-12 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser curved filamentation within transparent materials |
| EP3195706B2 (de) | 2014-09-16 | 2025-05-14 | LPKF Laser & Electronics SE | Verfahren zum einbringen mindestens einer ausnehmung oder einer durchbrechung in ein plattenförmiges werkstück |
| WO2016073658A1 (en) | 2014-11-05 | 2016-05-12 | Corning Incorporated | Bottom-up electrolytic via plating method |
| DE102014116958B9 (de) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
| DE102014116957A1 (de) * | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung |
| EP3221727B1 (de) * | 2014-11-19 | 2021-03-17 | Trumpf Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
| KR102232168B1 (ko) * | 2014-11-25 | 2021-03-29 | 삼성디스플레이 주식회사 | 기판 커팅 장치 |
| EP4234156B1 (de) | 2014-11-27 | 2025-10-29 | Siltectra GmbH | Laserbasiertes trennverfahren |
| US9873628B1 (en) * | 2014-12-02 | 2018-01-23 | Coherent Kaiserslautern GmbH | Filamentary cutting of brittle materials using a picosecond pulsed laser |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| EP3245166B1 (en) * | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| WO2016114934A1 (en) | 2015-01-13 | 2016-07-21 | Rofin-Sinar Technologies Inc. | Method and system for scribing brittle material followed by chemical etching |
| US10429553B2 (en) | 2015-02-27 | 2019-10-01 | Corning Incorporated | Optical assembly having microlouvers |
| HUE055461T2 (hu) * | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
| DE102015104802A1 (de) | 2015-03-27 | 2016-09-29 | Schott Ag | Verfahren zum Trennen von Glas mittels eines Lasers, sowie verfahrensgemäß hergestelltes Glaserzeugnis |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| JP6472333B2 (ja) * | 2015-06-02 | 2019-02-20 | 株式会社ディスコ | ウエーハの生成方法 |
| EP3311455A4 (en) * | 2015-06-16 | 2019-09-04 | Electro Scientific Industries, Inc. | METHOD AND DEVICE FOR PROCESSING TRANSPARENT MATERIALS |
| DE102015008037A1 (de) * | 2015-06-23 | 2016-12-29 | Siltectra Gmbh | Verfahren zum Führen eines Risses im Randbereich eines Spendersubstrats |
| DE102015110422A1 (de) | 2015-06-29 | 2016-12-29 | Schott Ag | Laserbearbeitung eines mehrphasigen transparenten Materials, sowie mehrphasiger Kompositwerkstoff |
| DE102015211999A1 (de) * | 2015-06-29 | 2016-12-29 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserbearbeitungskopf und Laserbearbeitungsmaschine damit |
| CN107835794A (zh) * | 2015-07-10 | 2018-03-23 | 康宁股份有限公司 | 在挠性基材板中连续制造孔的方法和与此相关的产品 |
| DE102015111491A1 (de) | 2015-07-15 | 2017-01-19 | Schott Ag | Verfahren und Vorrichtung zum Abtrennen von Glas- oder Glaskeramikteilen |
| DE102015111490A1 (de) * | 2015-07-15 | 2017-01-19 | Schott Ag | Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement |
| CN105108331A (zh) * | 2015-07-28 | 2015-12-02 | 上海信耀电子有限公司 | 一种整形导光管及激光焊接工艺 |
| DE102015116846A1 (de) | 2015-10-05 | 2017-04-06 | Schott Ag | Verfahren zum Filamentieren eines Werkstückes mit einer von der Sollkontur abweichenden Form sowie durch Filamentation erzeugtes Werkstück |
| KR102542407B1 (ko) | 2015-10-07 | 2023-06-13 | 코닝 인코포레이티드 | 레이저 컷 될 코팅된 기판의 레이저 처리 방법 |
| JP6549014B2 (ja) * | 2015-10-13 | 2019-07-24 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
| CN106601876A (zh) * | 2015-10-19 | 2017-04-26 | 映瑞光电科技(上海)有限公司 | 一种led芯片结构及其制作方法 |
| CN108367387B (zh) * | 2015-12-22 | 2021-12-07 | 贺利氏德国有限责任两合公司 | 使用皮秒激光生产金属陶瓷基材的方法 |
| DE102016102768A1 (de) * | 2016-02-17 | 2017-08-17 | Schott Ag | Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement |
| EP3426614B1 (en) | 2016-03-09 | 2024-11-20 | Corning Incorporated | Cold forming of complexly curved glass articles |
| EP4166271A1 (de) * | 2016-03-22 | 2023-04-19 | Siltectra GmbH | Verfahren zum erzeugen von mindestens einer zumindest abschnittweise gewölbten oder gebogenen festkörperschicht |
| KR101774290B1 (ko) * | 2016-04-25 | 2017-09-04 | 주식회사 아톤이엔지 | 레이저 핀 빔을 이용한 취성 소재 가공 방법 및 장치와 이를 위한 광학계 |
| CN109311725B (zh) | 2016-05-06 | 2022-04-26 | 康宁股份有限公司 | 从透明基材激光切割及移除轮廓形状 |
| JP6755705B2 (ja) * | 2016-05-09 | 2020-09-16 | 株式会社ディスコ | レーザー加工装置 |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| JP6705014B2 (ja) * | 2016-06-08 | 2020-06-03 | ハンズ レーザー テクノロジー インダストリー グループ カンパニー リミテッド | サファイアを切断するための方法及び装置 |
| KR102544091B1 (ko) | 2016-06-28 | 2023-06-16 | 코닝 인코포레이티드 | 장식 및 디스플레이 커버 적용(application)을 위한 커브드(curved) 몰딩된(molded) 플라스틱 표면에 대한 얇은 강화된 유리의 적층(laminating) |
| JP6744624B2 (ja) * | 2016-06-28 | 2020-08-19 | 三星ダイヤモンド工業株式会社 | 管状脆性部材の分断方法並びに分断装置 |
| US10134657B2 (en) * | 2016-06-29 | 2018-11-20 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| TWI730140B (zh) | 2016-07-05 | 2021-06-11 | 美商康寧公司 | 冷成形玻璃製品及其組裝製程 |
| KR20190035805A (ko) | 2016-07-29 | 2019-04-03 | 코닝 인코포레이티드 | 레이저 처리를 위한 장치 및 방법 |
| EP3507057A1 (en) * | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
| DE102017008619A1 (de) * | 2016-09-15 | 2018-03-15 | Asahi Glass Company, Limited | Verfahren zur Herstellung eines Glasgegenstands und ein Glasgegenstand |
| CN113399816B (zh) * | 2016-09-30 | 2023-05-16 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| TWI762517B (zh) * | 2016-10-07 | 2022-05-01 | 美商康寧公司 | 電致變色塗佈的玻璃物件及用於雷射處理電致變色塗佈的玻璃物件之方法 |
| US20180105455A1 (en) | 2016-10-17 | 2018-04-19 | Corning Incorporated | Silica test probe and other such devices |
| KR101736693B1 (ko) * | 2016-10-19 | 2017-05-29 | 전상욱 | 레이저 회절빔의 필라멘테이션을 이용한 취성 소재 가공 방법 및 이를 위한 레이저 가공 장치 |
| CN110167891A (zh) * | 2016-10-24 | 2019-08-23 | 康宁股份有限公司 | 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位 |
| CN115403280B (zh) | 2016-10-25 | 2024-03-19 | 康宁公司 | 用于显示器的冷成形玻璃积层 |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US20180118602A1 (en) * | 2016-11-01 | 2018-05-03 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
| US10668561B2 (en) * | 2016-11-15 | 2020-06-02 | Coherent, Inc. | Laser apparatus for cutting brittle material |
| JP7148513B2 (ja) * | 2016-11-18 | 2022-10-05 | アイピージー フォトニクス コーポレーション | 物質のレーザー処理用のシステム及び方法 |
| DE102017100015A1 (de) * | 2017-01-02 | 2018-07-05 | Schott Ag | Verfahren zum Trennen von Substraten |
| US11768549B2 (en) | 2017-01-03 | 2023-09-26 | Corning Incorporated | Vehicle interior systems having a curved cover glass and display or touch panel and methods for forming the same |
| US11016590B2 (en) | 2017-01-03 | 2021-05-25 | Corning Incorporated | Vehicle interior systems having a curved cover glass and display or touch panel and methods for forming the same |
| JP6929525B2 (ja) * | 2017-02-07 | 2021-09-01 | 日本電気硝子株式会社 | ガラスフィルムの製造方法 |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| CN106695117A (zh) * | 2017-02-13 | 2017-05-24 | 武汉澳谱激光科技有限公司 | 一种实现轴向均匀线焦斑的光学器件 |
| CN106624355A (zh) * | 2017-02-23 | 2017-05-10 | 常州特尔玛枪嘴有限公司 | 一种可调节光斑能量密度分布的激光切割头 |
| CN110869845A (zh) | 2017-04-12 | 2020-03-06 | 法国圣戈班玻璃厂 | 电致变色结构及分离电致变色结构的方法 |
| DE102017206461B4 (de) | 2017-04-13 | 2019-05-02 | Schott Ag | Vorrichtung und Verfahren zum laserbasierten Trennen eines transparenten, sprödbrechenden Werkstücks |
| EP3625179B1 (en) | 2017-05-15 | 2025-09-17 | Corning Incorporated | Contoured glass articles and method of making the same |
| DE102017208290A1 (de) | 2017-05-17 | 2018-11-22 | Schott Ag | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks entlang einer vorbestimmten Bearbeitungslinie |
| WO2018210519A1 (de) | 2017-05-19 | 2018-11-22 | Schott Ag | Bauteil, umfassend glas oder glaskeramik, mit entlang einer vorgegebenen trennlinie angeordneten vorschädigungen, verfahren und vorrichtung zur herstellung des bauteils und dessen verwendung |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| EP3412400A1 (en) * | 2017-06-09 | 2018-12-12 | Bystronic Laser AG | Beam shaper and use thereof, device for laser beam treatment of a workpiece and use thereof, method for laser beam treatment of a workpiece |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| GB201710813D0 (en) * | 2017-07-05 | 2017-08-16 | Univ Southampton | Method for fabricating an optical fibre preform |
| JP7288427B2 (ja) | 2017-07-11 | 2023-06-07 | コーニング インコーポレイテッド | タイル張り状ディスプレイとその製造方法 |
| EP4190616A3 (en) | 2017-07-18 | 2023-06-28 | Corning Incorporated | Cold forming of complexly curved glass articles |
| US10906832B2 (en) | 2017-08-11 | 2021-02-02 | Corning Incorporated | Apparatuses and methods for synchronous multi-laser processing of transparent workpieces |
| JP2020531392A (ja) * | 2017-08-25 | 2020-11-05 | コーニング インコーポレイテッド | アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法 |
| CN115602068A (zh) | 2017-09-12 | 2023-01-13 | 康宁公司(Us) | 用于装饰玻璃上的包括触摸面板的显示器的死前端及相关方法 |
| US11065960B2 (en) | 2017-09-13 | 2021-07-20 | Corning Incorporated | Curved vehicle displays |
| TWI806897B (zh) | 2017-09-13 | 2023-07-01 | 美商康寧公司 | 用於顯示器的基於光導器的無電面板、相關的方法及載具內部系統 |
| TWI888167B (zh) | 2017-10-10 | 2025-06-21 | 美商康寧公司 | 具有改善可靠性的彎曲的覆蓋玻璃的車輛內部系統及其形成方法 |
| CN111758063B (zh) | 2017-11-21 | 2022-08-09 | 康宁公司 | 用于抬头显示器系统的非球面镜及其形成方法 |
| TWI789463B (zh) | 2017-11-30 | 2023-01-11 | 美商康寧公司 | 用於形成曲面鏡的真空模具設備、系統及方法 |
| KR102709430B1 (ko) | 2017-11-30 | 2024-09-25 | 코닝 인코포레이티드 | 비구면 미러를 진공 성형하기 위한 시스템 및 방법 |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US10917966B2 (en) | 2018-01-29 | 2021-02-09 | Corning Incorporated | Articles including metallized vias |
| CN108161250A (zh) * | 2018-01-30 | 2018-06-15 | 苏州德龙激光股份有限公司 | 多焦点动态分布激光加工脆性透明材料的方法及装置 |
| DE102018126381A1 (de) | 2018-02-15 | 2019-08-22 | Schott Ag | Verfahren und Vorrichtung zum Einfügen einer Trennlinie in ein transparentes sprödbrüchiges Material, sowie verfahrensgemäß herstellbares, mit einer Trennlinie versehenes Element |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11992894B2 (en) | 2018-02-23 | 2024-05-28 | Corning Incorporated | Method of separating a liquid lens from an array of liquid lenses |
| US12202759B2 (en) | 2018-02-26 | 2025-01-21 | Corning Incorporated | Methods for laser forming transparent articles from a transparent mother sheet and processing the transparent articles in-situ |
| US12140732B2 (en) | 2018-03-02 | 2024-11-12 | Corning Incorporated | Anti-reflective coatings and articles and methods of forming the same |
| US11718071B2 (en) | 2018-03-13 | 2023-08-08 | Corning Incorporated | Vehicle interior systems having a crack resistant curved cover glass and methods for forming the same |
| US11401195B2 (en) * | 2018-03-29 | 2022-08-02 | Corning Incorporated | Selective laser processing of transparent workpiece stacks |
| US11152294B2 (en) | 2018-04-09 | 2021-10-19 | Corning Incorporated | Hermetic metallized via with improved reliability |
| US12011783B2 (en) | 2018-05-25 | 2024-06-18 | Corning Incorporated | Scribing thin ceramic materials using beam focal line |
| CN112714752A (zh) | 2018-06-19 | 2021-04-27 | 康宁公司 | 透明工件的主动控制激光加工 |
| US11059131B2 (en) | 2018-06-22 | 2021-07-13 | Corning Incorporated | Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer |
| CN116312233B (zh) | 2018-07-12 | 2025-09-16 | 康宁公司 | 配置用于色彩比对的无电板 |
| CN112566782A (zh) | 2018-07-16 | 2021-03-26 | 康宁公司 | 具冷弯玻璃基板的车辆内部系统及其形成方法 |
| CN112384481A (zh) * | 2018-08-10 | 2021-02-19 | 日本电气硝子株式会社 | 玻璃板的制造方法 |
| US20200061750A1 (en) * | 2018-08-22 | 2020-02-27 | Coherent Munich GmbH & Co. KG | Mitigating low surface quality |
| KR20210064266A (ko) | 2018-09-20 | 2021-06-02 | 재단법인 공업기술연구원 | 얇은 유리 상의 유리-관통 비아를 위한 구리 금속화 |
| KR102569941B1 (ko) | 2018-09-28 | 2023-08-23 | 코닝 인코포레이티드 | 투명 기판을 수정하기 위한 시스템 및 방법 |
| JP2022504169A (ja) | 2018-10-04 | 2022-01-13 | コーニング インコーポレイテッド | マルチセクションディスプレイを形成するためのシステムおよび方法 |
| CN109767973A (zh) * | 2018-12-14 | 2019-05-17 | 华南理工大学 | 一种利用深紫外激光对氧化物半导体薄膜进行退火的方法 |
| CN109702356A (zh) * | 2019-01-09 | 2019-05-03 | 蓝思智能机器人(长沙)有限公司 | 一种激光切割覆盖保护膜玻璃的方法 |
| US11760682B2 (en) | 2019-02-21 | 2023-09-19 | Corning Incorporated | Glass or glass ceramic articles with copper-metallized through holes and processes for making the same |
| EP3712717A1 (fr) * | 2019-03-19 | 2020-09-23 | Comadur S.A. | Methode pour marquer une glace de montre en saphir |
| WO2020190489A1 (en) | 2019-03-21 | 2020-09-24 | Corning Incorporated | Systems for and methods of forming micro-holes in glass-based objects using an annular vortex laser beam |
| JP7230650B2 (ja) | 2019-04-05 | 2023-03-01 | Tdk株式会社 | 無機材料基板の加工方法、デバイス、およびデバイスの製造方法 |
| US11054574B2 (en) | 2019-05-16 | 2021-07-06 | Corning Research & Development Corporation | Methods of singulating optical waveguide sheets to form optical waveguide substrates |
| JP7364860B2 (ja) * | 2019-07-01 | 2023-10-19 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| EP3990209B1 (en) | 2019-07-01 | 2023-10-04 | Corning Incorporated | Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams |
| EP3771695A1 (en) | 2019-07-31 | 2021-02-03 | Corning Incorporated | Method and system for cold-forming glass |
| DE102019121827A1 (de) * | 2019-08-13 | 2021-02-18 | Trumpf Laser- Und Systemtechnik Gmbh | Laserätzen mit variierender Ätzselektivität |
| DE102019123239B4 (de) * | 2019-08-29 | 2023-05-04 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Vorrichtung zum Trennen eines Werkstücks mittels eines Laserstrahls |
| CN110435160A (zh) * | 2019-09-09 | 2019-11-12 | 广东利元亨智能装备股份有限公司 | 一种激光焊接头及激光焊接方法 |
| DE102019125124A1 (de) * | 2019-09-18 | 2021-03-18 | Rogers Germany Gmbh | Verfahren zum Bearbeiten eines Metall-Keramik-Substrats, Anlage für ein solches Verfahren und Metall-Keramik-Substrate hergestellt mit einem solchen Verfahren |
| DE102019215264A1 (de) * | 2019-10-02 | 2021-04-08 | Flabeg Deutschland Gmbh | Scheibenförmiges Glaselement und Verfahren zum Vereinzeln eines Glassubstrats in eine Mehrzahl von derartigen Glaselementen |
| US12466756B2 (en) | 2019-10-08 | 2025-11-11 | Corning Incorporated | Curved glass articles including a bumper piece configured to relocate bending moment from display region and method of manufacturing same |
| CN110967842B (zh) * | 2019-11-11 | 2021-08-06 | 长春理工大学 | 基于光镊技术的局域空心光束自由开闭系统 |
| DE102019217577A1 (de) * | 2019-11-14 | 2021-05-20 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zur Laserbearbeitung eines Werkstücks, Bearbeitungsoptik und Laserbearbeitungsvorrichtung |
| KR20210059818A (ko) * | 2019-11-15 | 2021-05-26 | 삼성전자주식회사 | 스텔스 다이싱 장치 및 스텔스 다이싱 방법 |
| JP7782265B2 (ja) * | 2019-11-21 | 2025-12-09 | Agc株式会社 | ガラス板の加工方法 |
| CN111046535B (zh) * | 2019-11-25 | 2022-12-09 | 暨南大学 | 一种激光加工热分布计算方法 |
| JP7549958B2 (ja) | 2019-11-27 | 2024-09-12 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP2021088474A (ja) * | 2019-12-03 | 2021-06-10 | 日本電気硝子株式会社 | ガラス物品の製造方法、及びガラス物品 |
| EP4073487A1 (en) * | 2019-12-13 | 2022-10-19 | Alcon Inc. | System and method of determining issues with optical components |
| CA3170860A1 (en) * | 2020-02-21 | 2021-08-26 | Tornado Spectral Systems Inc. | Optical spectroscopy probe configurations for focusing light to a portion of a sample |
| TWI794589B (zh) * | 2020-02-21 | 2023-03-01 | 海納光電股份有限公司 | 硬脆板材高溫環境加工裝置及方法 |
| EP3875436B1 (de) * | 2020-03-06 | 2024-01-17 | Schott Ag | Verfahren zum vorbereiten und/oder durchführen des trennens eines substratelements und substratteilelement |
| JP6787617B2 (ja) * | 2020-03-19 | 2020-11-18 | 三星ダイヤモンド工業株式会社 | 管状脆性部材の分断方法並びに分断装置 |
| US11772361B2 (en) | 2020-04-02 | 2023-10-03 | Corning Incorporated | Curved glass constructions and methods for forming same |
| CN115697620A (zh) * | 2020-06-04 | 2023-02-03 | 康宁股份有限公司 | 使用改性脉冲串分布来激光加工透明工件的方法 |
| TWI733604B (zh) | 2020-06-10 | 2021-07-11 | 財團法人工業技術研究院 | 玻璃工件雷射處理系統及方法 |
| US12486197B2 (en) * | 2020-09-04 | 2025-12-02 | Schott Ag | Method of surface structuring a substrate body and substrate body |
| KR102375235B1 (ko) * | 2020-09-08 | 2022-03-16 | 주식회사 필옵틱스 | 레이저 가공 시스템 및 방법 |
| DE102020123787A1 (de) | 2020-09-11 | 2022-03-17 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Trennen eines transparenten Materials |
| DE102020127116B4 (de) | 2020-10-15 | 2022-07-14 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Laserbearbeiten eines Werkstücks |
| DE102020132700A1 (de) | 2020-12-08 | 2022-06-09 | Trumpf Laser- Und Systemtechnik Gmbh | Hochenergieglasschneiden |
| DE102020134197A1 (de) * | 2020-12-18 | 2022-06-23 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines Materials |
| CN112606235B (zh) * | 2021-01-12 | 2022-12-20 | 盛吉盛精密制造(绍兴)有限公司 | 一种用于硅片线切割的切割设备 |
| US12304005B2 (en) | 2021-02-01 | 2025-05-20 | Corning Incorporated | Sacrificial layers to enable laser cutting of textured substrates |
| EP4308331A4 (en) * | 2021-03-18 | 2025-03-19 | Divergent Technologies, Inc. | Powder bed fusion based on an energy beam with variable beam geometry |
| DE102021112271A1 (de) * | 2021-05-11 | 2022-11-17 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zur Bestimmung der Strahlgüte |
| CN113607092B (zh) * | 2021-07-21 | 2022-07-15 | 中国科学技术大学 | 一种光线小角度测量方法及系统 |
| WO2023014550A1 (en) | 2021-08-06 | 2023-02-09 | Corning Incorporated | Anti-resonant hollow core optical fiber preform and methods of making |
| CN113732511B (zh) * | 2021-08-30 | 2023-01-06 | 中国科学院西安光学精密机械研究所 | 光纤表面包层微纳结构飞秒激光加工方法及装置 |
| US20240402507A1 (en) * | 2021-10-01 | 2024-12-05 | Tekjp, Inc. | Narrow beam generation device |
| WO2023096776A2 (en) | 2021-11-29 | 2023-06-01 | Corning Incorporated | Laser cutting methods for multi-layered glass assemblies having an electrically conductive layer |
| DE102021131812A1 (de) | 2021-12-02 | 2023-06-07 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Trennen eines transparenten Werkstücks |
| EP4551535A1 (en) | 2022-07-07 | 2025-05-14 | Corning Incorporated | Methods for drilling features in a substrate using laser perforation and laser ablation |
| DE102022118491A1 (de) * | 2022-07-25 | 2024-01-25 | Trumpf Laser- Und Systemtechnik Gmbh | Optische Anordnung zur Umwandlung eines Eingangslaserstrahls in einen linienartigen Ausgangsstrahls |
| CN115755763A (zh) * | 2022-12-01 | 2023-03-07 | 北京工业大学 | 一种激光机器人加工自适应定位方法 |
| NL2036144B1 (en) * | 2023-10-27 | 2025-05-12 | Inphocal B V | Laser-based wafer dicing method and apparatus |
| DE102024103217A1 (de) * | 2024-02-06 | 2025-08-07 | TRUMPF Laser SE | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks aus einem doppelbrechenden Material |
Family Cites Families (750)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1790397A (en) | 1931-01-27 | Glass workins machine | ||
| US1529243A (en) | 1924-01-30 | 1925-03-10 | Libbey Owens Sheet Glass Co | Flattening table for continuous sheet glass |
| US1626396A (en) | 1926-08-02 | 1927-04-26 | Libbey Owens Sheet Glass Co | Sheet-glass-drawing apparatus |
| US2754956A (en) | 1951-05-02 | 1956-07-17 | Sommer & Maca Glass Machinery | Conveyor structure for flat glass edging beveling and polishing apparatus |
| US2682134A (en) | 1951-08-17 | 1954-06-29 | Corning Glass Works | Glass sheet containing translucent linear strips |
| US2749794A (en) | 1953-04-24 | 1956-06-12 | Corning Glass Works | Illuminating glassware and method of making it |
| US2932087A (en) | 1954-05-10 | 1960-04-12 | Libbey Owens Ford Glass Co | Template cutting apparatus for bent sheets of glass or the like |
| GB1242172A (en) | 1968-02-23 | 1971-08-11 | Ford Motor Co | A process for chemically cutting glass |
| US3647410A (en) | 1969-09-09 | 1972-03-07 | Owens Illinois Inc | Glass ribbon machine blow head mechanism |
| US3729302A (en) | 1970-01-02 | 1973-04-24 | Owens Illinois Inc | Removal of glass article from ribbon forming machine by vibrating force |
| US3775084A (en) | 1970-01-02 | 1973-11-27 | Owens Illinois Inc | Pressurizer apparatus for glass ribbon machine |
| US3673900A (en) | 1970-08-10 | 1972-07-04 | Shatterproof Glass Corp | Glass cutting apparatus |
| US3695497A (en) | 1970-08-26 | 1972-10-03 | Ppg Industries Inc | Method of severing glass |
| US3695498A (en) | 1970-08-26 | 1972-10-03 | Ppg Industries Inc | Non-contact thermal cutting |
| DE2231330A1 (de) | 1972-06-27 | 1974-01-10 | Agfa Gevaert Ag | Verfahren und vorrichtung zur erzeugung eines scharfen fokus |
| US3947093A (en) * | 1973-06-28 | 1976-03-30 | Canon Kabushiki Kaisha | Optical device for producing a minute light beam |
| GB1500207A (en) | 1975-10-29 | 1978-02-08 | Pilkington Brothers Ltd | Breaking flat glass into cullet |
| JPS5318756A (en) | 1976-07-31 | 1978-02-21 | Izawa Seimen Koujiyou Yuugen | Production of boiled noodle with long preservetivity |
| DE2757890C2 (de) | 1977-12-24 | 1981-10-15 | Fa. Karl Lutz, 6980 Wertheim | Verfahren und Vorrichtung zum Herstellen von Behältnissen aus Röhrenglas, insbesondere Ampullen |
| JPS54136045A (en) | 1978-04-07 | 1979-10-22 | Inoue Gomu Kogyo Kk | Preparation of elastic bumper for automobile* to which ornamental lace body is integrally installed |
| JPS5713480A (en) | 1980-06-26 | 1982-01-23 | Hitachi Ltd | Crt display unit |
| US4441008A (en) | 1981-09-14 | 1984-04-03 | Ford Motor Company | Method of drilling ultrafine channels through glass |
| US4546231A (en) | 1983-11-14 | 1985-10-08 | Group Ii Manufacturing Ltd. | Creation of a parting zone in a crystal structure |
| US4618056A (en) | 1984-03-23 | 1986-10-21 | Omega Castings, Inc. | Link conveyor belt for heat treating apparatus |
| JPS6174794A (ja) | 1984-09-17 | 1986-04-17 | Mitsubishi Electric Corp | レ−ザ加工装置の加工ヘツド |
| US4623776A (en) | 1985-01-03 | 1986-11-18 | Dow Corning Corporation | Ring of light laser optics system |
| US4642439A (en) | 1985-01-03 | 1987-02-10 | Dow Corning Corporation | Method and apparatus for edge contouring lenses |
| JPS6246930A (ja) | 1985-08-21 | 1987-02-28 | Bandou Kiko Kk | ガラス板の割断装置 |
| US4646308A (en) | 1985-09-30 | 1987-02-24 | Spectra-Physics, Inc. | Synchronously pumped dye laser using ultrashort pump pulses |
| JPS6318756A (ja) | 1986-07-09 | 1988-01-26 | Fujiwara Jiyouki Sangyo Kk | 生物育成、微生物培養工程における制御温度の監視方法及びその装置 |
| US4749400A (en) | 1986-12-12 | 1988-06-07 | Ppg Industries, Inc. | Discrete glass sheet cutting |
| EP0272582B1 (en) | 1986-12-18 | 1994-05-18 | Sumitomo Chemical Company, Limited | Light control sheets |
| JP2691543B2 (ja) | 1986-12-18 | 1997-12-17 | 住友化学工業株式会社 | 光制御板およびその製造方法 |
| JPS63192561A (ja) | 1987-02-04 | 1988-08-09 | Nkk Corp | マルチ切断装置 |
| US5104523A (en) | 1987-05-29 | 1992-04-14 | Nippon Sheet Glass Co., Ltd. | Glass-plate sorting system |
| US4918751A (en) | 1987-10-05 | 1990-04-17 | The University Of Rochester | Method for optical pulse transmission through optical fibers which increases the pulse power handling capacity of the fibers |
| IL84255A (en) | 1987-10-23 | 1993-02-21 | Galram Technology Ind Ltd | Process for removal of post- baked photoresist layer |
| JPH01179770A (ja) | 1988-01-12 | 1989-07-17 | Hiroshima Denki Gakuen | 金属とセラミックスとの接合方法 |
| US4764930A (en) | 1988-01-27 | 1988-08-16 | Intelligent Surgical Lasers | Multiwavelength laser source |
| US4907586A (en) | 1988-03-31 | 1990-03-13 | Intelligent Surgical Lasers | Method for reshaping the eye |
| US4929065A (en) | 1988-11-03 | 1990-05-29 | Isotec Partners, Ltd. | Glass plate fusion for macro-gradient refractive index materials |
| US4891054A (en) | 1988-12-30 | 1990-01-02 | Ppg Industries, Inc. | Method for cutting hot glass |
| US5112722A (en) | 1989-04-12 | 1992-05-12 | Nippon Sheet Glass Co., Ltd. | Method of producing light control plate which induces scattering of light at different angles |
| US5104210A (en) | 1989-04-24 | 1992-04-14 | Monsanto Company | Light control films and method of making |
| US5035918A (en) | 1989-04-26 | 1991-07-30 | Amp Incorporated | Non-flammable and strippable plating resist and method of using same |
| US4951457A (en) | 1989-11-08 | 1990-08-28 | Deal Douglas O | Narrow pitch articulated chain and links therefor |
| US4997250A (en) | 1989-11-17 | 1991-03-05 | General Electric Company | Fiber output coupler with beam shaping optics for laser materials processing system |
| ES2090308T3 (es) | 1990-01-31 | 1996-10-16 | Bando Kiko Co | Maquina para trabajar placa de cristal. |
| US5040182A (en) | 1990-04-24 | 1991-08-13 | Coherent, Inc. | Mode-locked laser |
| IE912667A1 (en) * | 1991-07-29 | 1993-02-10 | Trinity College Dublin | Laser Profiling of Lens Edge |
| US5256853A (en) | 1991-07-31 | 1993-10-26 | Bausch & Lomb Incorporated | Method for shaping contact lens surfaces |
| EP0614388B1 (en) | 1991-11-06 | 2002-06-12 | LAI, Shui, T. | Corneal surgery device |
| US5265107A (en) | 1992-02-05 | 1993-11-23 | Bell Communications Research, Inc. | Broadband absorber having multiple quantum wells of different thicknesses |
| US5410567A (en) | 1992-03-05 | 1995-04-25 | Corning Incorporated | Optical fiber draw furnace |
| JPH05274085A (ja) | 1992-03-26 | 1993-10-22 | Sanyo Electric Co Ltd | 入力および表示装置 |
| JPH05300544A (ja) | 1992-04-23 | 1993-11-12 | Sony Corp | 映像表示装置 |
| JPH05323110A (ja) | 1992-05-22 | 1993-12-07 | Hitachi Koki Co Ltd | 多ビーム発生素子 |
| US5475197A (en) | 1992-06-17 | 1995-12-12 | Carl-Zeiss-Stiftung | Process and apparatus for the ablation of a surface |
| JP3553986B2 (ja) | 1992-08-31 | 2004-08-11 | キヤノン株式会社 | 2重ベッセルビーム発生方法及び装置 |
| US6016223A (en) | 1992-08-31 | 2000-01-18 | Canon Kabushiki Kaisha | Double bessel beam producing method and apparatus |
| CA2112843A1 (en) | 1993-02-04 | 1994-08-05 | Richard C. Ujazdowski | Variable repetition rate picosecond laser |
| DE69418248T2 (de) | 1993-06-03 | 1999-10-14 | Hamamatsu Photonics Kk | Optisches Laser-Abtastsystem mit Axikon |
| EP0656241B1 (en) | 1993-06-04 | 1998-12-23 | Seiko Epson Corporation | Apparatus and method for laser machining |
| US6489589B1 (en) | 1994-02-07 | 2002-12-03 | Board Of Regents, University Of Nebraska-Lincoln | Femtosecond laser utilization methods and apparatus and method for producing nanoparticles |
| JP3531199B2 (ja) * | 1994-02-22 | 2004-05-24 | 三菱電機株式会社 | 光伝送装置 |
| US5436925A (en) | 1994-03-01 | 1995-07-25 | Hewlett-Packard Company | Colliding pulse mode-locked fiber ring laser using a semiconductor saturable absorber |
| US5400350A (en) | 1994-03-31 | 1995-03-21 | Imra America, Inc. | Method and apparatus for generating high energy ultrashort pulses |
| US5778016A (en) | 1994-04-01 | 1998-07-07 | Imra America, Inc. | Scanning temporal ultrafast delay methods and apparatuses therefor |
| US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
| DE19513354A1 (de) | 1994-04-14 | 1995-12-14 | Zeiss Carl | Materialbearbeitungseinrichtung |
| JP2526806B2 (ja) | 1994-04-26 | 1996-08-21 | 日本電気株式会社 | 半導体レ―ザおよびその動作方法 |
| WO1995031023A1 (en) | 1994-05-09 | 1995-11-16 | Massachusetts Institute Of Technology | Dispersion-compensated laser using prismatic end elements |
| US5434875A (en) | 1994-08-24 | 1995-07-18 | Tamar Technology Co. | Low cost, high average power, high brightness solid state laser |
| US6016324A (en) | 1994-08-24 | 2000-01-18 | Jmar Research, Inc. | Short pulse laser system |
| US5776220A (en) | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| US5541774A (en) | 1995-02-27 | 1996-07-30 | Blankenbecler; Richard | Segmented axial gradient lens |
| US5696782A (en) | 1995-05-19 | 1997-12-09 | Imra America, Inc. | High power fiber chirped pulse amplification systems based on cladding pumped rare-earth doped fibers |
| AT402195B (de) | 1995-05-29 | 1997-02-25 | Lisec Peter | Vorrichtung zum fördern von glastafeln |
| DE19535392A1 (de) | 1995-09-23 | 1997-03-27 | Zeiss Carl Fa | Radial polarisationsdrehende optische Anordnung und Mikrolithographie-Projektionsbelichtungsanlage damit |
| US5854490A (en) | 1995-10-03 | 1998-12-29 | Fujitsu Limited | Charged-particle-beam exposure device and charged-particle-beam exposure method |
| JPH09106243A (ja) | 1995-10-12 | 1997-04-22 | Dainippon Printing Co Ltd | ホログラムの複製方法 |
| JP3125180B2 (ja) | 1995-10-20 | 2001-01-15 | 新東工業株式会社 | シート状樹脂成型設備 |
| US5715346A (en) | 1995-12-15 | 1998-02-03 | Corning Incorporated | Large effective area single mode optical waveguide |
| US5692703A (en) | 1996-05-10 | 1997-12-02 | Mcdonnell Douglas Corporation | Multiple application wheel well design |
| US5736709A (en) | 1996-08-12 | 1998-04-07 | Armco Inc. | Descaling metal with a laser having a very short pulse width and high average power |
| US5854751A (en) | 1996-10-15 | 1998-12-29 | The Trustees Of Columbia University In The City Of New York | Simulator and optimizer of laser cutting process |
| US7353829B1 (en) | 1996-10-30 | 2008-04-08 | Provectus Devicetech, Inc. | Methods and apparatus for multi-photon photo-activation of therapeutic agents |
| JP4237827B2 (ja) | 1996-11-13 | 2009-03-11 | コーニング インコーポレイテッド | 内部にチャンネルが形成されたガラス製品の製造方法 |
| US5781684A (en) | 1996-12-20 | 1998-07-14 | Corning Incorporated | Single mode optical waveguide having large effective area |
| CA2231096A1 (en) | 1997-03-25 | 1998-09-25 | Duane E. Hoke | Optical fiber dual spindle winder with automatic threading and winding |
| US6033583A (en) | 1997-05-05 | 2000-03-07 | The Regents Of The University Of California | Vapor etching of nuclear tracks in dielectric materials |
| US6156030A (en) | 1997-06-04 | 2000-12-05 | Y-Beam Technologies, Inc. | Method and apparatus for high precision variable rate material removal and modification |
| BE1011208A4 (fr) | 1997-06-11 | 1999-06-01 | Cuvelier Georges | Procede de decalottage de pieces en verre. |
| DE19728766C1 (de) | 1997-07-07 | 1998-12-17 | Schott Rohrglas Gmbh | Verwendung eines Verfahrens zur Herstellung einer Sollbruchstelle bei einem Glaskörper |
| JPH1179770A (ja) | 1997-07-10 | 1999-03-23 | Yamaha Corp | スクライブ装置及び劈開方法 |
| US6078599A (en) | 1997-07-22 | 2000-06-20 | Cymer, Inc. | Wavelength shift correction technique for a laser |
| US6003418A (en) | 1997-07-31 | 1999-12-21 | International Business Machines Corporation | Punched slug removal system |
| JP3264224B2 (ja) | 1997-08-04 | 2002-03-11 | キヤノン株式会社 | 照明装置及びそれを用いた投影露光装置 |
| US6520057B1 (en) | 1997-09-30 | 2003-02-18 | Eastman Machine Company | Continuous system and method for cutting sheet material |
| JP3185869B2 (ja) | 1997-10-21 | 2001-07-11 | 日本電気株式会社 | レーザ加工方法 |
| DE19750320C1 (de) | 1997-11-13 | 1999-04-01 | Max Planck Gesellschaft | Verfahren und Vorrichtung zur Lichtpulsverstärkung |
| AU3908099A (en) | 1997-12-05 | 1999-06-28 | Thermolase Corporation | Skin enhancement using laser light |
| US6501578B1 (en) | 1997-12-19 | 2002-12-31 | Electric Power Research Institute, Inc. | Apparatus and method for line of sight laser communications |
| JPH11197498A (ja) | 1998-01-13 | 1999-07-27 | Japan Science & Technology Corp | 無機材料内部の選択的改質方法及び内部が選択的に改質された無機材料 |
| US6272156B1 (en) | 1998-01-28 | 2001-08-07 | Coherent, Inc. | Apparatus for ultrashort pulse transportation and delivery |
| JPH11240730A (ja) | 1998-02-27 | 1999-09-07 | Nec Kansai Ltd | 脆性材料の割断方法 |
| JPH11269683A (ja) | 1998-03-18 | 1999-10-05 | Armco Inc | 金属表面から酸化物を除去する方法及び装置 |
| US6160835A (en) | 1998-03-20 | 2000-12-12 | Rocky Mountain Instrument Co. | Hand-held marker with dual output laser |
| DE69931690T2 (de) | 1998-04-08 | 2007-06-14 | Asml Netherlands B.V. | Lithographischer Apparat |
| EP0949541B1 (en) | 1998-04-08 | 2006-06-07 | ASML Netherlands B.V. | Lithography apparatus |
| US6256328B1 (en) | 1998-05-15 | 2001-07-03 | University Of Central Florida | Multiwavelength modelocked semiconductor diode laser |
| US6308055B1 (en) | 1998-05-29 | 2001-10-23 | Silicon Laboratories, Inc. | Method and apparatus for operating a PLL for synthesizing high-frequency signals for wireless communications |
| JPH11347861A (ja) | 1998-06-03 | 1999-12-21 | Amada Co Ltd | レーザ加工機における複合加工方法およびレーザ加工機における複合加工システム |
| JPH11347758A (ja) | 1998-06-10 | 1999-12-21 | Mitsubishi Heavy Ind Ltd | 超精密加工装置 |
| TW419867B (en) | 1998-08-26 | 2001-01-21 | Samsung Electronics Co Ltd | Laser cutting apparatus and method |
| DE19851353C1 (de) | 1998-11-06 | 1999-10-07 | Schott Glas | Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff |
| JP3178524B2 (ja) | 1998-11-26 | 2001-06-18 | 住友重機械工業株式会社 | レーザマーキング方法と装置及びマーキングされた部材 |
| US6259058B1 (en) | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
| US7649153B2 (en) | 1998-12-11 | 2010-01-19 | International Business Machines Corporation | Method for minimizing sample damage during the ablation of material using a focused ultrashort pulsed laser beam |
| US6445491B2 (en) | 1999-01-29 | 2002-09-03 | Irma America, Inc. | Method and apparatus for optical sectioning and imaging using time-gated parametric image amplification |
| JP2000225485A (ja) | 1999-02-04 | 2000-08-15 | Fine Machining Kk | レーザ加工装置のステージ |
| US6381391B1 (en) | 1999-02-19 | 2002-04-30 | The Regents Of The University Of Michigan | Method and system for generating a broadband spectral continuum and continuous wave-generating system utilizing same |
| JP2000247668A (ja) | 1999-02-25 | 2000-09-12 | Bando Kiko Kk | ガラス板の加工機械 |
| DE19908630A1 (de) | 1999-02-27 | 2000-08-31 | Bosch Gmbh Robert | Abschirmung gegen Laserstrahlen |
| WO2000053365A1 (en) | 1999-03-05 | 2000-09-14 | Mitsubishi Denki Kabushiki Kaisha | Laser machining apparatus |
| US6501576B1 (en) | 1999-03-24 | 2002-12-31 | Intel Corporation | Wireless data transfer using a remote media interface |
| US6484052B1 (en) | 1999-03-30 | 2002-11-19 | The Regents Of The University Of California | Optically generated ultrasound for enhanced drug delivery |
| TWI223581B (en) | 1999-04-02 | 2004-11-01 | Murata Manufacturing Co | Method for machining ceramic green sheet and apparatus for machining the same |
| US6137632A (en) | 1999-04-19 | 2000-10-24 | Iomega Corporation | Method and apparatus for lossless beam shaping to obtain high-contrast imaging in photon tunneling methods |
| JP2000327349A (ja) | 1999-05-24 | 2000-11-28 | China Glaze Co Ltd | 結晶化ガラス板の曲げ加工方法 |
| US6373565B1 (en) | 1999-05-27 | 2002-04-16 | Spectra Physics Lasers, Inc. | Method and apparatus to detect a flaw in a surface of an article |
| CN2388062Y (zh) | 1999-06-21 | 2000-07-19 | 郭广宗 | 一层有孔一层无孔双层玻璃车船窗 |
| US6449301B1 (en) | 1999-06-22 | 2002-09-10 | The Regents Of The University Of California | Method and apparatus for mode locking of external cavity semiconductor lasers with saturable Bragg reflectors |
| US6185051B1 (en) | 1999-06-23 | 2001-02-06 | Read-Rite Corporation | High numerical aperture optical focusing device for use in data storage systems |
| CN1100494C (zh) | 1999-07-06 | 2003-02-05 | 王仁丁 | 糊香风味均质豆腐的制备方法 |
| US6259151B1 (en) | 1999-07-21 | 2001-07-10 | Intersil Corporation | Use of barrier refractive or anti-reflective layer to improve laser trim characteristics of thin film resistors |
| US6573026B1 (en) | 1999-07-29 | 2003-06-03 | Corning Incorporated | Femtosecond laser writing of glass, including borosilicate, sulfide, and lead glasses |
| US6452117B2 (en) | 1999-08-26 | 2002-09-17 | International Business Machines Corporation | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
| EP1409935B1 (en) | 1999-09-24 | 2013-01-02 | Peter Forrest Thompson | Heat pump fluid heating system |
| JP2001130921A (ja) | 1999-10-29 | 2001-05-15 | Mitsuboshi Diamond Industrial Co Ltd | 脆性基板の加工方法及び装置 |
| DE19952331C1 (de) | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
| JP2001138083A (ja) | 1999-11-18 | 2001-05-22 | Seiko Epson Corp | レーザー加工装置及びレーザー照射方法 |
| JP4592855B2 (ja) | 1999-12-24 | 2010-12-08 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP1242802B1 (en) | 1999-12-28 | 2012-05-30 | Corning Incorporated | Method and apparatus for tensile testing and rethreading optical fiber during fiber draw |
| US6339208B1 (en) | 2000-01-19 | 2002-01-15 | General Electric Company | Method of forming cooling holes |
| US6552301B2 (en) | 2000-01-25 | 2003-04-22 | Peter R. Herman | Burst-ultrafast laser machining method |
| JP2001236673A (ja) | 2000-02-17 | 2001-08-31 | Minolta Co Ltd | 光ヘッド及び光記録・再生装置 |
| DE10010131A1 (de) | 2000-03-03 | 2001-09-06 | Zeiss Carl | Mikrolithographie - Projektionsbelichtung mit tangentialer Polarisartion |
| WO2001084230A1 (en) | 2000-05-04 | 2001-11-08 | Schott Donnelly Llc | Chromogenic glazing |
| JP3530114B2 (ja) | 2000-07-11 | 2004-05-24 | 忠弘 大見 | 単結晶の切断方法 |
| JP2002040330A (ja) | 2000-07-25 | 2002-02-06 | Olympus Optical Co Ltd | 光学素子切換え制御装置 |
| JP3626442B2 (ja) * | 2000-09-13 | 2005-03-09 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP4964376B2 (ja) | 2000-09-13 | 2012-06-27 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| KR100673073B1 (ko) | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치 |
| SE0004096D0 (sv) | 2000-11-08 | 2000-11-08 | Nira Automotive Ab | Positioning system |
| US20020110639A1 (en) | 2000-11-27 | 2002-08-15 | Donald Bruns | Epoxy coating for optical surfaces |
| US6611647B2 (en) | 2000-12-12 | 2003-08-26 | Corning Incorporated | Large effective area optical fiber |
| US20020082466A1 (en) | 2000-12-22 | 2002-06-27 | Jeongho Han | Laser surgical system with light source and video scope |
| JP4880820B2 (ja) | 2001-01-19 | 2012-02-22 | 株式会社レーザーシステム | レーザ支援加工方法 |
| DE10103256A1 (de) | 2001-01-25 | 2002-08-08 | Leica Microsystems | Sicherheitsvorrichtung für Mikroskope mit einem Laserstrahl als Beleuchtungsquelle |
| JP2002228818A (ja) | 2001-02-05 | 2002-08-14 | Taiyo Yuden Co Ltd | レーザー加工用回折光学素子、レーザー加工装置及びレーザー加工方法 |
| JP3445250B2 (ja) | 2001-02-20 | 2003-09-08 | ゼット株式会社 | 靴 底 |
| EA004167B1 (ru) | 2001-03-01 | 2004-02-26 | Общество С Ограниченной Ответственностью "Лазтекс" | Способ резки стекла |
| DE10124803A1 (de) | 2001-05-22 | 2002-11-28 | Zeiss Carl | Polarisator und Mikrolithographie-Projektionsanlage mit Polarisator |
| US7015491B2 (en) | 2001-06-01 | 2006-03-21 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and device manufactured thereby, control system |
| KR100576746B1 (ko) | 2001-06-01 | 2006-05-03 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피장치, 디바이스제조방법, 그 디바이스,제어시스템, 컴퓨터프로그램, 및 컴퓨터프로그램물 |
| JP3725805B2 (ja) | 2001-07-04 | 2005-12-14 | 三菱電線工業株式会社 | ファイバ配線シートおよびその製造方法 |
| SG108262A1 (en) | 2001-07-06 | 2005-01-28 | Inst Data Storage | Method and apparatus for cutting a multi-layer substrate by dual laser irradiation |
| US6754429B2 (en) | 2001-07-06 | 2004-06-22 | Corning Incorporated | Method of making optical fiber devices and devices thereof |
| SE0202159D0 (sv) | 2001-07-10 | 2002-07-09 | Coding Technologies Sweden Ab | Efficientand scalable parametric stereo coding for low bitrate applications |
| JP3775250B2 (ja) | 2001-07-12 | 2006-05-17 | セイコーエプソン株式会社 | レーザー加工方法及びレーザー加工装置 |
| JPWO2003007370A1 (ja) | 2001-07-12 | 2004-11-04 | 株式会社日立製作所 | 配線ガラス基板およびその製造方法ならびに配線ガラス基板に用いられる導電性ペーストおよび半導体モジュールならびに配線基板および導体形成方法 |
| CN1283409C (zh) | 2001-08-10 | 2006-11-08 | 三星钻石工业股份有限公司 | 脆性材料基片的倒角方法以及倒角装置 |
| JP3795778B2 (ja) | 2001-08-24 | 2006-07-12 | 株式会社ノリタケカンパニーリミテド | 水添ビスフェノールa型エポキシ樹脂を用いたレジノイド研削砥石 |
| JP4397571B2 (ja) * | 2001-09-25 | 2010-01-13 | 株式会社半導体エネルギー研究所 | レーザ照射方法およびレーザ照射装置、並びに半導体装置の作製方法 |
| JP2003114400A (ja) | 2001-10-04 | 2003-04-18 | Sumitomo Electric Ind Ltd | レーザ光学システムおよびレーザ加工方法 |
| JP2003124491A (ja) | 2001-10-15 | 2003-04-25 | Sharp Corp | 薄膜太陽電池モジュール |
| EP1306196A1 (de) | 2001-10-24 | 2003-05-02 | Telsonic AG | Haltevorrichtung, Vorrichtung zum Verschweissen von Werkstücken und Verfahren zum Bereitstellen einer Haltevorrichtung |
| JP2003154517A (ja) | 2001-11-21 | 2003-05-27 | Seiko Epson Corp | 脆性材料の割断加工方法およびその装置、並びに電子部品の製造方法 |
| US6720519B2 (en) | 2001-11-30 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | System and method of laser drilling |
| US6973384B2 (en) | 2001-12-06 | 2005-12-06 | Bellsouth Intellectual Property Corporation | Automated location-intelligent traffic notification service systems and methods |
| JP2003238178A (ja) | 2002-02-21 | 2003-08-27 | Toshiba Ceramics Co Ltd | ガス導入用シャワープレート及びその製造方法 |
| DE60335538D1 (de) | 2002-03-12 | 2011-02-10 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
| US6787732B1 (en) | 2002-04-02 | 2004-09-07 | Seagate Technology Llc | Method for laser-scribing brittle substrates and apparatus therefor |
| US6744009B1 (en) | 2002-04-02 | 2004-06-01 | Seagate Technology Llc | Combined laser-scribing and laser-breaking for shaping of brittle substrates |
| DE10219514A1 (de) | 2002-04-30 | 2003-11-13 | Zeiss Carl Smt Ag | Beleuchtungssystem, insbesondere für die EUV-Lithographie |
| US7565820B2 (en) | 2002-04-30 | 2009-07-28 | Corning Incorporated | Methods and apparatus for forming heat treated optical fiber |
| FR2839508B1 (fr) | 2002-05-07 | 2005-03-04 | Saint Gobain | Vitrage decoupe sans rompage |
| JP3559827B2 (ja) | 2002-05-24 | 2004-09-02 | 独立行政法人理化学研究所 | 透明材料内部の処理方法およびその装置 |
| US7116283B2 (en) | 2002-07-30 | 2006-10-03 | Ncr Corporation | Methods and apparatus for improved display of visual data for point of sale terminals |
| CA2396831A1 (en) * | 2002-08-02 | 2004-02-02 | Femtonics Corporation | Microstructuring optical wave guide devices with femtosecond optical pulses |
| DE10240033B4 (de) | 2002-08-28 | 2005-03-10 | Jenoptik Automatisierungstech | Anordnung zum Einbringen von Strahlungsenergie in ein Werkstück aus einem schwach absorbierenden Material |
| US6737345B1 (en) | 2002-09-10 | 2004-05-18 | Taiwan Semiconductor Manufacturing Company | Scheme to define laser fuse in dual damascene CU process |
| US20040051982A1 (en) | 2002-09-13 | 2004-03-18 | Perchak Robert M. | Wide angle surface generator & target |
| JP3929393B2 (ja) | 2002-12-03 | 2007-06-13 | 株式会社日本エミック | 切断装置 |
| JP2004209675A (ja) | 2002-12-26 | 2004-07-29 | Kashifuji:Kk | 押圧切断装置及び押圧切断方法 |
| KR100497820B1 (ko) | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
| TWI319412B (en) | 2003-01-15 | 2010-01-11 | Sumitomo Rubber Ind | Polymeric-type antistatic agent and antistatic polymer composition and fabricating method thereof |
| JP2004217492A (ja) | 2003-01-17 | 2004-08-05 | Murakami Corp | ガラス板材の切抜方法 |
| CN100398249C (zh) | 2003-01-21 | 2008-07-02 | 丰田钢铁中心株式会社 | 激光切割装置、激光切割方法和激光切割系统 |
| JP3775410B2 (ja) | 2003-02-03 | 2006-05-17 | セイコーエプソン株式会社 | レーザー加工方法、レーザー溶接方法並びにレーザー加工装置 |
| CN1758985A (zh) | 2003-03-12 | 2006-04-12 | 浜松光子学株式会社 | 激光加工方法 |
| US7617167B2 (en) | 2003-04-09 | 2009-11-10 | Avisere, Inc. | Machine vision system for enterprise management |
| RU2365547C2 (ru) | 2003-04-22 | 2009-08-27 | Дзе Кока-Кола Компани | Способ и устройство для упрочнения стекла |
| US6952519B2 (en) | 2003-05-02 | 2005-10-04 | Corning Incorporated | Large effective area high SBS threshold optical fiber |
| US6904218B2 (en) | 2003-05-12 | 2005-06-07 | Fitel U.S.A. Corporation | Super-large-effective-area (SLA) optical fiber and communication system incorporating the same |
| DE10322376A1 (de) | 2003-05-13 | 2004-12-02 | Carl Zeiss Smt Ag | Axiconsystem und Beleuchtungssystem damit |
| US7511886B2 (en) | 2003-05-13 | 2009-03-31 | Carl Zeiss Smt Ag | Optical beam transformation system and illumination system comprising an optical beam transformation system |
| FR2855084A1 (fr) * | 2003-05-22 | 2004-11-26 | Air Liquide | Optique de focalisation pour le coupage laser |
| JP2005000952A (ja) | 2003-06-12 | 2005-01-06 | Nippon Sheet Glass Co Ltd | レーザー加工方法及びレーザー加工装置 |
| JP4820750B2 (ja) | 2003-06-26 | 2011-11-24 | ダンマークス テクニスク ユニバーシテット | 複数の位相コントラストフィルタによる所望波面の生成 |
| EP2269765B1 (en) | 2003-07-18 | 2014-10-15 | Hamamatsu Photonics K.K. | Cut semiconductor chip |
| WO2005024516A2 (de) | 2003-08-14 | 2005-03-17 | Carl Zeiss Smt Ag | Beleuchtungseinrichtung für eine mikrolithographische projektionsbelichtungsanlage |
| JP2005104819A (ja) | 2003-09-10 | 2005-04-21 | Nippon Sheet Glass Co Ltd | 合せガラスの切断方法及び合せガラス切断装置 |
| US7408616B2 (en) | 2003-09-26 | 2008-08-05 | Carl Zeiss Smt Ag | Microlithographic exposure method as well as a projection exposure system for carrying out the method |
| US20050205778A1 (en) | 2003-10-17 | 2005-09-22 | Gsi Lumonics Corporation | Laser trim motion, calibration, imaging, and fixturing techniques |
| JP2005135964A (ja) * | 2003-10-28 | 2005-05-26 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
| JP2005138143A (ja) * | 2003-11-06 | 2005-06-02 | Disco Abrasive Syst Ltd | レーザ光線を利用する加工装置 |
| US7172067B2 (en) | 2003-11-10 | 2007-02-06 | Johnson Level & Tool Mfg. Co., Inc. | Level case with positioning indentations |
| JP2005144487A (ja) | 2003-11-13 | 2005-06-09 | Seiko Epson Corp | レーザ加工装置及びレーザ加工方法 |
| JP3962718B2 (ja) | 2003-12-01 | 2007-08-22 | キヤノン株式会社 | 情報処理装置及びその制御方法、プログラム |
| US7057709B2 (en) | 2003-12-04 | 2006-06-06 | International Business Machines Corporation | Printing a mask with maximum possible process window through adjustment of the source distribution |
| US20080190981A1 (en) | 2003-12-04 | 2008-08-14 | Yasutomo Okajima | Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate |
| JP2005179154A (ja) | 2003-12-22 | 2005-07-07 | Shibuya Kogyo Co Ltd | 脆性材料の割断方法およびその装置 |
| US7633033B2 (en) | 2004-01-09 | 2009-12-15 | General Lasertronics Corporation | Color sensing for laser decoating |
| US20070019179A1 (en) | 2004-01-16 | 2007-01-25 | Damian Fiolka | Polarization-modulating optical element |
| JP4951241B2 (ja) | 2004-01-16 | 2012-06-13 | 独立行政法人科学技術振興機構 | 微細加工方法 |
| US8270077B2 (en) | 2004-01-16 | 2012-09-18 | Carl Zeiss Smt Gmbh | Polarization-modulating optical element |
| CN1910522B (zh) | 2004-01-16 | 2010-05-26 | 卡尔蔡司Smt股份公司 | 偏振调制光学元件 |
| JP4074589B2 (ja) | 2004-01-22 | 2008-04-09 | Tdk株式会社 | レーザ加工装置及びレーザ加工方法 |
| TWI395068B (zh) | 2004-01-27 | 2013-05-01 | 尼康股份有限公司 | 光學系統、曝光裝置以及曝光方法 |
| JP2005219960A (ja) | 2004-02-05 | 2005-08-18 | Nishiyama Stainless Chem Kk | ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板、フラットパネルディスプレイ |
| WO2005084874A1 (ja) | 2004-03-05 | 2005-09-15 | Olympus Corporation | レーザ加工装置 |
| JP5074658B2 (ja) | 2004-03-15 | 2012-11-14 | キヤノン株式会社 | 最適化方法、最適化装置、及びプログラム |
| JP2005271563A (ja) * | 2004-03-26 | 2005-10-06 | Daitron Technology Co Ltd | 硬脆材料板体の分割加工方法及び装置 |
| US7486705B2 (en) * | 2004-03-31 | 2009-02-03 | Imra America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
| JP4418282B2 (ja) * | 2004-03-31 | 2010-02-17 | 株式会社レーザーシステム | レーザ加工方法 |
| US20050231651A1 (en) | 2004-04-14 | 2005-10-20 | Myers Timothy F | Scanning display system |
| US7187833B2 (en) | 2004-04-29 | 2007-03-06 | Corning Incorporated | Low attenuation large effective area optical fiber |
| KR100626554B1 (ko) | 2004-05-11 | 2006-09-21 | 주식회사 탑 엔지니어링 | 비금속재 절단장치 및 비금속재 절단시의 절단깊이 제어방법 |
| US7123348B2 (en) | 2004-06-08 | 2006-10-17 | Asml Netherlands B.V | Lithographic apparatus and method utilizing dose control |
| GB0412974D0 (en) | 2004-06-10 | 2004-07-14 | Syngenta Participations Ag | Method of applying active ingredients |
| JP4890746B2 (ja) * | 2004-06-14 | 2012-03-07 | 株式会社ディスコ | ウエーハの加工方法 |
| US7804043B2 (en) | 2004-06-15 | 2010-09-28 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| DE102005030543A1 (de) | 2004-07-08 | 2006-02-02 | Carl Zeiss Smt Ag | Polarisatoreinrichtung zur Erzeugung einer definierten Ortsverteilung von Polarisationszuständen |
| US7283209B2 (en) | 2004-07-09 | 2007-10-16 | Carl Zeiss Smt Ag | Illumination system for microlithography |
| US7231786B2 (en) | 2004-07-29 | 2007-06-19 | Corning Incorporated | Process and device for manufacturing glass sheet |
| US7259354B2 (en) | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| US7136227B2 (en) | 2004-08-06 | 2006-11-14 | Matsushita Electric Industrial Co., Ltd. | Fresnel zone plate based on elastic materials |
| JP4518078B2 (ja) | 2004-09-22 | 2010-08-04 | 株式会社ニコン | 照明装置、露光装置及びマイクロデバイスの製造方法 |
| JP3887394B2 (ja) | 2004-10-08 | 2007-02-28 | 芝浦メカトロニクス株式会社 | 脆性材料の割断加工システム及びその方法 |
| WO2006046525A1 (ja) | 2004-10-25 | 2006-05-04 | Mitsuboshi Diamond Industrial Co., Ltd. | クラック形成方法およびクラック形成装置 |
| JP4692717B2 (ja) * | 2004-11-02 | 2011-06-01 | 澁谷工業株式会社 | 脆性材料の割断装置 |
| JP4222296B2 (ja) | 2004-11-22 | 2009-02-12 | 住友電気工業株式会社 | レーザ加工方法とレーザ加工装置 |
| JP4564343B2 (ja) | 2004-11-24 | 2010-10-20 | 大日本印刷株式会社 | 導電材充填スルーホール基板の製造方法 |
| JP2006150385A (ja) | 2004-11-26 | 2006-06-15 | Canon Inc | レーザ割断方法 |
| US7201965B2 (en) | 2004-12-13 | 2007-04-10 | Corning Incorporated | Glass laminate substrate having enhanced impact and static loading resistance |
| KR101096733B1 (ko) | 2004-12-27 | 2011-12-21 | 엘지디스플레이 주식회사 | 기판의 절단장치 및 이를 이용한 기판의 절단방법 |
| KR101170587B1 (ko) | 2005-01-05 | 2012-08-01 | 티에이치케이 인텍스 가부시키가이샤 | 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치 |
| US7542013B2 (en) | 2005-01-31 | 2009-06-02 | Asml Holding N.V. | System and method for imaging enhancement via calculation of a customized optimal pupil field and illumination mode |
| EP1811547A4 (en) | 2005-02-03 | 2010-06-02 | Nikon Corp | OPTICAL INTEGRATOR, OPTICAL LIGHTING DEVICE, EXPOSURE DEVICE AND EXPOSURE METHOD |
| JP2006248885A (ja) | 2005-02-08 | 2006-09-21 | Takeji Arai | 超短パルスレーザによる石英の切断方法 |
| DE102005013783B4 (de) | 2005-03-22 | 2007-08-16 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung |
| US20070228616A1 (en) | 2005-05-11 | 2007-10-04 | Kyu-Yong Bang | Device and method for cutting nonmetalic substrate |
| US20060261118A1 (en) | 2005-05-17 | 2006-11-23 | Cox Judy K | Method and apparatus for separating a pane of brittle material from a moving ribbon of the material |
| JP4173151B2 (ja) | 2005-05-23 | 2008-10-29 | 株式会社椿本チエイン | コンベヤチェーン |
| US7402773B2 (en) * | 2005-05-24 | 2008-07-22 | Disco Corporation | Laser beam processing machine |
| DE102005042072A1 (de) | 2005-06-01 | 2006-12-14 | Forschungsverbund Berlin E.V. | Verfahren zur Erzeugung von vertikalen elektrischen Kontaktverbindungen in Halbleiterwafern |
| KR100915273B1 (ko) | 2005-06-01 | 2009-09-03 | 페톤 가부시끼가이샤 | 레이저 가공장치 및 레이저 가공방법 |
| JP2008544531A (ja) | 2005-06-21 | 2008-12-04 | カール ツァイス エスエムテー アーゲー | 瞳ファセットミラー上に減衰素子を備えた二重ファセット照明光学系 |
| JP4841873B2 (ja) | 2005-06-23 | 2011-12-21 | 大日本スクリーン製造株式会社 | 熱処理用サセプタおよび熱処理装置 |
| US7566914B2 (en) | 2005-07-07 | 2009-07-28 | Intersil Americas Inc. | Devices with adjustable dual-polarity trigger- and holding-voltage/current for high level of electrostatic discharge protection in sub-micron mixed signal CMOS/BiCMOS integrated circuits |
| JP4490883B2 (ja) | 2005-07-19 | 2010-06-30 | 株式会社レーザーシステム | レーザ加工装置およびレーザ加工方法 |
| US7934172B2 (en) | 2005-08-08 | 2011-04-26 | Micronic Laser Systems Ab | SLM lithography: printing to below K1=.30 without previous OPC processing |
| DE102005039833A1 (de) | 2005-08-22 | 2007-03-01 | Rowiak Gmbh | Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen |
| KR20070023958A (ko) | 2005-08-25 | 2007-03-02 | 삼성전자주식회사 | 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법 |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| US9138913B2 (en) * | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| US7626138B2 (en) | 2005-09-08 | 2009-12-01 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| US8118971B2 (en) | 2005-09-12 | 2012-02-21 | Nippon Sheet Glass Company, Limited | Interlayer film separation method |
| US20070068648A1 (en) * | 2005-09-28 | 2007-03-29 | Honeywell International, Inc. | Method for repairing die cast dies |
| KR100792593B1 (ko) * | 2005-10-12 | 2008-01-09 | 한국정보통신대학교 산학협력단 | 극초단 펄스 레이저를 이용한 단일 펄스 패턴 형성방법 및시스템 |
| US20070111119A1 (en) * | 2005-11-15 | 2007-05-17 | Honeywell International, Inc. | Method for repairing gas turbine engine compressor components |
| US7838331B2 (en) | 2005-11-16 | 2010-11-23 | Denso Corporation | Method for dicing semiconductor substrate |
| JP2007142000A (ja) | 2005-11-16 | 2007-06-07 | Denso Corp | レーザ加工装置およびレーザ加工方法 |
| JP4816390B2 (ja) * | 2005-11-16 | 2011-11-16 | 株式会社デンソー | 半導体チップの製造方法および半導体チップ |
| US20070111480A1 (en) | 2005-11-16 | 2007-05-17 | Denso Corporation | Wafer product and processing method therefor |
| KR100858983B1 (ko) | 2005-11-16 | 2008-09-17 | 가부시키가이샤 덴소 | 반도체 장치 및 반도체 기판 다이싱 방법 |
| US7977601B2 (en) | 2005-11-28 | 2011-07-12 | Electro Scientific Industries, Inc. | X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method |
| WO2007069516A1 (en) | 2005-12-16 | 2007-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device |
| GB0600022D0 (en) | 2006-01-03 | 2006-02-08 | Pilkington Plc | Glazings |
| JP4483793B2 (ja) | 2006-01-27 | 2010-06-16 | セイコーエプソン株式会社 | 微細構造体の製造方法及び製造装置 |
| US7418181B2 (en) | 2006-02-13 | 2008-08-26 | Adc Telecommunications, Inc. | Fiber optic splitter module |
| KR100985428B1 (ko) | 2006-02-15 | 2010-10-05 | 아사히 가라스 가부시키가이샤 | 유리 기판의 모따기 방법 및 장치 |
| US7535634B1 (en) | 2006-02-16 | 2009-05-19 | The United States Of America As Represented By The National Aeronautics And Space Administration | Optical device, system, and method of generating high angular momentum beams |
| JP4672689B2 (ja) | 2006-02-22 | 2011-04-20 | 日本板硝子株式会社 | レーザを用いたガラスの加工方法および加工装置 |
| WO2007096958A1 (ja) | 2006-02-22 | 2007-08-30 | Nippon Sheet Glass Company, Limited | レーザを用いたガラスの加工方法および加工装置 |
| WO2007096460A2 (en) | 2006-02-23 | 2007-08-30 | Picodeon Ltd Oy | Surface treatment technique and surface treatment apparatus associated with ablation technology |
| DE102006012034A1 (de) | 2006-03-14 | 2007-09-20 | Carl Zeiss Smt Ag | Optisches System, insbesondere in einer Beleuchtungseinrichtung einer Projektionsbelichtungsanlage |
| JP2007253203A (ja) | 2006-03-24 | 2007-10-04 | Sumitomo Electric Ind Ltd | レーザ加工用光学装置 |
| US20090050661A1 (en) | 2006-03-24 | 2009-02-26 | Youn-Ho Na | Glass Cutting Apparatus With Bending Member and Method Using Thereof |
| WO2007119740A1 (ja) | 2006-04-13 | 2007-10-25 | Toray Engineering Co., Ltd. | スクライブ方法、スクライブ装置、及びこの方法または装置を用いて割断した割断基板 |
| US7794904B2 (en) | 2006-04-24 | 2010-09-14 | Stc.Unm | Method and apparatus for producing interferometric lithography patterns with circular symmetry |
| US20070298529A1 (en) | 2006-05-31 | 2007-12-27 | Toyoda Gosei, Co., Ltd. | Semiconductor light-emitting device and method for separating semiconductor light-emitting devices |
| GB2439962B (en) | 2006-06-14 | 2008-09-24 | Exitech Ltd | Process and apparatus for laser scribing |
| US7897487B2 (en) | 2006-07-03 | 2011-03-01 | Hamamatsu Photonics K.K. | Laser processing method and chip |
| JP2008018547A (ja) | 2006-07-11 | 2008-01-31 | Seiko Epson Corp | 基体の製造方法、tft基板の製造方法、多層構造基板の製造方法、表示装置の製造方法 |
| DE102006035555A1 (de) | 2006-07-27 | 2008-01-31 | Eliog-Kelvitherm Industrieofenbau Gmbh | Anordnung und Verfahren zur Verformung von Glasscheiben |
| FR2904437B1 (fr) | 2006-07-28 | 2008-10-24 | Saint Gobain | Dispositif actif a proprietes energetiques/optiques variables |
| JP2008037943A (ja) | 2006-08-03 | 2008-02-21 | Nitto Denko Corp | 衝撃吸収粘着剤シートおよびその製造方法 |
| US8168514B2 (en) | 2006-08-24 | 2012-05-01 | Corning Incorporated | Laser separation of thin laminated glass substrates for flexible display applications |
| DE102007042047A1 (de) | 2006-09-06 | 2008-03-27 | Carl Zeiss Smt Ag | Teilsystem einer Beleuchtungseinrichtung einer mikrolithographischen Projektionsbelichtungsanlage |
| CN102489883B (zh) | 2006-09-19 | 2015-12-02 | 浜松光子学株式会社 | 激光加工方法和激光加工装置 |
| US7867907B2 (en) | 2006-10-17 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| DE102006051105B3 (de) * | 2006-10-25 | 2008-06-12 | Lpkf Laser & Electronics Ag | Vorrichtung zur Bearbeitung eines Werkstücks mittels Laserstrahlung |
| GB0622232D0 (en) | 2006-11-08 | 2006-12-20 | Rumsby Philip T | Method and apparatus for laser beam alignment for solar panel scribing |
| GB0623511D0 (en) | 2006-11-24 | 2007-01-03 | Council Cent Lab Res Councils | Raman detection of container contents |
| JP2008132616A (ja) | 2006-11-27 | 2008-06-12 | Shibuya Kogyo Co Ltd | 脆性材料の割断方法とその装置 |
| US8041127B2 (en) | 2006-11-30 | 2011-10-18 | Intuit Inc. | Method and system for obscuring and securing financial data in an online banking application |
| US8338744B2 (en) | 2006-11-30 | 2012-12-25 | Sumitomo Electric Industries, Ltd. | Condensing optical system, laser processing method and apparatus, and manufacturing method of brittle material blank |
| US20080158529A1 (en) | 2006-12-28 | 2008-07-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| AT504726A1 (de) | 2007-01-05 | 2008-07-15 | Lisec Maschb Gmbh | Verfahren und vorrichtung zum herstellen eines trennspalts in einer glasscheibe |
| US8952832B2 (en) | 2008-01-18 | 2015-02-10 | Invensense, Inc. | Interfacing application programs and motion sensors of a device |
| JP2008168327A (ja) | 2007-01-15 | 2008-07-24 | Shinko Seisakusho:Kk | レーザ切断装置 |
| CN103345128B (zh) | 2007-02-06 | 2017-04-12 | 卡尔蔡司Smt有限责任公司 | 微光刻投射曝光设备的照明系统 |
| JP5318748B2 (ja) | 2007-02-22 | 2013-10-16 | 日本板硝子株式会社 | 陽極接合用ガラス |
| CN101622722B (zh) | 2007-02-27 | 2012-11-21 | 卡尔蔡司激光器材有限责任公司 | 连续涂覆设备、生产晶态薄膜和太阳电池的方法 |
| TWI394731B (zh) | 2007-03-02 | 2013-05-01 | Nippon Electric Glass Co | 強化板玻璃及其製造方法 |
| ITMI20070528A1 (it) | 2007-03-16 | 2008-09-17 | Piaggio & C Spa | Sistema di propulsione e di trasmissione ibrida per motoveicoli |
| US9250536B2 (en) | 2007-03-30 | 2016-02-02 | Asml Netherlands B.V. | Lithographic apparatus and method |
| US8937706B2 (en) | 2007-03-30 | 2015-01-20 | Asml Netherlands B.V. | Lithographic apparatus and method |
| WO2008119794A1 (en) | 2007-04-03 | 2008-10-09 | Carl Zeiss Smt Ag | Optical system, in particular illumination device or projection objective of a microlithographic projection exposure apparatus |
| JP5784273B2 (ja) | 2007-04-05 | 2015-09-24 | チャーム エンジニアリング株式会社 | レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法 |
| FR2914751B1 (fr) | 2007-04-06 | 2009-07-03 | Draka Comteq France | Fibre optique monomode |
| EP1983154B1 (en) | 2007-04-17 | 2013-12-25 | Services Pétroliers Schlumberger | In-situ correction of triaxial accelerometer and magnetometer measurements made in a well |
| JP4863168B2 (ja) | 2007-04-17 | 2012-01-25 | 日本電気硝子株式会社 | フラットパネルディスプレイ用ガラス基板およびその製造方法 |
| DE102007018674A1 (de) | 2007-04-18 | 2008-10-23 | Lzh Laserzentrum Hannover E.V. | Verfahren zum Bilden von Durchgangslöchern in Bauteilen aus Glas |
| JP2008288577A (ja) | 2007-04-18 | 2008-11-27 | Fujikura Ltd | 基板の処理方法、貫通配線基板及びその製造方法、並びに電子部品 |
| WO2008136918A2 (en) | 2007-05-07 | 2008-11-13 | Corning Incorporated | Large effective area fiber |
| US8236116B2 (en) | 2007-06-06 | 2012-08-07 | Centre Luxembourgeois De Recherches Pour Le Verre Et Al Ceramique S.A. (C.R.V.C.) | Method of making coated glass article, and intermediate product used in same |
| US8374472B2 (en) | 2007-06-15 | 2013-02-12 | Ofs Fitel, Llc | Bend insensitivity in single mode optical fibers |
| US8076605B2 (en) | 2007-06-25 | 2011-12-13 | Electro Scientific Industries, Inc. | Systems and methods for adapting parameters to increase throughput during laser-based wafer processing |
| DE112008001873A5 (de) | 2007-07-21 | 2010-06-10 | Du, Keming, Dr. | Optische Anordnung zur Erzeugung von Multistrahlen |
| US8169587B2 (en) | 2007-08-16 | 2012-05-01 | Apple Inc. | Methods and systems for strengthening LCD modules |
| JP2009056482A (ja) | 2007-08-31 | 2009-03-19 | Seiko Epson Corp | 基板分割方法、及び表示装置の製造方法 |
| JP5113462B2 (ja) | 2007-09-12 | 2013-01-09 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の面取り方法 |
| US20100276505A1 (en) | 2007-09-26 | 2010-11-04 | Roger Earl Smith | Drilling in stretched substrates |
| JP2009084089A (ja) | 2007-09-28 | 2009-04-23 | Omron Laserfront Inc | ガラス切断装置及び方法 |
| DE102008041593A1 (de) | 2007-10-09 | 2009-04-16 | Carl Zeiss Smt Ag | Beleuchtungsoptik für die Mikrolithographie |
| CN101610870B (zh) | 2007-10-16 | 2013-09-11 | 三星钻石工业股份有限公司 | 脆性材料基板的u形槽加工方法以及使用该方法的去除加工方法、打孔加工方法和倒角方法 |
| JP5326259B2 (ja) | 2007-11-08 | 2013-10-30 | 株式会社ニコン | 照明光学装置、露光装置、およびデバイス製造方法 |
| DE102007055567A1 (de) | 2007-11-20 | 2009-05-28 | Carl Zeiss Smt Ag | Optisches System |
| KR100949152B1 (ko) | 2007-11-23 | 2010-03-25 | 삼성코닝정밀유리 주식회사 | 유리 기판 레이저 절단 장치 |
| JP4710897B2 (ja) | 2007-11-28 | 2011-06-29 | セイコーエプソン株式会社 | 接合体の剥離方法 |
| KR20090057161A (ko) | 2007-12-01 | 2009-06-04 | 주식회사 이엔팩 | 초발수성 좌변기 시트 |
| JP2009142886A (ja) | 2007-12-18 | 2009-07-02 | Agt:Kk | レーザー穴開け加工方法 |
| CN101462822B (zh) | 2007-12-21 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | 具有通孔的脆性非金属工件及其加工方法 |
| EP2237218A4 (en) | 2007-12-25 | 2016-03-23 | Nec Corp | Image Processing Device, Image Processing Method, Image Decomposition Device, Image Compilation Device, Image Transmission System, and Storage Media |
| US7842583B2 (en) | 2007-12-27 | 2010-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
| US20090183764A1 (en) | 2008-01-18 | 2009-07-23 | Tenksolar, Inc | Detachable Louver System |
| JP5098665B2 (ja) * | 2008-01-23 | 2012-12-12 | 株式会社東京精密 | レーザー加工装置およびレーザー加工方法 |
| JP2009178725A (ja) | 2008-01-29 | 2009-08-13 | Sunx Ltd | レーザ加工装置及びレーザ加工方法 |
| KR101303542B1 (ko) | 2008-02-11 | 2013-09-03 | 엘지디스플레이 주식회사 | 평판표시패널 절단장치 |
| GB0802944D0 (en) | 2008-02-19 | 2008-03-26 | Rumsby Philip T | Apparatus for laser processing the opposite sides of thin panels |
| PL2285521T3 (pl) | 2008-02-20 | 2019-12-31 | Lasercoil Technologies, Llc | Postępowe laserowe urządzenie wykrawające do cięcia z wysoką prędkością |
| WO2009114372A2 (en) | 2008-03-13 | 2009-09-17 | Honeywell International Inc. | Thermal interconnect and integrated interface systems, methods of production and uses thereof |
| JP5826027B2 (ja) | 2008-03-21 | 2015-12-02 | イムラ アメリカ インコーポレイテッド | レーザベースの材料加工方法及びシステム |
| JP5333816B2 (ja) | 2008-03-26 | 2013-11-06 | 旭硝子株式会社 | ガラス板の切線加工装置及び切線加工方法 |
| US8237080B2 (en) | 2008-03-27 | 2012-08-07 | Electro Scientific Industries, Inc | Method and apparatus for laser drilling holes with Gaussian pulses |
| JP5345334B2 (ja) | 2008-04-08 | 2013-11-20 | 株式会社レミ | 脆性材料の熱応力割断方法 |
| JP5274085B2 (ja) | 2008-04-09 | 2013-08-28 | 株式会社アルバック | レーザー加工装置、レーザービームのピッチ可変方法、及びレーザー加工方法 |
| US8358888B2 (en) | 2008-04-10 | 2013-01-22 | Ofs Fitel, Llc | Systems and techniques for generating Bessel beams |
| JP2009255114A (ja) | 2008-04-15 | 2009-11-05 | Linkstar Japan Co Ltd | 脆性材料基板の加工装置および切断方法 |
| US8035901B2 (en) | 2008-04-30 | 2011-10-11 | Corning Incorporated | Laser scoring with curved trajectory |
| JP5539625B2 (ja) | 2008-05-08 | 2014-07-02 | ミヤチテクノス株式会社 | レーザ加工方法 |
| EP2119512B1 (en) | 2008-05-14 | 2017-08-09 | Gerresheimer Glas GmbH | Method and device for removing contaminating particles from containers on automatic production system |
| US8061128B2 (en) | 2008-05-15 | 2011-11-22 | Ford Global Technologies, Llc | Diesel particulate filter overstress mitigation |
| US8053704B2 (en) | 2008-05-27 | 2011-11-08 | Corning Incorporated | Scoring of non-flat materials |
| GB2460648A (en) | 2008-06-03 | 2009-12-09 | M Solv Ltd | Method and apparatus for laser focal spot size control |
| JP2009297734A (ja) | 2008-06-11 | 2009-12-24 | Nitto Denko Corp | レーザー加工用粘着シート及びレーザー加工方法 |
| US8514476B2 (en) | 2008-06-25 | 2013-08-20 | View, Inc. | Multi-pane dynamic window and method for making same |
| US8268913B2 (en) | 2008-06-30 | 2012-09-18 | Fina Technology, Inc. | Polymeric blends and methods of using same |
| US7810355B2 (en) | 2008-06-30 | 2010-10-12 | Apple Inc. | Full perimeter chemical strengthening of substrates |
| KR101602373B1 (ko) | 2008-07-11 | 2016-03-21 | 에이에스엠엘 네델란즈 비.브이. | 스펙트럼 퓨리티 필터, 방사선 소스, 리소그래피 장치, 및 디바이스 제조 방법 |
| JP2010017990A (ja) | 2008-07-14 | 2010-01-28 | Seiko Epson Corp | 基板分割方法 |
| US7773848B2 (en) | 2008-07-30 | 2010-08-10 | Corning Incorporated | Low bend loss single mode optical fiber |
| TWI484563B (zh) | 2008-08-01 | 2015-05-11 | Moohan Co Ltd | 薄膜電晶體之製造方法與設備 |
| KR101499651B1 (ko) | 2008-08-01 | 2015-03-06 | 주식회사 무한 | 박막 트랜지스터 어레이 기판의 제조방법 및 제조장치 |
| JP5071868B2 (ja) | 2008-08-11 | 2012-11-14 | オムロン株式会社 | レーザ加工方法、レーザ加工装置、光学素子の製造方法、および光学素子 |
| TW201009525A (en) | 2008-08-18 | 2010-03-01 | Ind Tech Res Inst | Laser marking method and laser marking system |
| JP5155774B2 (ja) | 2008-08-21 | 2013-03-06 | 株式会社ノリタケカンパニーリミテド | プラトー面加工用レジノイド超砥粒砥石ホイール |
| JP2010075991A (ja) | 2008-09-29 | 2010-04-08 | Fujifilm Corp | レーザ加工装置 |
| JP5435267B2 (ja) | 2008-10-01 | 2014-03-05 | 日本電気硝子株式会社 | ガラスロール、ガラスロールの製造装置、及びガラスロールの製造方法 |
| US8123515B2 (en) | 2008-10-02 | 2012-02-28 | Robert Frank Schleelein | System and method for producing composite materials with variable shapes |
| US7869210B2 (en) | 2008-10-08 | 2011-01-11 | Dell Products L.P. | Temperature control for an information handling system rack |
| JP5297139B2 (ja) | 2008-10-09 | 2013-09-25 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| US8895892B2 (en) | 2008-10-23 | 2014-11-25 | Corning Incorporated | Non-contact glass shearing device and method for scribing or cutting a moving glass sheet |
| US8092739B2 (en) | 2008-11-25 | 2012-01-10 | Wisconsin Alumni Research Foundation | Retro-percussive technique for creating nanoscale holes |
| US8131494B2 (en) | 2008-12-04 | 2012-03-06 | Baker Hughes Incorporated | Rotatable orientation independent gravity sensor and methods for correcting systematic errors |
| JP2010134328A (ja) | 2008-12-08 | 2010-06-17 | Disco Abrasive Syst Ltd | 偏光素子およびレーザーユニット |
| AU2009326846A1 (en) | 2008-12-08 | 2011-06-30 | University Of South Australia | Formation of nanoporous materials |
| US20110240476A1 (en) | 2008-12-17 | 2011-10-06 | Ding Wang | Fabrication of conductive nanostructures on a flexible substrate |
| US9346130B2 (en) | 2008-12-17 | 2016-05-24 | Electro Scientific Industries, Inc. | Method for laser processing glass with a chamfered edge |
| EP2202545A1 (en) | 2008-12-23 | 2010-06-30 | Karlsruher Institut für Technologie | Beam transformation module with an axicon in a double-pass mode |
| KR101020621B1 (ko) | 2009-01-15 | 2011-03-09 | 연세대학교 산학협력단 | 광섬유를 이용하는 광소자 제조 방법, 광섬유를 이용하는 광소자 및 이를 이용한 광 트위저 |
| KR20110121605A (ko) | 2009-02-02 | 2011-11-07 | 아사히 가라스 가부시키가이샤 | 반도체 디바이스 부재용 유리 기판 및 반도체 디바이스 부재용 유리 기판의 제조 방법 |
| CN102307699B (zh) * | 2009-02-09 | 2015-07-15 | 浜松光子学株式会社 | 加工对象物的切断方法 |
| US8347651B2 (en) | 2009-02-19 | 2013-01-08 | Corning Incorporated | Method of separating strengthened glass |
| US8341976B2 (en) | 2009-02-19 | 2013-01-01 | Corning Incorporated | Method of separating strengthened glass |
| US8327666B2 (en) | 2009-02-19 | 2012-12-11 | Corning Incorporated | Method of separating strengthened glass |
| US8245540B2 (en) | 2009-02-24 | 2012-08-21 | Corning Incorporated | Method for scoring a sheet of brittle material |
| CN102326232B (zh) | 2009-02-25 | 2016-01-20 | 日亚化学工业株式会社 | 半导体元件的制造方法 |
| US8218929B2 (en) | 2009-02-26 | 2012-07-10 | Corning Incorporated | Large effective area low attenuation optical fiber |
| CN201357287Y (zh) | 2009-03-06 | 2009-12-09 | 苏州德龙激光有限公司 | 新型皮秒激光加工装置 |
| CN101502914A (zh) | 2009-03-06 | 2009-08-12 | 苏州德龙激光有限公司 | 用于喷油嘴微孔加工的皮秒激光加工装置 |
| JP5300544B2 (ja) | 2009-03-17 | 2013-09-25 | 株式会社ディスコ | 光学系及びレーザ加工装置 |
| KR101041140B1 (ko) | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 기판 절단 방법 |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| US9723723B2 (en) | 2009-03-31 | 2017-08-01 | View, Inc. | Temperable electrochromic devices |
| CN102378664B (zh) | 2009-04-07 | 2015-07-01 | 通快公司 | 具有利用射束的切割头和联接到移动切割头的移动单元的抽吸管的切割机 |
| KR200448519Y1 (ko) | 2009-04-28 | 2010-04-21 | 남동진 | 돌출형 ⅰc 패키지용 방열판 |
| US20100279067A1 (en) | 2009-04-30 | 2010-11-04 | Robert Sabia | Glass sheet having enhanced edge strength |
| WO2010129459A2 (en) | 2009-05-06 | 2010-11-11 | Corning Incorporated | Carrier for glass substrates |
| EP2251310B1 (en) | 2009-05-13 | 2012-03-28 | Corning Incorporated | Methods and systems for forming continuous glass sheets |
| US8539795B2 (en) | 2009-05-13 | 2013-09-24 | Corning Incorporated | Methods for cutting a fragile material |
| US8132427B2 (en) | 2009-05-15 | 2012-03-13 | Corning Incorporated | Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet |
| US8269138B2 (en) | 2009-05-21 | 2012-09-18 | Corning Incorporated | Method for separating a sheet of brittle material |
| JP5340806B2 (ja) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | 半導体ウエーハのレーザ加工方法 |
| US8194170B2 (en) | 2009-06-02 | 2012-06-05 | Algonquin College | Axicon lens array |
| DE102009023602B4 (de) | 2009-06-02 | 2012-08-16 | Grenzebach Maschinenbau Gmbh | Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl |
| JP5525601B2 (ja) | 2009-06-04 | 2014-06-18 | コアレイズ オーワイ | レーザを用いた基板加工方法 |
| US20100332087A1 (en) | 2009-06-24 | 2010-12-30 | Mark Robert Claffee | Remote Vehicle Controller |
| JP5416492B2 (ja) | 2009-06-30 | 2014-02-12 | 三星ダイヤモンド工業株式会社 | レーザ光によるガラス基板加工装置 |
| TWI395630B (zh) | 2009-06-30 | 2013-05-11 | Mitsuboshi Diamond Ind Co Ltd | 使用雷射光之玻璃基板加工裝置 |
| US8592716B2 (en) | 2009-07-22 | 2013-11-26 | Corning Incorporated | Methods and apparatus for initiating scoring |
| CN101637849B (zh) | 2009-08-07 | 2011-12-07 | 苏州德龙激光有限公司 | 皮秒激光加工设备的高精度z轴载物平台 |
| CN201471092U (zh) | 2009-08-07 | 2010-05-19 | 苏州德龙激光有限公司 | 皮秒激光加工设备的高精度z轴载物平台 |
| JP5500914B2 (ja) | 2009-08-27 | 2014-05-21 | 株式会社半導体エネルギー研究所 | レーザ照射装置 |
| JP2013503105A (ja) | 2009-08-28 | 2013-01-31 | コーニング インコーポレイテッド | 化学強化ガラス基板からガラス品をレーザ割断するための方法 |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| KR101094284B1 (ko) * | 2009-09-02 | 2011-12-19 | 삼성모바일디스플레이주식회사 | 기판 절단 장치 및 이를 이용한 기판 절단 방법 |
| EP2470325A4 (en) | 2009-09-24 | 2017-07-05 | Electro Scientific Industries, Inc. | Method and apparatus to scribe a line in a thin film material using a burst of laser pulses with beneficial pulse shape |
| JP2011079690A (ja) | 2009-10-06 | 2011-04-21 | Leo:Kk | 回折格子を用いた厚板ガラスのレーザ熱応力割断 |
| US20110088324A1 (en) | 2009-10-20 | 2011-04-21 | Wessel Robert B | Apparatus and method for solar heat gain reduction in a window assembly |
| US20110094267A1 (en) | 2009-10-28 | 2011-04-28 | Kenneth William Aniolek | Methods of producing glass sheets |
| JP5715639B2 (ja) | 2009-11-03 | 2015-05-13 | コーニング インコーポレイテッド | 変動速度を有する移動ガラスリボンのレーザスコーリング |
| US8623496B2 (en) | 2009-11-06 | 2014-01-07 | Wisconsin Alumni Research Foundation | Laser drilling technique for creating nanoscale holes |
| NL2005331A (en) | 2009-11-18 | 2011-05-19 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| US20120234807A1 (en) | 2009-12-07 | 2012-09-20 | J.P. Sercel Associates Inc. | Laser scribing with extended depth affectation into a workplace |
| US8338745B2 (en) | 2009-12-07 | 2012-12-25 | Panasonic Corporation | Apparatus and methods for drilling holes with no taper or reverse taper |
| EP2336823A1 (de) | 2009-12-18 | 2011-06-22 | Boegli-Gravures S.A. | Verfahren und Vorrichtung zur Herstellung von Masken für eine Laseranlage zur Erzeugung von Mikrostrukturen. |
| WO2011076500A1 (en) | 2009-12-23 | 2011-06-30 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| WO2011082065A2 (en) * | 2009-12-30 | 2011-07-07 | Gsi Group Corporation | Link processing with high speed beam deflection |
| US9042422B2 (en) | 2009-12-30 | 2015-05-26 | National University Corporation Chiba University | Tunable external resonator laser |
| JP5405324B2 (ja) | 2010-01-04 | 2014-02-05 | 富士フイルム株式会社 | 撮像レンズおよび撮像装置 |
| JP5461205B2 (ja) | 2010-01-19 | 2014-04-02 | 日立造船株式会社 | レーザ加工方法とその装置 |
| TWI438162B (zh) | 2010-01-27 | 2014-05-21 | Wintek Corp | 強化玻璃切割方法及強化玻璃切割預置結構 |
| US9234760B2 (en) | 2010-01-29 | 2016-01-12 | Blackberry Limited | Portable mobile transceiver for GPS navigation and vehicle data input for dead reckoning mode |
| ITMO20100020A1 (it) | 2010-02-02 | 2011-08-03 | Keraglass Engineering S R L | Dispositivo per la pulizia di rulli. |
| US9086509B2 (en) | 2010-02-25 | 2015-07-21 | The United States Of America As Represented By The Secretary, Department Of Health And Human Services | Azicon beam polarization devices |
| US8743165B2 (en) | 2010-03-05 | 2014-06-03 | Micronic Laser Systems Ab | Methods and device for laser processing |
| JP5249979B2 (ja) | 2010-03-18 | 2013-07-31 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法およびこれに用いるレーザ加工装置 |
| KR101842421B1 (ko) | 2010-03-24 | 2018-05-14 | 리모 게엠베하 | 레이저 광선 제공 장치 및 선형 배광 재생 장치 |
| US20110238308A1 (en) | 2010-03-26 | 2011-09-29 | Isaac Thomas Miller | Pedal navigation using leo signals and body-mounted sensors |
| US8654538B2 (en) | 2010-03-30 | 2014-02-18 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
| CN102905839B (zh) | 2010-03-30 | 2016-03-09 | Imra美国公司 | 基于激光的材料加工装置和方法 |
| TWI433745B (zh) | 2010-04-16 | 2014-04-11 | Qmc Co Ltd | 雷射加工方法及雷射加工設備 |
| JP2013144613A (ja) | 2010-04-20 | 2013-07-25 | Asahi Glass Co Ltd | 半導体デバイス貫通電極形成用のガラス基板の製造方法 |
| CN102844857A (zh) | 2010-04-20 | 2012-12-26 | 旭硝子株式会社 | 半导体器件贯通电极用的玻璃基板 |
| US8821211B2 (en) | 2010-04-21 | 2014-09-02 | Lg Chem, Ltd. | Device for cutting of glass sheet |
| DE202010006047U1 (de) | 2010-04-22 | 2010-07-22 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Strahlformungseinheit zur Fokussierung eines Laserstrahls |
| KR100984727B1 (ko) | 2010-04-30 | 2010-10-01 | 유병소 | 대상물 가공 방법 및 대상물 가공 장치 |
| US8245539B2 (en) | 2010-05-13 | 2012-08-21 | Corning Incorporated | Methods of producing glass sheets |
| KR20130079395A (ko) | 2010-05-19 | 2013-07-10 | 미쓰비시 가가꾸 가부시키가이샤 | 카드용 시트 및 카드 |
| JP5488907B2 (ja) | 2010-05-20 | 2014-05-14 | 日本電気硝子株式会社 | ガラスフィルムの回収装置及び回収方法 |
| CA2800150C (en) | 2010-05-21 | 2018-09-04 | Novartis Ag | Influenza virus reassortment method |
| GB2481190B (en) | 2010-06-04 | 2015-01-14 | Plastic Logic Ltd | Laser ablation |
| SG186384A1 (en) | 2010-06-29 | 2013-01-30 | Corning Inc | Multi-layer glass sheet made by co-drawing using the overflow downdraw fusion process |
| DE102010025965A1 (de) | 2010-07-02 | 2012-01-05 | Schott Ag | Verfahren zur spannungsarmen Herstellung von gelochten Werkstücken |
| DE102010025966B4 (de) | 2010-07-02 | 2012-03-08 | Schott Ag | Interposer und Verfahren zum Herstellen von Löchern in einem Interposer |
| DE102010025967B4 (de) | 2010-07-02 | 2015-12-10 | Schott Ag | Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer |
| DE202010013161U1 (de) | 2010-07-08 | 2011-03-31 | Oerlikon Solar Ag, Trübbach | Laserbearbeitung mit mehreren Strahlen und dafür geeigneter Laseroptikkopf |
| JP5772827B2 (ja) | 2010-07-12 | 2015-09-02 | 旭硝子株式会社 | インプリントモールド用TiO2含有石英ガラス基材およびその製造方法 |
| WO2012006736A2 (en) | 2010-07-12 | 2012-01-19 | Filaser Inc. | Method of material processing by laser filamentation |
| FR2962818B1 (fr) | 2010-07-13 | 2013-03-08 | Saint Gobain | Dispositif electrochimique a proprietes de transmission optique et/ou energetique electrocommandables. |
| KR20120015366A (ko) | 2010-07-19 | 2012-02-21 | 엘지디스플레이 주식회사 | 강화유리 절단방법 및 절단장치 |
| JP5580129B2 (ja) | 2010-07-20 | 2014-08-27 | 株式会社アマダ | 固体レーザ加工装置 |
| JP2012024983A (ja) | 2010-07-21 | 2012-02-09 | Shibuya Kogyo Co Ltd | 脆性材料の面取り方法とその装置 |
| JP5669001B2 (ja) | 2010-07-22 | 2015-02-12 | 日本電気硝子株式会社 | ガラスフィルムの割断方法、ガラスロールの製造方法、及びガラスフィルムの割断装置 |
| US8741777B2 (en) | 2010-07-26 | 2014-06-03 | Hamamatsu Photonics K.K. | Substrate processing method |
| US8828260B2 (en) | 2010-07-26 | 2014-09-09 | Hamamatsu Photonics K.K. | Substrate processing method |
| JP2012031018A (ja) | 2010-07-30 | 2012-02-16 | Asahi Glass Co Ltd | 強化ガラス基板及び強化ガラス基板の溝加工方法と強化ガラス基板の切断方法 |
| US8604380B2 (en) | 2010-08-19 | 2013-12-10 | Electro Scientific Industries, Inc. | Method and apparatus for optimally laser marking articles |
| US8584354B2 (en) | 2010-08-26 | 2013-11-19 | Corning Incorporated | Method for making glass interposer panels |
| US8720228B2 (en) | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
| TWI402228B (zh) | 2010-09-15 | 2013-07-21 | Wintek Corp | 強化玻璃切割方法、強化玻璃薄膜製程、強化玻璃切割預置結構及強化玻璃切割件 |
| TWI576320B (zh) | 2010-10-29 | 2017-04-01 | 康寧公司 | 用於裁切玻璃帶之方法與設備 |
| WO2012061304A1 (en) | 2010-11-02 | 2012-05-10 | Georgia Tech Research Corporation | Ultra-thin interposer assemblies with through vias |
| US8164818B2 (en) | 2010-11-08 | 2012-04-24 | Soladigm, Inc. | Electrochromic window fabrication methods |
| US9958750B2 (en) | 2010-11-08 | 2018-05-01 | View, Inc. | Electrochromic window fabrication methods |
| JP5617556B2 (ja) | 2010-11-22 | 2014-11-05 | 日本電気硝子株式会社 | 帯状ガラスフィルム割断装置及び帯状ガラスフィルム割断方法 |
| JP2012119098A (ja) | 2010-11-29 | 2012-06-21 | Gigaphoton Inc | 光学装置、レーザ装置および極端紫外光生成装置 |
| US8616024B2 (en) | 2010-11-30 | 2013-12-31 | Corning Incorporated | Methods for forming grooves and separating strengthened glass substrate sheets |
| EP2646384B1 (en) | 2010-11-30 | 2019-03-27 | Corning Incorporated | Methods of forming high-density arrays of holes in glass |
| US8607590B2 (en) | 2010-11-30 | 2013-12-17 | Corning Incorporated | Methods for separating glass articles from strengthened glass substrate sheets |
| EP2457881B1 (en) | 2010-11-30 | 2019-05-08 | Corning Incorporated | Method and apparatus for bending a sheet of material into a shaped article |
| EP2649490B1 (en) | 2010-12-08 | 2018-07-11 | View, Inc. | Improved spacers for insulated glass units |
| TW201226345A (en) | 2010-12-27 | 2012-07-01 | Liefco Optical Inc | Method of cutting tempered glass |
| KR101298019B1 (ko) | 2010-12-28 | 2013-08-26 | (주)큐엠씨 | 레이저 가공 장치 |
| WO2012093471A1 (ja) | 2011-01-05 | 2012-07-12 | Kondo Kiyoyuki | ビーム加工装置 |
| WO2012096053A1 (ja) | 2011-01-11 | 2012-07-19 | 旭硝子株式会社 | 強化ガラス板の切断方法 |
| CN102248302A (zh) | 2011-01-13 | 2011-11-23 | 苏州德龙激光有限公司 | 超短脉冲激光异形切割钢化玻璃的装置及其方法 |
| US8475507B2 (en) | 2011-02-01 | 2013-07-02 | Solta Medical, Inc. | Handheld apparatus for use by a non-physician consumer to fractionally resurface the skin of the consumer |
| US8539794B2 (en) | 2011-02-01 | 2013-09-24 | Corning Incorporated | Strengthened glass substrate sheets and methods for fabricating glass panels from glass substrate sheets |
| JP2012159749A (ja) | 2011-02-01 | 2012-08-23 | Nichia Chem Ind Ltd | ベッセルビーム発生装置 |
| JP5906198B2 (ja) * | 2011-02-08 | 2016-04-20 | 株式会社フジクラ | 微細孔を有する基体の製造方法、及び基体 |
| US8933367B2 (en) | 2011-02-09 | 2015-01-13 | Sumitomo Electric Industries, Ltd. | Laser processing method |
| WO2012108052A1 (ja) * | 2011-02-10 | 2012-08-16 | 信越ポリマー株式会社 | 単結晶基板製造方法および内部改質層形成単結晶部材 |
| JP5875121B2 (ja) | 2011-02-10 | 2016-03-02 | 信越ポリマー株式会社 | 単結晶基板の製造方法および内部改質層形成単結晶部材の製造方法 |
| DE102011000768B4 (de) | 2011-02-16 | 2016-08-18 | Ewag Ag | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung |
| JP5649592B2 (ja) | 2011-02-17 | 2015-01-07 | Hoya株式会社 | 携帯電子機器用カバーガラスのガラス基板の製造方法、携帯電子機器用カバーガラスのガラス基板および携帯電子機器 |
| US8584490B2 (en) | 2011-02-18 | 2013-11-19 | Corning Incorporated | Laser cutting method |
| JP5193326B2 (ja) | 2011-02-25 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | 基板加工装置および基板加工方法 |
| US8776547B2 (en) | 2011-02-28 | 2014-07-15 | Corning Incorporated | Local strengthening of glass by ion exchange |
| JP2012187618A (ja) | 2011-03-11 | 2012-10-04 | V Technology Co Ltd | ガラス基板のレーザ加工装置 |
| NL2006418C2 (nl) | 2011-03-18 | 2012-09-19 | Rexnord Flattop Europe Bv | Transportsysteem, alsmede gebruik van een ten opzichte van een kunststof module binnenwaarts reikende kamer in een transportsysteem. |
| KR101927543B1 (ko) | 2011-03-31 | 2018-12-10 | 아반스트레이트 가부시키가이샤 | 유리판의 제조 방법 |
| WO2012138009A1 (ko) | 2011-04-07 | 2012-10-11 | (주)네톰 | 무선인식 태그 및 이를 구비한 전자제품 피씨비 및 전자제품 관리 시스템 |
| US8857215B2 (en) | 2011-05-18 | 2014-10-14 | Corning Incorporated | Apparatus and method for heat treating glass sheets |
| US8986072B2 (en) | 2011-05-26 | 2015-03-24 | Corning Incorporated | Methods of finishing an edge of a glass sheet |
| WO2012164649A1 (ja) | 2011-05-27 | 2012-12-06 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| TWI547454B (zh) | 2011-05-31 | 2016-09-01 | 康寧公司 | 於玻璃中高速製造微孔洞的方法 |
| KR20140024919A (ko) | 2011-06-15 | 2014-03-03 | 아사히 가라스 가부시키가이샤 | 유리판의 절단 방법 |
| JP2013007842A (ja) | 2011-06-23 | 2013-01-10 | Toyo Seikan Kaisha Ltd | 構造体形成装置、構造体形成方法及び構造体 |
| JP5765421B2 (ja) | 2011-06-28 | 2015-08-19 | 株式会社Ihi | 脆性的な部材を切断する装置、方法、および切断された脆性的な部材 |
| TWI572480B (zh) | 2011-07-25 | 2017-03-01 | 康寧公司 | 經層壓及離子交換之強化玻璃疊層 |
| DE112012003162T5 (de) | 2011-07-29 | 2014-04-17 | Ats Automation Tooling Systems Inc. | Systeme und Verfahren zum Herstellen dünner Siliziumstäbe |
| KR101120471B1 (ko) | 2011-08-05 | 2012-03-05 | (주)지엘코어 | 다중 초점 방식의 펄스 레이저를 이용한 취성 재료 절단 장치 |
| JP5729873B2 (ja) | 2011-08-05 | 2015-06-03 | 株式会社マキタ | 集塵装置 |
| US8635887B2 (en) | 2011-08-10 | 2014-01-28 | Corning Incorporated | Methods for separating glass substrate sheets by laser-formed grooves |
| JP2013043808A (ja) | 2011-08-25 | 2013-03-04 | Asahi Glass Co Ltd | 強化ガラス板切断用保持具及び強化ガラス板の切断方法 |
| DE112012003605T5 (de) | 2011-08-29 | 2014-06-12 | Asahi Glass Co., Ltd. | Verfahren zum Schneiden einer Glasplatte mit erhöhter Festigkeit und Vorrichtung zum Schneiden einer Glasplatte mit erhöhter Festigkeit |
| US20130047671A1 (en) | 2011-08-29 | 2013-02-28 | Jeffrey T. Kohli | Apparatus and method for forming glass sheets |
| CN103764579A (zh) | 2011-08-31 | 2014-04-30 | 旭硝子株式会社 | 强化玻璃板的切断方法及强化玻璃板切断装置 |
| PH12012000258A1 (en) | 2011-09-09 | 2015-06-01 | Hoya Corp | Method of manufacturing an ion-exchanged glass article |
| WO2013039230A1 (ja) | 2011-09-15 | 2013-03-21 | 日本電気硝子株式会社 | ガラス板切断方法 |
| JP5861864B2 (ja) | 2011-09-15 | 2016-02-16 | 日本電気硝子株式会社 | ガラス板切断方法およびガラス板切断装置 |
| US9422184B2 (en) | 2011-09-15 | 2016-08-23 | Nippon Electric Glass Co., Ltd. | Cutting method for glass sheet and glass sheet cutting apparatus |
| JP6063670B2 (ja) | 2011-09-16 | 2017-01-18 | 株式会社アマダホールディングス | レーザ切断加工方法及び装置 |
| US10239160B2 (en) * | 2011-09-21 | 2019-03-26 | Coherent, Inc. | Systems and processes that singulate materials |
| US8687932B2 (en) | 2011-09-21 | 2014-04-01 | Ofs Fitel, Llc | Optimized ultra large area optical fibers |
| US8768129B2 (en) | 2011-09-21 | 2014-07-01 | Ofs Fitel, Llc | Optimized ultra large area optical fibers |
| WO2013043173A1 (en) | 2011-09-21 | 2013-03-28 | Raydiance, Inc. | Systems and processes that singulate materials |
| US8718431B2 (en) | 2011-09-21 | 2014-05-06 | Ofs Fitel, Llc | Optimized ultra large area optical fibers |
| JP5931389B2 (ja) | 2011-09-29 | 2016-06-08 | 川崎重工業株式会社 | 搬送システム |
| JP5864988B2 (ja) | 2011-09-30 | 2016-02-17 | 浜松ホトニクス株式会社 | 強化ガラス板切断方法 |
| FR2980859B1 (fr) | 2011-09-30 | 2013-10-11 | Commissariat Energie Atomique | Procede et dispositif de lithographie |
| DE102011084128A1 (de) | 2011-10-07 | 2013-04-11 | Schott Ag | Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante |
| JP2013091578A (ja) | 2011-10-25 | 2013-05-16 | Mitsuboshi Diamond Industrial Co Ltd | ガラス基板のスクライブ方法 |
| KR20130049080A (ko) | 2011-11-03 | 2013-05-13 | 삼성디스플레이 주식회사 | 회전식 박막 증착 장치 및 그것을 이용한 박막 증착 방법 |
| KR101269474B1 (ko) | 2011-11-09 | 2013-05-30 | 주식회사 모린스 | 강화글라스 절단 방법 |
| US20130129947A1 (en) | 2011-11-18 | 2013-05-23 | Daniel Ralph Harvey | Glass article having high damage resistance |
| US8677783B2 (en) | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
| US8666214B2 (en) | 2011-11-30 | 2014-03-04 | Corning Incorporated | Low bend loss optical fiber |
| JP5963038B2 (ja) | 2011-12-05 | 2016-08-03 | 株式会社リコー | 穿孔装置、用紙処理装置及び画像形成装置 |
| WO2013084879A1 (ja) | 2011-12-07 | 2013-06-13 | 旭硝子株式会社 | 強化ガラス板の切断方法、及び強化ガラス板切断装置 |
| WO2013084877A1 (ja) | 2011-12-07 | 2013-06-13 | 旭硝子株式会社 | 強化ガラス板の切断方法、および強化ガラス板切断装置 |
| KR20130065051A (ko) | 2011-12-09 | 2013-06-19 | 삼성코닝정밀소재 주식회사 | 강화 글라스의 절단 방법 및 이를 이용한 터치스크린패널의 제조방법 |
| JP5979600B2 (ja) | 2011-12-12 | 2016-08-24 | 日本電気硝子株式会社 | 板ガラスの割断離反方法 |
| US9021837B2 (en) | 2011-12-12 | 2015-05-05 | Nippon Electric Glass Co., Ltd. | Method of cleaving and separating a glass sheet and apparatus for cleaving and separating a glass sheet |
| US8724937B2 (en) | 2011-12-20 | 2014-05-13 | International Business Machines Corporation | Fiber to wafer interface |
| JP5910075B2 (ja) | 2011-12-27 | 2016-04-27 | 三星ダイヤモンド工業株式会社 | 被加工物の加工方法 |
| JP5887929B2 (ja) | 2011-12-28 | 2016-03-16 | 三星ダイヤモンド工業株式会社 | 被加工物の分断方法および光学素子パターン付き基板の分断方法 |
| CN103182894A (zh) | 2011-12-29 | 2013-07-03 | 深圳富泰宏精密工业有限公司 | 玻璃件及其制作方法 |
| JP5685208B2 (ja) | 2012-01-24 | 2015-03-18 | 株式会社日立製作所 | 薄板用熱間圧延機の制御装置および薄板用熱間圧延機の制御方法 |
| JP2013152986A (ja) | 2012-01-24 | 2013-08-08 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
| JP5964607B2 (ja) | 2012-02-14 | 2016-08-03 | 株式会社カネカ | 剥離層付き支持体、基板構造、および電子デバイスの製造方法 |
| CN104125934A (zh) | 2012-02-28 | 2014-10-29 | 伊雷克托科学工业股份有限公司 | 用于分离强化玻璃的方法及装置及由该强化玻璃生产的物品 |
| US20130222877A1 (en) | 2012-02-28 | 2013-08-29 | Sage Electrochromics, Inc. | Multi-zone electrochromic devices |
| JP2015511571A (ja) | 2012-02-28 | 2015-04-20 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品 |
| US9895771B2 (en) | 2012-02-28 | 2018-02-20 | General Lasertronics Corporation | Laser ablation for the environmentally beneficial removal of surface coatings |
| US10357850B2 (en) | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
| WO2013130608A1 (en) | 2012-02-29 | 2013-09-06 | Electro Scientific Industries, Inc. | Methods and apparatus for machining strengthened glass and articles produced thereby |
| US9082764B2 (en) | 2012-03-05 | 2015-07-14 | Corning Incorporated | Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same |
| JP2013187247A (ja) | 2012-03-06 | 2013-09-19 | Nippon Hoso Kyokai <Nhk> | インターポーザおよびその製造方法 |
| US9341912B2 (en) | 2012-03-13 | 2016-05-17 | View, Inc. | Multi-zone EC windows |
| TW201343296A (zh) * | 2012-03-16 | 2013-11-01 | Ipg Microsystems Llc | 使一工件中具有延伸深度虛飾之雷射切割系統及方法 |
| JP5964626B2 (ja) | 2012-03-22 | 2016-08-03 | 株式会社Screenホールディングス | 熱処理装置 |
| TW201339111A (zh) | 2012-03-29 | 2013-10-01 | Global Display Co Ltd | 強化玻璃的切割方法 |
| JP2013203630A (ja) | 2012-03-29 | 2013-10-07 | Asahi Glass Co Ltd | 強化ガラス板の切断方法 |
| JP2013203631A (ja) | 2012-03-29 | 2013-10-07 | Asahi Glass Co Ltd | 強化ガラス板の切断方法、及び強化ガラス板切断装置 |
| US9272941B2 (en) | 2012-04-05 | 2016-03-01 | Sage Electrochromics, Inc. | Method of cutting a panel using a starter crack and a glass panel including a starter crack |
| JP2013216513A (ja) | 2012-04-05 | 2013-10-24 | Nippon Electric Glass Co Ltd | ガラスフィルムの切断方法及びガラスフィルム積層体 |
| JP2015120604A (ja) | 2012-04-06 | 2015-07-02 | 旭硝子株式会社 | 強化ガラス板の切断方法、及び強化ガラス板切断システム |
| FR2989294B1 (fr) | 2012-04-13 | 2022-10-14 | Centre Nat Rech Scient | Dispositif et methode de nano-usinage par laser |
| US20130288010A1 (en) | 2012-04-27 | 2013-10-31 | Ravindra Kumar Akarapu | Strengthened glass article having shaped edge and method of making |
| KR20130124646A (ko) | 2012-05-07 | 2013-11-15 | 주식회사 엠엠테크 | 강화 유리 절단 방법 |
| US9365446B2 (en) | 2012-05-14 | 2016-06-14 | Richard Green | Systems and methods for altering stress profiles of glass |
| DE102012010635B4 (de) | 2012-05-18 | 2022-04-07 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Verfahren zur 3D-Strukturierung und Formgebung von Oberflächen aus harten, spröden und optischen Materialien |
| CN102672355B (zh) | 2012-05-18 | 2015-05-13 | 杭州士兰明芯科技有限公司 | Led衬底的划片方法 |
| JP6009225B2 (ja) | 2012-05-29 | 2016-10-19 | 浜松ホトニクス株式会社 | 強化ガラス板の切断方法 |
| FR2991214B1 (fr) | 2012-06-01 | 2014-06-13 | Snecma | Procede de percage d'une piece par impulsions laser |
| US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| JP6022223B2 (ja) | 2012-06-14 | 2016-11-09 | 株式会社ディスコ | レーザー加工装置 |
| JP5991860B2 (ja) | 2012-06-19 | 2016-09-14 | 三星ダイヤモンド工業株式会社 | ガラス基板の加工方法 |
| US20130344684A1 (en) | 2012-06-20 | 2013-12-26 | Stuart Bowden | Methods and systems for using subsurface laser engraving (ssle) to create one or more wafers from a material |
| JP6065910B2 (ja) | 2012-07-09 | 2017-01-25 | 旭硝子株式会社 | 化学強化ガラス板の切断方法 |
| AT13206U1 (de) | 2012-07-17 | 2013-08-15 | Lisec Maschb Gmbh | Verfahren und Anordnung zum Teilen von Flachglas |
| US9462632B2 (en) | 2012-07-17 | 2016-10-04 | Qualcomm Incorporated | Concurrent data streaming using various parameters from the same sensor |
| TW201417928A (zh) | 2012-07-30 | 2014-05-16 | Raydiance Inc | 具訂製邊形及粗糙度之脆性材料切割 |
| US8842358B2 (en) | 2012-08-01 | 2014-09-23 | Gentex Corporation | Apparatus, method, and process with laser induced channel edge |
| KR101395054B1 (ko) | 2012-08-08 | 2014-05-14 | 삼성코닝정밀소재 주식회사 | 강화유리 커팅 방법 및 강화유리 커팅용 스테이지 |
| KR20140022981A (ko) | 2012-08-14 | 2014-02-26 | (주)하드램 | 기판 에지 보호유닛을 포함한 강화유리 레이저 절단 장치 및 방법 |
| KR20140022980A (ko) | 2012-08-14 | 2014-02-26 | (주)하드램 | 강화유리 레이저 절단 장치 및 방법 |
| WO2014028022A1 (en) | 2012-08-16 | 2014-02-20 | Hewlett-Packard Development Company, L.P. | Diagonal openings in photodefinable glass |
| US20140047957A1 (en) | 2012-08-17 | 2014-02-20 | Jih Chun Wu | Robust Torque-Indicating Wrench |
| JP5727433B2 (ja) | 2012-09-04 | 2015-06-03 | イムラ アメリカ インコーポレイテッド | 超短パルスレーザでの透明材料処理 |
| CN102923939B (zh) | 2012-09-17 | 2015-03-25 | 江西沃格光电股份有限公司 | 强化玻璃的切割方法 |
| CN102898014A (zh) | 2012-09-29 | 2013-01-30 | 江苏太平洋石英股份有限公司 | 无接触激光切割石英玻璃制品的方法及其装置 |
| US9227886B2 (en) | 2012-10-12 | 2016-01-05 | Exxonmobil Chemical Patents Inc. | Polymerization process |
| CN102916081B (zh) | 2012-10-19 | 2015-07-08 | 张立国 | 一种薄膜太阳能电池的清边方法 |
| LT6046B (lt) | 2012-10-22 | 2014-06-25 | Uab "Lidaris" | Justiruojamų optinių laikiklių pakeitimo įrenginys ir sistema, turinti tokių įrenginių |
| US20140110040A1 (en) | 2012-10-23 | 2014-04-24 | Ronald Steven Cok | Imprinted micro-louver structure method |
| DE102012110971B4 (de) | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| US9991090B2 (en) | 2012-11-15 | 2018-06-05 | Fei Company | Dual laser beam system used with an electron microscope and FIB |
| KR20140064220A (ko) | 2012-11-20 | 2014-05-28 | 에스케이씨 주식회사 | 보안필름의 제조방법 |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| US9341015B2 (en) | 2012-11-21 | 2016-05-17 | Nexeon Energy Solutions LLC | Energy-efficient film |
| JP2014104484A (ja) | 2012-11-27 | 2014-06-09 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| CN102962583A (zh) | 2012-11-28 | 2013-03-13 | 江苏大学 | 一种基于激光加热的塑料件微结构成形方法和装置 |
| JP6333282B2 (ja) | 2012-11-29 | 2018-05-30 | コーニング インコーポレイテッド | レーザー損傷及びエッチングによってガラス物品を製造する方法 |
| WO2014085660A1 (en) | 2012-11-29 | 2014-06-05 | Corning Incorporated | Sacrificial cover layers for laser drilling substrates and methods thereof |
| JP6054161B2 (ja) | 2012-12-13 | 2016-12-27 | 株式会社ディスコ | レーザ加工方法 |
| RU2539970C2 (ru) | 2012-12-17 | 2015-01-27 | Общество с ограниченной ответственностью "РнД-ИСАН" | Источник света с лазерной накачкой и способ генерации излучения |
| CN203021443U (zh) | 2012-12-24 | 2013-06-26 | 深圳大宇精雕科技有限公司 | 玻璃板水射流切割机 |
| EP2750447A1 (en) | 2012-12-28 | 2014-07-02 | Alcatel Lucent | Neighboring cell selection for an user equipment using a content delivery service in a mobile network |
| CN103013374B (zh) | 2012-12-28 | 2014-03-26 | 吉林大学 | 仿生防粘疏水疏油贴膜 |
| SG11201505070VA (en) | 2012-12-29 | 2015-08-28 | Hoya Corp | Glass substrate for magnetic disk and magnetic disk |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| JP2016513016A (ja) | 2013-02-04 | 2016-05-12 | ニューポート コーポレーション | 透明及び半透明な基板をレーザ切断する方法及び装置 |
| US10670510B2 (en) * | 2013-02-05 | 2020-06-02 | Massachusetts Institute Of Technology | 3-D holographic imaging continuous flow cytometry |
| US9498920B2 (en) | 2013-02-12 | 2016-11-22 | Carbon3D, Inc. | Method and apparatus for three-dimensional fabrication |
| JP2014156289A (ja) | 2013-02-14 | 2014-08-28 | Mitsubishi Electric Building Techno Service Co Ltd | エレベータの主ロープ点検方法 |
| US9919380B2 (en) | 2013-02-23 | 2018-03-20 | Coherent, Inc. | Shaping of brittle materials with controlled surface and bulk properties |
| DE102013003118B4 (de) | 2013-02-25 | 2015-03-26 | Jenoptik Automatisierungstechnik Gmbh | Verfahren zum Entsorgen von einem bei einem Lochungsvorgang eines Hohlprofils enstehenden Butzens |
| CN105339316B (zh) | 2013-02-25 | 2018-11-09 | 康宁股份有限公司 | 制造薄玻璃块的方法 |
| CN105164581B (zh) | 2013-03-08 | 2020-05-01 | Sage电致变色显示有限公司 | 具有多个独立可控区域和内部母线的电致变色器件 |
| CN103143841B (zh) | 2013-03-08 | 2014-11-26 | 西北工业大学 | 一种利用皮秒激光加工孔的方法 |
| US10179952B2 (en) | 2013-03-08 | 2019-01-15 | Rutgers, The State University Of New Jersey | Patterned thin films by thermally induced mass displacement |
| KR102209964B1 (ko) | 2013-03-13 | 2021-02-02 | 삼성디스플레이 주식회사 | 피코초 레이저 가공 장치 |
| EP2969375B1 (en) | 2013-03-15 | 2018-09-12 | Kinestral Technologies, Inc. | Laser cutting strengthened glass |
| JP6061193B2 (ja) | 2013-03-18 | 2017-01-18 | 大日本印刷株式会社 | ブランクのストリッパ機構 |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| WO2014156289A1 (ja) | 2013-03-27 | 2014-10-02 | 住友精化株式会社 | 吸水性樹脂組成物の製造方法 |
| JP6059059B2 (ja) | 2013-03-28 | 2017-01-11 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| WO2014161534A2 (de) | 2013-04-04 | 2014-10-09 | Lpkf Laser & Electronics Ag | Verfahren und vorrichtung zum einbringen von durchbrechungen in ein substrat sowie ein derart hergestelltes substrat |
| ES2959429T3 (es) | 2013-04-04 | 2024-02-26 | Lpkf Laser & Electronics Se | Procedimiento para la separación de un sustrato |
| DE102013103370A1 (de) | 2013-04-04 | 2014-10-09 | Lpkf Laser & Electronics Ag | Verfahren zum Einbringen von Durchbrechungen in ein Glassubstrat sowie ein derart hergestelltes Glassubstrat |
| ES2685656T3 (es) | 2013-04-10 | 2018-10-10 | Saint-Gobain Glass France | Película de múltiples capas con propiedades ópticas conmutables mediante la electricidad |
| CN103224117B (zh) | 2013-05-10 | 2016-02-03 | 深圳市华星光电技术有限公司 | 一种自动反馈调节碎玻璃传送张力的系统 |
| CN103273195B (zh) | 2013-05-28 | 2015-03-04 | 江苏大学 | 激光间接冲击下金属薄板的微冲裁自动化装置及其方法 |
| CN103316990B (zh) | 2013-05-28 | 2015-06-10 | 江苏大学 | 脉冲激光驱动飞片加载薄板的微冲裁自动化装置及其方法 |
| US9365413B2 (en) | 2013-05-29 | 2016-06-14 | Freescale Semiconductor, Inc. | Transducer-including devices, and methods and apparatus for their calibration |
| HK1220774A1 (zh) | 2013-06-18 | 2017-05-12 | View, Inc. | 非矩形形状上的电致变色设备 |
| US9776891B2 (en) | 2013-06-26 | 2017-10-03 | Corning Incorporated | Filter and methods for heavy metal remediation of water |
| KR101344368B1 (ko) | 2013-07-08 | 2013-12-24 | 정우라이팅 주식회사 | 수직형 유리관 레이저 절단장치 |
| CN103359948A (zh) | 2013-07-12 | 2013-10-23 | 深圳南玻伟光导电膜有限公司 | 钢化玻璃的切割方法 |
| KR20150009153A (ko) | 2013-07-16 | 2015-01-26 | 동우 화인켐 주식회사 | 강화처리된 유리의 홀 형성 방법 |
| US9102011B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |
| US9102007B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| US9790128B2 (en) | 2013-08-07 | 2017-10-17 | Corning Incorporated | Laser controlled ion exchange process and glass articles formed therefrom |
| US9296646B2 (en) | 2013-08-29 | 2016-03-29 | Corning Incorporated | Methods for forming vias in glass substrates |
| TWI618131B (zh) | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | 剝離起點形成裝置及形成方法、疊層體製造裝置 |
| BR112016001216B1 (pt) | 2013-09-04 | 2021-11-16 | Saint-Gobain Glass France | Método para produzir uma vidraça com um revestimento eletricamente condutor com defeitos eletricamente isolados, vidraça com um revestimento eletricamente condutor e uso de uma vidraça |
| CN203509350U (zh) | 2013-09-27 | 2014-04-02 | 东莞市盛雄激光设备有限公司 | 皮秒激光加工装置 |
| CN103531414B (zh) | 2013-10-14 | 2016-03-02 | 南京三乐电子信息产业集团有限公司 | 一种栅控行波管栅网的皮秒脉冲激光切割制备方法 |
| US10017410B2 (en) | 2013-10-25 | 2018-07-10 | Rofin-Sinar Technologies Llc | Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses |
| US20150121960A1 (en) | 2013-11-04 | 2015-05-07 | Rofin-Sinar Technologies Inc. | Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses |
| US20150122656A1 (en) | 2013-11-04 | 2015-05-07 | Rofin-Sinar Technologies Inc. | Mass based filtration devices and method of fabrication using bursts of ultrafast laser pulses |
| US10005152B2 (en) | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
| US11053156B2 (en) | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| US9517929B2 (en) | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
| DE102013223637B4 (de) | 2013-11-20 | 2018-02-01 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats |
| JP2017501951A (ja) | 2013-11-25 | 2017-01-19 | コーニング インコーポレイテッド | 実質的に柱面を成す鏡面反射面の形状を決定するための方法 |
| CN105722925B (zh) | 2013-11-29 | 2018-02-16 | 松下知识产权经营株式会社 | 涂料组合物及使用了该涂料组合物的光扩散部件 |
| US10144088B2 (en) | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
| CN103746027B (zh) | 2013-12-11 | 2015-12-09 | 西安交通大学 | 一种在ito导电薄膜表面刻蚀极细电隔离槽的方法 |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9687936B2 (en) | 2013-12-17 | 2017-06-27 | Corning Incorporated | Transparent material cutting with ultrafast laser and beam optics |
| CA2931984A1 (en) | 2013-12-17 | 2015-06-25 | Bayer Cropscience Lp | Mixing systems, methods, and devices with extendible impellers |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| EP3083514B1 (en) | 2013-12-17 | 2019-03-06 | Corning Incorporated | 3-d forming of glass and associated product |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US20150165563A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US20150166393A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
| CN103831539B (zh) | 2014-01-10 | 2016-01-20 | 合肥鑫晟光电科技有限公司 | 激光打孔方法及激光打孔系统 |
| JP6390961B2 (ja) | 2014-01-28 | 2018-09-19 | 株式会社リコー | 書込ヘッドユニットの組立装置および書込ヘッドユニットの組立方法 |
| DE102014201739B4 (de) | 2014-01-31 | 2021-08-12 | Trumpf Laser- Und Systemtechnik Gmbh | Laserbearbeitungsvorrichtung sowie Verfahren zum Erzeugen zweier Teilstrahlen |
| WO2015127583A1 (en) | 2014-02-25 | 2015-09-03 | Schott Ag | Chemically toughened glass article with low coefficient of thermal expansion |
| EP2913137A1 (de) | 2014-02-26 | 2015-09-02 | Bystronic Laser AG | Laserbearbeitungsvorrichtung und Verfahren |
| MX388829B (es) | 2014-03-04 | 2025-03-20 | Saint Gobain | Metodo para cortar una capa de vidrio laminada, ultradelgada. |
| US11780029B2 (en) | 2014-03-05 | 2023-10-10 | Panasonic Connect North America, division of Panasonic Corporation of North America | Material processing utilizing a laser having a variable beam shape |
| US11204506B2 (en) | 2014-03-05 | 2021-12-21 | TeraDiode, Inc. | Polarization-adjusted and shape-adjusted beam operation for materials processing |
| US20150352671A1 (en) | 2014-06-09 | 2015-12-10 | GM Global Technology Operations LLC | Laser cutting same side slug removal |
| CN106662788A (zh) | 2014-06-17 | 2017-05-10 | Sage电致变色显示有限公司 | 防潮电致变色装置 |
| JP6651467B2 (ja) | 2014-06-17 | 2020-02-19 | セイジ・エレクトロクロミクス,インコーポレイテッド | エレクトロクロミックデバイスの被制御スイッチング |
| EP3166895B1 (en) | 2014-07-08 | 2021-11-24 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| EP2965853B2 (en) | 2014-07-09 | 2020-03-25 | High Q Laser GmbH | Processing of material using elongated laser beams |
| JP2017529311A (ja) | 2014-07-11 | 2017-10-05 | コーニング インコーポレイテッド | ガラス物品内にパルスレーザで穿孔を生じさせることによるガラス切断システムおよび方法 |
| JP6788571B2 (ja) | 2014-07-14 | 2020-11-25 | コーニング インコーポレイテッド | 界面ブロック、そのような界面ブロックを使用する、ある波長範囲内で透過する基板を切断するためのシステムおよび方法 |
| US20160009066A1 (en) | 2014-07-14 | 2016-01-14 | Corning Incorporated | System and method for cutting laminated structures |
| EP3169477B1 (en) | 2014-07-14 | 2020-01-29 | Corning Incorporated | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
| US9617180B2 (en) | 2014-07-14 | 2017-04-11 | Corning Incorporated | Methods and apparatuses for fabricating glass articles |
| DE102014213775B4 (de) | 2014-07-15 | 2018-02-15 | Innolas Solutions Gmbh | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen, kristallinen Substraten, insbesondere von Halbleitersubstraten |
| US9757815B2 (en) | 2014-07-21 | 2017-09-12 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser curved filamentation within transparent materials |
| DE102014110920C5 (de) | 2014-07-31 | 2023-08-03 | Schott Ag | Geformter Glasartikel mit vorbestimmter Geometrie |
| CN104344202A (zh) | 2014-09-26 | 2015-02-11 | 张玉芬 | 一种有孔玻璃 |
| DE102014116958B9 (de) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
| EP3221727B1 (de) | 2014-11-19 | 2021-03-17 | Trumpf Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
| US9740063B2 (en) | 2014-11-28 | 2017-08-22 | Japan Display Inc. | Reflective type liquid crystal display device |
| US9873628B1 (en) | 2014-12-02 | 2018-01-23 | Coherent Kaiserslautern GmbH | Filamentary cutting of brittle materials using a picosecond pulsed laser |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| WO2016100954A1 (en) | 2014-12-19 | 2016-06-23 | Captl Llc | Flow cytometry using hydrodynamically planar flow |
| JP6005125B2 (ja) | 2014-12-22 | 2016-10-12 | イムラ アメリカ インコーポレイテッド | 超短パルスレーザでの透明材料処理 |
| FR3031102B1 (fr) | 2014-12-31 | 2017-01-27 | Saint Gobain | Procede de rompage d'une forme interieure dans une feuille de verre |
| HUE055461T2 (hu) | 2015-03-24 | 2021-11-29 | Corning Inc | Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US9477037B1 (en) | 2015-04-22 | 2016-10-25 | Corning Incorporated | Optical fiber for silicon photonics |
| KR20170006900A (ko) | 2015-07-10 | 2017-01-18 | 삼성전자주식회사 | 성형장치 및 이를 이용한 성형방법 |
| DE102015111490A1 (de) | 2015-07-15 | 2017-01-19 | Schott Ag | Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement |
| CN106604898B (zh) | 2015-08-10 | 2021-06-04 | 法国圣戈班玻璃厂 | 用于切割薄玻璃层的方法 |
| CN105081564B (zh) | 2015-08-31 | 2017-03-29 | 大族激光科技产业集团股份有限公司 | 一种强化玻璃内形孔的加工方法 |
| CN107922259B (zh) | 2015-09-04 | 2021-05-07 | Agc株式会社 | 玻璃板的制造方法、玻璃板、玻璃物品的制造方法、玻璃物品以及玻璃物品的制造装置 |
| KR20180075707A (ko) | 2015-11-25 | 2018-07-04 | 코닝 인코포레이티드 | 유리 웹의 분리 방법들 |
| DE102015120950B4 (de) | 2015-12-02 | 2022-03-03 | Schott Ag | Verfahren zum lasergestützten Ablösen eines Teilstücks von einem flächigen Glas- oder Glaskeramikelement, flächiges zumindest teilweise keramisiertes Glaselement oder Glaskeramikelement und Kochfläche umfassend ein flächiges Glas- oder Glaskeramikelement |
| US20170197868A1 (en) | 2016-01-08 | 2017-07-13 | Apple Inc. | Laser Processing of Electronic Device Structures |
| DE102016102768A1 (de) | 2016-02-17 | 2017-08-17 | Schott Ag | Verfahren zur Kantenbearbeitung von Glaselementen und verfahrensgemäß bearbeitetes Glaselement |
| KR20190035805A (ko) | 2016-07-29 | 2019-04-03 | 코닝 인코포레이티드 | 레이저 처리를 위한 장치 및 방법 |
| EP3507057A1 (en) | 2016-08-30 | 2019-07-10 | Corning Incorporated | Laser processing of transparent materials |
| LT3311947T (lt) | 2016-09-30 | 2019-12-27 | Corning Incorporated | Skaidrių ruošinių lazerinio apdirbimo, naudojant spindulių pluošto dėmes be simetrijos ašių, būdas |
| CN113399816B (zh) | 2016-09-30 | 2023-05-16 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| NL2017998B1 (en) | 2016-12-14 | 2018-06-26 | Corning Inc | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US20180118602A1 (en) | 2016-11-01 | 2018-05-03 | Corning Incorporated | Glass sheet transfer apparatuses for laser-based machining of sheet-like glass substrates |
| US10668561B2 (en) | 2016-11-15 | 2020-06-02 | Coherent, Inc. | Laser apparatus for cutting brittle material |
| US11393984B2 (en) | 2017-04-13 | 2022-07-19 | Cynora Gmbh | Organic molecules for use in organic optoelectronic devices |
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| KR102230762B1 (ko) | 2021-03-23 |
| CN105209218A (zh) | 2015-12-30 |
| JP2016509540A (ja) | 2016-03-31 |
| KR20160010397A (ko) | 2016-01-27 |
| EP2945769B1 (de) | 2017-04-26 |
| CA2898371A1 (en) | 2014-07-24 |
| JP2019034343A (ja) | 2019-03-07 |
| TWI639479B (zh) | 2018-11-01 |
| EP2754524A1 (de) | 2014-07-16 |
| TW201446379A (zh) | 2014-12-16 |
| JP2016513024A (ja) | 2016-05-12 |
| JP6422033B2 (ja) | 2018-11-14 |
| US10421683B2 (en) | 2019-09-24 |
| EP2754524B1 (de) | 2015-11-25 |
| KR102165804B1 (ko) | 2020-10-15 |
| TWI630969B (zh) | 2018-08-01 |
| CN106170365A (zh) | 2016-11-30 |
| WO2014111794A1 (en) | 2014-07-24 |
| EP2945770A1 (en) | 2015-11-25 |
| CN105209218B (zh) | 2018-07-06 |
| EP2945769A1 (de) | 2015-11-25 |
| US20190352215A1 (en) | 2019-11-21 |
| LT2945770T (lt) | 2019-04-25 |
| US11345625B2 (en) | 2022-05-31 |
| US11028003B2 (en) | 2021-06-08 |
| US20140199519A1 (en) | 2014-07-17 |
| TW201436914A (zh) | 2014-10-01 |
| CA2898256A1 (en) | 2014-07-24 |
| WO2014111385A1 (de) | 2014-07-24 |
| US20150360991A1 (en) | 2015-12-17 |
| EP2945770B1 (en) | 2019-03-27 |
| LT2945769T (lt) | 2017-09-25 |
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